Boxed Processor Contents - Intel 5100 Series Instruction Manual

Thermal/Mechanical Reference Design
design criteria may need to be considered if this heatsink is used in a 2U rack mount
chassis, or in a chassis that has drive bay obstructions above the inlet to the fan
heatsink.
Thermal Profile A should be used to help determine the thermal performance of the
platform. The primary recommended control method for this solution is using pulse
width modulation control. This control method requires the motherboard provide the
correct PWM duty cycle to the active fan heatsink solution to properly follow the
thermal profile. If no PWM signal is detected the active heatsink solution will default
back to a thermistor controlled mode and the fan will automatically adjust fan RPM to
meet the thermal profile.
It is critical to supply a constant +12 V to the fan header so that the active CEK
heatsink solution can operate properly. If a system board has a jumper setting to select
either a constant +12 V power to the fan header or a variable voltage, it is strongly
recommended that the jumper be set by default to the constant +12 V setting.
It is recommended that the ambient air temperature outside of the chassis be kept at
or below 35 ° C. The air passing directly over the processor heatsink should not be
preheated by other system components. Meeting the processor's temperature
specification is the responsibility of the system integrator.
2.4.8.3

Boxed Processor Contents

A direct chassis attach method must be used to avoid problems related to shock and
vibration, due to the weight of the heatsink required to cool the processor. The board
must not bend beyond specification in order to avoid damage. The boxed processor
contains the components necessary to solve both issues. The boxed processor will
include the following items:
• Dual-Core Intel Xeon Processor 5100 Series
• Unattached heatsink solution
• 4 screws, 4 springs, and 4 heatsink standoffs (all captive to the heatsink)
• Thermal Interface Material (pre-applied on heatsink)
• Installation Manual
• Intel Inside
The other items listed in
shipped with either the chassis or boards. They are as follows:
• CEK Spring (supplied by baseboard vendors)
• Heatsink standoffs (supplied by chassis vendors)
Dual-Core Intel® Xeon® Processor 5100 Series Thermal/Mechanical Design Guide
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Figure 2-14 that are required to complete this solution will be
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