Cleanness; Emi - HP JG221A Installation Manual

CAUTION:
If condensation appears on the switch when you move it to a high-temperature environment, dry the switch
before powering it on to avoid short circuits.
Table 3 Humidity requirements
Humidity
Operating humidity (noncondensing)
Storage humidity (noncondensing)

Cleanness

Dust buildup on the chassis may result in electrostatic adsorption, which causes poor contact of metal
components and contact points, especially when indoor relative humidity is low. In the worst case,
electrostatic adsorption can cause communication failure.
Table 4 Dust concentration limit in the equipment room
Substance
Dust particles
NOTE:
Dust diameter ≥ 5 µm
The equipment room must also meet strict limits on salts, acids, and sulfides to eliminate corrosion and
premature aging of components, as shown in
Table 5 Harmful gas limits in the equipment room
Gas
SO
2
H S
2
NH
3
Cl
2

EMI

All electromagnetic interference (EMI) sources, from outside or inside of the switch and application system,
adversely affect the switch in a conduction pattern of capacitance coupling, inductance coupling,
electromagnetic wave radiation, or common impedance (including the grounding system) coupling. To
prevent EMI, take the following actions:
If AC power is used, use a single-phase three-wire power receptacle with protection earth (PE) to filter

interference from the power grid.
Keep the switch far away from radio transmitting stations, radar stations, and high-frequency devices.

 Use electromagnetic shielding, for example, shielded interface cables, when necessary.
Range
10% to 95%
5% to 95%
Concentration limit (particles/cu m)
≤ 3 x 10 4 (no visible dust on the tabletop over three days)
Table 5.
Max. (mg/m
0.2
0.006
0.05
0.01
9
)
3