(G)Mch Fc-Bga Package Dimensions (Bottom View) - Intel 845PE Thermal Design Manual

Appendix A: Package Dimensions
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Figure 13. Intel

(G)MCH FC-BGA Package Dimensions (Bottom View)

0.7500
0.7500
1.0000
Detail B
Units = Millimeters
30
2 4 6 8 10 12
1 3 5 7 9 11 13
1.0000
Detail B
Pin A1
0.57 ±0.1
0.7 ±0.05 0.7 ±0.05
0.57 ±0.1
0.7 ±0.05
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Intel 845GE / 845PE Chipset (G)MCH Thermal Design Guide
Bottom View
Detail A
14 16 18 20 22 24 26
15 17 19 21 23 25
Detail A
BGA Land; 760 balls
ϕ 0.600 (760 places)
0.203
0.071
ϕ 0.63 ±0.025
ϕ 0.47 ±0.04
28 30 32 34 36
27 29 31 33 35 37
0.435
A B C
L S S
A
L
Pkg760_Bottom
R
AU
AT
AR
AP
AN
AM
AL
AK
AJ
AH
AG
AF
AE
AD
AC
AB
AA
Y
W
V
U
T
R
P
N
M
L
K
J
H
G
F
E
D
C
B
A