Table Of Contents - Intel 845PE Thermal Design Manual

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Contents
1 Introduction.....................................................................................................................7
1.1 Definition of Terms .............................................................................................9
2 Product Specifications ..................................................................................................11
2.1 Package Description .........................................................................................11
2.1.1
2.2 Heatsink and Clip Mechanical Reference Design ..............................................11
2.2.1
2.2.2
2.3 Thermal and Mechanical Reliability ..................................................................13
2.4 Thermal Specifications .....................................................................................14
2.4.1
2.4.2
2.5 Temperature Measurement Metrology ..............................................................15
2.5.1
2.5.2
2.5.3
2.6 Power Dissipation Software ..............................................................................17
2.7 Intel
3 Generic Thermal Solution .............................................................................................19
3.1 Generic Thermal Solution Performance ............................................................19
3.2 Generic Thermal Solution TIM Description........................................................19
3.2.1
3.3 Generic Thermal Solution Thermal Operating Point ..........................................20
3.4 Generic Thermal Solution Simulation................................................................20
3.4.1
3.4.2
3.4.3
4 Generic Thermal Attach / Mechanical Solution..............................................................23
4.1 Heatsink Retention............................................................................................23
4.2 Thermal Bond Line ...........................................................................................24
4.3 Solder Joint Protection......................................................................................24
4.4 Intel
5 Vendors ........................................................................................................................27
5.1 Heatsink Suppliers............................................................................................27
Appendix A: Package Dimensions .......................................................................................................29
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Intel 845GE / 845PE Chipset (G)MCH Thermal Design Guide
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Intel (G)MCH Package Dimensions..................................................11
Mechanical Keep-Outs.......................................................................11
Heatsink Assembly ............................................................................12
External Ambient Conditions..............................................................14
Maximum Case Temperature.............................................................15
Case Temperature Measurements .....................................................15
90 Degree Angle Attach Methodology ................................................15
0 Degree Angle Attach Methodology ..................................................16
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(G)MCH Thermal Design Power ..............................................................18
The Effect of Pressure on TIM Performance ......................................19
Flotherm Model Implementation in a System Level Analysis..............21
System Model Grid ............................................................................21
Thermal Model Power Dissipation......................................................21
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(G)MCH Heatsink Drawings.....................................................................25
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