Table of Contents
Advertisement
Generic Thermal Solution
3.3
Generic Thermal Solution Thermal Operating Point
The Thermal Operating Point (TOP) is defined as the thermal resistance of the TIM at the
design force of the clip and retention mechanism plus the thermal resistance of the heatsink at
the specified airflow speed. The thermal resistance of the heatsink (TRHS) is given by the
following equation:
TRHS = (T
Thermal simulation results show that as airflow increases upstream of the 845GE/845PE chipset
generic thermal solution, the percentage of TDP that leaves via the top of the package increases
(see Table 8).
Table 8. TDP Dissipation for Various Airflow Speeds
Upstream Airflow Speed
3.4
Generic Thermal Solution Simulation
A Computational Fluid Dynamics (CFD) model of the (G)MCH has been developed for use with
the commercially available thermal analysis tool "Flotherm" (version 2.1 or later). This model
can be used to evaluate package thermal limits and cooling methods. Modeled (G)MCH
components are shown in Figure 8.
®
Figure 8. Intel
(G)MCH Components Modeled
Contact your Intel Field Sales representative to order the thermal models and user's guides.
20
– T
) / (% TDP dissipated via heatsink)
case
local_ambient
% of TDP Dissipated via
(
)
Intel Thermal Solution
lfm
50
100
150
Underfill
®
Intel
845GE / 845PE Chipset (G)MCH Thermal Design Guide
% of TDP Dissipated via the
4-Layer JEDEC Board
70%
75%
77%
Die
C4 Bumps
R
30%
25%
23%
Substrate
package_overview
Advertisement
Table of Contents
