Related Manuals for Intel 845PE
Summary of Contents for Intel 845PE
- Page 1 ® Intel 845PE/845GE Chipset Thermal Design Guide ® ® Intel 82845GE GMCH / Intel 82845PE MCH Thermal and Mechanical Design Guidelines September 2006 Document Number: 251926-002...
- Page 2 Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order. Intel, Pentium, and the Intel logo are trademarks or registered trademarks of Intel Corporation or its subsidiaries in the United States and other countries.
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Page 3: Table Of Contents
Thermal Model Power Dissipation............21 Generic Thermal Attach / Mechanical Solution..............23 Heatsink Retention....................23 Thermal Bond Line ...................24 Solder Joint Protection..................24 ® Intel (G)MCH Heatsink Drawings..............25 Vendors ........................27 Heatsink Suppliers....................27 Appendix A: Package Dimensions .......................29 ® Intel 845GE / 845PE Chipset (G)MCH Thermal Design Guide... - Page 4 82845GE GMCH Thermal Design Power ..........18 Table 7. Chomerics T710 TIM Performance (at 50 °C as a Function of Attach Pressure)19 Table 8. TDP Dissipation for Various Airflow Speeds ............20 ® Intel 845GE / 845PE Chipset (G)MCH Thermal Design Guide...
- Page 5 Revision History Revision Description Date Number • Corrected part number for heatsink -002 September 2006 • Initial Release. -001 October 2002 ® Intel 845GE / 845PE Chipset (G)MCH Thermal Design Guide...
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Page 7: Introduction
This document is for the 845GE and 845PE chipsets. The thermal and mechanical design guidelines are described for both the 82845GE GMCH and 82845PE MCH. For the ICH4, refer ®... -
Page 8: Table 1. Specification Summary
5.6 W (333 MHz DDR, 533 MHz FSB, Discrete Graphics) 82845GE GMCH 6.3 W (333 MHz DDR, 533 MHz FSB, w/ Integrated Graphics) (G)MCH Maximum Case Temperature 92 °C (G)MCH ® Intel 845GE / 845PE Chipset (G)MCH Thermal Design Guide... -
Page 9: Definition Of Terms
Thermal Operating Point. The TOP is defined as the thermal resistance of the thermal interface material loaded at the design force of the clip and retention mechanism plus the thermal resistance of the heatsink at the specified airflow speed. ® Intel 845GE / 845PE Chipset (G)MCH Thermal Design Guide... - Page 10 Introduction This page is intentionally left blank. ® Intel 845GE / 845PE Chipset (G)MCH Thermal Design Guide...
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Page 11: Product Specifications
The mechanical keep-out restrictions are included in Appendix A (Figure 14). The component height restrictions are illustrated by a legend in the drawing. It is important to note that the keep- ® out and height restrictions differ slightly from the Intel 82845 chipset keep-outs. ®... -
Page 12: Heatsink Assembly
Figure 1. This clip attaches to solder down anchors located on the system board. Figure 1. Heatsink Assembly: Heatsink, Clip Frame, Clip Lever Figure 2. Heatsink Assembly Placement and Actuation ® Intel 845GE / 845PE Chipset (G)MCH Thermal Design Guide... -
Page 13: Thermal And Mechanical Reliability
1. The above tests should be performed on a sample size of at least 12 assemblies from 3 different lots of material. 2. Additional Pass/Fail Criteria may be added at the discretion of the user. ® Intel 845GE / 845PE Chipset (G)MCH Thermal Design Guide... -
Page 14: Thermal Specifications
(linear feet per minute) must be present as measured 1 inch in front of the air inlet side of the 845GE/845PE chipset generic thermal solution. The thermal designer must carefully select the location to measure airflow to get a representative sampling. (Note, These environmental specifications are based on a 35 °C system external temperature measured at 5000′). -
Page 15: Maximum Case Temperature
C-MAX Temperature Measurement Metrology To accurately assess junction temperature for an application or to determine if you are not of 92 °C, it is necessary to have a good thermocouple attach. Intel has exceeding a T C-MAX established guidelines for the proper techniques to be used when measuring the (G)MCH case temperature. -
Page 16: Degree Angle Attach Methodology
It is critical that the thermocouple bead makes contact with the die (see Figure 5). 6. Attach heatsink assembly to the (G)MCH and route the thermocouple wires out through the milled slot. ® Intel 845GE / 845PE Chipset (G)MCH Thermal Design Guide... -
Page 17: Power Dissipation Software
To assess the thermal performance of the 845GE/845PE chipset generic thermal solution during “worst-case realistic application” conditions, Intel has developed a software utility that operates the chipset at near worst-case power dissipation. The utility has been developed solely for testing customer thermal solutions at or near the thermal design power. -
Page 18: Intel ® (G)Mch Thermal Design Power
Intel (G)MCH Thermal Design Power The 845GE/845PE chipset power utility is designed to dissipate the TDP power value through the (G)MCH when a system is populated with the memory listed in Table 5. These values have been validated for the configurations below running the Processor System Bus frequency at 400 MHz. -
Page 19: Generic Thermal Solution
Figure 1) provides enough pressure for the TIM to achieve a thermal conductivity of 0.9 W/m⋅K. Table 7. Chomerics T710 TIM Performance (at 50 °C as a Function of Attach Pressure) Pressure (psi) Thermal Resistance (°C*In2)/W 0.37 0.21 0.17 ® Intel 845GE / 845PE Chipset (G)MCH Thermal Design Guide... -
Page 20: Generic Thermal Solution Thermal Operating Point
) / (% TDP dissipated via heatsink) case local_ambient Thermal simulation results show that as airflow increases upstream of the 845GE/845PE chipset generic thermal solution, the percentage of TDP that leaves via the top of the package increases (see Table 8). -
Page 21: Flotherm Model Implementation In A System Level Analysis
Note that an increase in the number of grid cells may also add to the computation time of model. 3.4.3 Thermal Model Power Dissipation Based on the system component configuration, use the TDP power values shown in Table 5. ® Intel 845GE / 845PE Chipset (G)MCH Thermal Design Guide... - Page 22 Generic Thermal Solution This page is intentionally left blank. ® Intel 845GE / 845PE Chipset (G)MCH Thermal Design Guide...
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Page 23: Generic Thermal Attach / Mechanical Solution
This symmetry is to channels. This symmetry is to facilitate ease clip of assembly facilitate ease clip of assembly and HS orientation. and HS orientation. Clip Tabs Clip Tabs ® Intel 845GE / 845PE Chipset (G)MCH Thermal Design Guide... -
Page 24: Thermal Bond Line
In this manner, the critical solder balls are protected from tensile loading that may cause damage to the solder joint. ® Intel 845GE / 845PE Chipset (G)MCH Thermal Design Guide... -
Page 25: Intel (G)Mch Heatsink Drawings
Figure 11. Intel (G)MCH Clip Frame and Lever Lever Handle Clip Lever Pivot Axle CAM Profile Clip Frame Clip_Fram e ® Intel (G)MCH Heatsink Drawings Contact your field representative for additional information. ® Intel 845GE / 845PE Chipset (G)MCH Thermal Design Guide... - Page 26 Generic Thermal Attach / Mechanical Solution This page is intentionally left blank. ® Intel 845GE / 845PE Chipset (G)MCH Thermal Design Guide...
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Page 27: Vendors
Some suppliers may be able to provide pre-assembled kits. Contact individual suppliers for information. Supplier Contact Information Boyd Corporation* http://www.boydcorp.com Chomerics, Inc. http://www.chomerics.com Foxconn Electronics, Inc. http://www.foxconn.com CCI (Chaun-Choung Technology Group) http://www.ccic.com.tw ® Intel 845GE / 845PE Chipset (G)MCH Thermal Design Guide... - Page 28 Vendors This page is intentionally left blank. ® Intel 845GE / 845PE Chipset (G)MCH Thermal Design Guide...
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Page 29: Appendix A: Package Dimensions
0.203 Epoxy ϕ 0.6500 ±0.05 ϕ 1.1500 ±0.05 ϕ 0.500 ϕ 1.00 1.5 ±0.05 Die Solder 0.100 ±0.025 Bumps 0.57 ±0.1 3 x 0.07 0.57 ±0.1 Units = Millimeters Pkg760_Side-Top ® Intel 845GE / 845PE Chipset (G)MCH Thermal Design Guide... -
Page 30: (G)Mch Fc-Bga Package Dimensions (Bottom View)
BGA Land; 760 balls ϕ 0.600 (760 places) 0.203 0.57 ±0.1 0.7 ±0.05 0.7 ±0.05 0.071 0.57 ±0.1 ϕ 0.63 ±0.025 ϕ 0.47 ±0.04 0.7 ±0.05 Units = Millimeters Pkg760_Bottom ® Intel 845GE / 845PE Chipset (G)MCH Thermal Design Guide... -
Page 31: 82845Ge Gmch / 82845Pe Mch Keep-Out Restriction
Appendix A: Package Dimensions ® Figure 14. Intel 82845GE GMCH / 82845PE MCH Keep-Out Restriction GMCH Keep-Out_Restrict ® Intel 82845PE/82845GE GMCH Thermal Design Guide...