NEC EXPRESS5800/140He Service Manual page 15

4.2 Routine Maintenance....................................................................................................... 51
4.3 Indication of Defected Devices with Lamps ................................................................... 52
4.3.1 Status Lamp.............................................................................................................. 54
4.3.2 Attention Lamp ........................................................................................................ 55
4.3.3 Processor Board Error Lamp.................................................................................... 56
4.3.4 Memory Board Error Lamp ..................................................................................... 58
4.3.5 I/O Board Error Lamp .............................................................................................. 59
4.3.6 Power Unit Error Lamp............................................................................................ 61
4.3.7 Fan Error Lamp ........................................................................................................ 62
4.3.8 Temperature Error Lamp.......................................................................................... 63
4.3.9 Clearing Lamp Indication ........................................................................................ 63
4.4 Off-line Maintenance Utility ........................................................................................... 64
4.4.1 Starting Off-line Maintenance Utility ...................................................................... 64
4.5 Fault Repair and Troubleshooting ................................................................................... 66
4.6 Dump Acquisition ........................................................................................................... 67
4.7 POST Execution .............................................................................................................. 67
4.8 TeDoLi Execution ........................................................................................................... 67
4.9 Device Replacement (1) .................................................................................................. 68
4.9.1 Preparation before Replacement .............................................................................. 68
4.9.2 Replacement of Hard Disk, Power Unit, 3.5-inch Device, or 5-inch Device........... 69
4.9.3 Replacement of Memory Board or DIMM .............................................................. 69
4.9.4 Replacement of Processor Board, Processor, Heat Sink or VRM............................ 73
4.9.5 Replacement of CD-ROM Drive or CD/FD Board on 140Rd-4 Chassis................. 79
4.9.6 Replacement of CD-ROM Drive, CD/FD Board or FD Drive on 140He Chassis... 81
4.9.7 Replacement of Front Panel ..................................................................................... 83
4.10 Device Replacement (2) .................................................................................................. 84
4.10.1 Removal or Installation of Rear Access Cover ........................................................ 84
4.10.2 Removal or Installation of Front Access Cover ....................................................... 85
4.10.3 Fan Replacement...................................................................................................... 86
4.10.4 Replacement of Power Cage or Power BP............................................................... 89
4.10.5 Replacement of Management LAN Board or I/O Board ......................................... 93
4.10.6 Replacement of Additional HDD Cage or SCSI-BP (8 HDDs) on 140He Chassis 101
4.10.7 Replacement of SCSI-BP (5HDD/3HDD) on 140Rd-4 Chassis ............................ 105
4.10.8 Replacement of SCSI-BP(5HDD) on 140HE Chassis ........................................... 108
4.10.9 Replacement of Main Board or Connect Board on 140Rd-4 Chassis .................... 110
4.10.10 Replacement of Main Board or Connect Board on 140He Chassis ....................... 112
4.10.11 Replacement of Battery of DIMM for On-board RAID......................................... 114
4.10.12 Replacement of PCI Board..................................................................................... 118
4.11 Jumper Settings ............................................................................................................. 119
5. System BIOS .......................................................................................................... 122
5.1 BIOS SETUP................................................................................................................. 122
5.2 Duplication of System BIOS......................................................................................... 122
6. RAS Function......................................................................................................... 123
6.1 Logging ......................................................................................................................... 123
6.2 Memory Degrading Operation ...................................................................................... 123
6.3 Temperature Monitoring................................................................................................ 123
6.4 Watchdog Timer (WDT)................................................................................................ 123
7. Remote Management Function ............................................................................ 124
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