Intel ® (G)Mch Thermal Design Power; Figure 7. 0 Degree Thermal Solution Decision Flowchart For 0 °C; Table 5. Intel - Intel 845PE Thermal Design Manual

Product Specifications
component's datasheet for the I
Field Sales representative to obtain a copy of this software.
Figure 7. 0 Degree Thermal Solution Decision Flowchart for 0 °C
Start
Attach device to
board using normal
reflow process.
®
2.7 Intel
The 845GE/845PE chipset power utility is designed to dissipate the TDP power value through
the (G)MCH when a system is populated with the memory listed in Table 5. These values have
been validated for the configurations below running the Processor System Bus frequency at 400
MHz.
®

Table 5. Intel

82845PE MCH Thermal Design Power
TDP (Watts)
®
Table 6. Intel 82845GE GMCH Thermal Design Power
TDP (Watts)
18
(Max Power Supply Current) specification. Contact your Intel
CC
Attach thermocouples using
recommended metrology.
Setup the system in the
desired configuration.
Select
Heatsink
(G)MCH Thermal Design Power
5.6 W 333 MHz DDR, 533 MHz FSB, Discrete Graphics
6.3 W 333 MHz DDR, 533 MHz FSB, w/ 266 MHz Integrated Graphics
®
Intel 845GE / 845PE Chipset (G)MCH Thermal Design Guide
Run the Power
Tdie >
program and
Specification?
monitor the device
die temperature.
Heatsink
Yes
required
System Configuration
System Configuration
R
No
End
flowchart