Thermal Profile Diagram - Intel 5100 Series Instruction Manual

Thermal/Mechanical Reference Design
x = Processor power consumption (W)
a = Case-to-ambient thermal resistance, ψCA (°C/W)
b = Processor local ambient temperature, TLA (°C)
Figure 2-5.

Thermal Profile Diagram

T T MAX@ MAX@
CASE CASE
P P
_PROFILE_MIN _PROFILE_MIN
The higher end point of the Thermal Profile represents the processor's TDP and the
associated maximum case temperature (T
Thermal Profile represents the power value (P
temperature (T
T
CONTROL
to-ambient resistance of the thermal solution with the y-intercept being the local
processor ambient temperature. The slope of the Thermal Profile is constant between
P
_PROFILE_MIN
the Thermal Profile will require the same heatsink case-to-ambient resistance.
In order to satisfy the Thermal Profile specification, a thermal solution must be at or
below the Thermal Profile line for the given processor when its DTS temperature is
greater than T
customers to make a trade-off between the thermal solution case-to-ambient
resistance and the processor local ambient temperature that best suits their platform
implementation (refer to
solution case-to-ambient resistance and processor local ambient temperature that can
meet a given Thermal Profile. If the case-to-ambient resistance and the local ambient
temperature are known for a specific thermal solution, the Thermal Profile of that
solution can easily be plotted against the Thermal Profile specification. As explained
above, the case-to-ambient resistance represents the slope of the line and the
processor local ambient temperature represents the y-axis intercept. Hence the T
values of a specific solution can be calculated at the TDP and P
levels. Once these points are determined, they can be joined by a line, which
represents the Thermal Profile of the specific solution. If that line stays at or below the
Thermal Profile specification, then that particular solution is deemed as a compliant
solution.
Dual-Core Intel® Xeon® Processor 5100 Series Thermal/Mechanical Design Guide
T T MAX MAX
CASE CASE
T T
CASE CASE
P P
_PROFILE_MIN _PROFILE_MIN
@ P
CASE_MAX _PROFILE_MIN
(see Section 2.2.6). The slope of the Thermal Profile line represents the case-
and TDP, which indicates that all frequencies of a processor defined by
(refer to Section
CONTROL
Section
Power Power
). The lower end point of the
CASE_MAX
_PROFILE_MIN
) for the lowest possible theoretical value of
2.2.6). The Thermal Profile allows the
2.3.3). There can be multiple combinations of thermal
Thermal Profile Thermal Profile
TDP TDP
) and the associated case
power
_PROFILE_MIN
CASE
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