Degree Angle Attach Methodology; Figure 4. 90 Degree Angle Attach Methodology (Not To Scale) - Intel 845PE Thermal Design Manual

Product Specifications

Figure 4. 90 Degree Angle Attach Methodology (not to scale)

2.5.3

0 Degree Angle Attach Methodology

1. Mill a 3.3 mm (0.13 inches) diameter hole centered on bottom of the heatsink base
(see Figure 5). The milled hole should be approximately 1.5 mm (0.06 inches) deep.
2. Mill a 1.3 mm (0.05 inches) wide slot, 0.5 mm (0.02 inches) deep, from the centered hole to
one edge of the heatsink. The slot should be in the direction parallel to the heatsink fins (see
Figure 5 and Figure 6.
3. Attach thermal interface material (TIM) to the bottom of the heatsink base.
4. Cut out portions of the TIM to make room for the thermocouple wire and bead. The cutouts
should match the slot and hole milled into the heatsink base.
5. Attach a 36 gauge or smaller calibrated K-type thermocouple bead or junction to the center
of the top surface of the die using a high thermal conductivity cement. During this step,
make sure there is no contact between the thermocouple cement and the heatsink base
because any contact will affect the thermocouple reading. It is critical that the
thermocouple bead makes contact with the die (see Figure 5).
6. Attach heatsink assembly to the (G)MCH and route the thermocouple wires out through the
milled slot.
16
Thermocouple Wire
Heatsink
Substrate
Die
®
Intel 845GE / 845PE Chipset (G)MCH Thermal Design Guide
3.3 mm (0.13 in.)
Diameter Hole
Thermocouple Bead
90° Angle Attach
R