Cek Thermal Adherence To Dual-Core Intel Xeon Processor 5160 Thermal Profile A - Intel 5100 Series Instruction Manual

Figure 2-19. 2U+CEK Thermal Adherence to Dual-Core Intel Xeon Processor 5160 Thermal
Profile A
T T
CASE MAX_A CASE MAX_A
TDP TDP
T T
CASE_MAX CASE_MAX
P P
_PROFILE_MIN _PROFILE_MIN
The 1U CEK Intel reference thermal solution is designed to meet the Thermal Profile B
for the Dual-Core Intel
(mean+3sigma) performance of the thermal solution is computed to be 0.299°C/W and
the processor local ambient temperature (T
the Thermal Profile equation for this thermal solution is calculated as:
Equation 2-11.y = 0.299x + 40
where,
y = Processor T
x = Processor power value (W)
Figure 2-20 below shows the comparison of this reference thermal solution's Thermal
Profile to the Dual-Core Intel
The 1U CEK solution meets the Thermal Profile B with 1.9°C margin at the lower end
(P
_PROFILE_MIN
Section 2.2.7, designing to Thermal Profile B results in increased TCC activation and
measurable performance loss for the processor.
42
@ @
60 60
Thermal Profile A Thermal Profile A
y = 0.231 * x + 41.5 y = 0.231 * x + 41.5
@ @
50 50
40 40
30 30
20 20
10 10
0 0
0 0 10 10 20 20
® ®
Xeon Processor 5160. From
value (°C)
CASE
®
Xeon
) and 1.1°C margin at the upper end (TDP). However, as explained in
Dual-Core Intel® Xeon® Processor 5100 Series Thermal/Mechanical Design Guide
Thermal/Mechanical Reference Design
2U+ CEK Reference Solution 2U+ CEK Reference Solution
y = 0.236 * x + 40 y = 0.236 * x + 40
30 30 40 40 50 50
P P
_PROFILE_MIN _PROFILE_MIN
Power [W] Power [W]
Table 2-6
) for this thermal solution is 40°C. Hence,
LA
®
Processor 5160 Thermal Profile B specification.
60 60 70 70 80 80 90 90
TDP TDP
the three-sigma