Cek Thermal Adherence To Dual-Core Intel® Xeon® Processor 5110/5120/5130/5140/5150 Thermal Profile - Intel 5100 Series Instruction Manual

Thermal/Mechanical Reference Design
Figure 2-18. 1U CEK Thermal Adherence to
5130/5140/5150
T T
TDP TDP
The 2U+ CEK Intel reference thermal solution is designed to meet the Thermal Profile A
for the Dual-Core Intel Xeon Processor 5160. From
(mean+3sigma) performance of the thermal solution is computed to be 0.236°C/W and
the processor local ambient temperature (T
the Thermal Profile equation for this thermal solution is calculated as:
Equation 2-10.y = 0.236x + 40
where,
y = Processor T
x = Processor power value (W)
Figure 2-19 below shows the comparison of this reference thermal solution's Thermal
Profile to the Dual-Core Intel
The 2U+ CEK solution meets the Thermal Profile A with a 1.3°C margin at the lower
end (P
_PROFILE_MIN
Profile A, it is ensured that no measurable performance loss due to TCC activation is
observed under the given environmental conditions.
Dual-Core Intel® Xeon® Processor 5100 Series Thermal/Mechanical Design Guide
Thermal Profile
70 70
@ @
CASE MAX CASE MAX
60 60
Thermal Profile Thermal Profile
y = 0.385 * x + 40 y = 0.385 * x + 40
T T @ @
CASE_MAX CASE_MAX
50 50
P P
_PROFILE_MIN _PROFILE_MIN
40 40
30 30
20 20
10 10
0 0
0 0 10 10
value (°C)
CASE
®
Xeon
) and 1.1°C margin at the upper end (TDP). By designing to Thermal
®
Dual-Core Intel Xeon
1U CEK Reference Solution 1U CEK Reference Solution
y = 0.299 * x + 40 y = 0.299 * x + 40
20 20 30 30 40 40
P P
_PROFILE_MIN _PROFILE_MIN
Power [W] Power [W]
Table
) for this thermal solution is 40°C. Hence,
LA
®
Processor 5160 Thermal Profile A specification.
®
Processor 5110/5120/
50 50 60 60 70 70
TDP TDP
2-6, the three-sigma
41