Cleanness - H3C S5100-SI series Quick Start Manual

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H3C S5100-SI/EI Series Ethernet Switches

2.2.2 Cleanness

Dust is a hazard to the operating safety of your device. The dust
accumulated on the chassis can be adsorbed by static electricity and
result in poor contact of metal connectors or metal contact points.
When the relative indoor humidity is low, especially, electrostatic
adsorption is more likely to happen. This can not only shorten the
service life of your device but also cause communications failures.
The following table lists the dust concentration limit.
Table 2-1 Dust concentration limit in the equipment room
Substance
Dust
Note: The dust particle size is greater than or equal to 5 μm
Besides dust, there are rigorous limits on the content of harmful
substances that can accelerate the corrosion and aging of metals,
such as salts, acids, and sulfides in the air in the equipment room, and
the equipment room must be protected against ingression of harmful
gases such as SO
see the following table.
Table 2-2 Harmful gas limits in the equipment room
Gas
SO
2
H S
2
Unit
Particles/m³
, H S, NH , and Cl
2 2 3
Maximum concentration (mg/m
0.2
0.006
2-3
Chapter 2 Preparing for
Concentration limit
4
≤ 3 × 10 (No visible dust on
the tabletop for three days)
. For the specific requirement,
2
Installation
3
)