Temperature And Humidity; Cleanness; Emi - HP FlexFabric 7900 Series Installation Manual

Identify the airflow designs of neighboring devices, and prevent hot air flowing out of the bottom
•
device from entering the top device.
The rack or workbench is sturdy enough to support the switch and its accessories.
•
The rack or workbench is correctly grounded.
•
To ensure correct operation and long service life of the switch, install it in an environment that meets the
requirements described in the following subsections.

Temperature and humidity

Maintain temperature and humidity in the equipment room as described in
and technical
Lasting high relative humidity can cause poor insulation, electricity creepage, mechanical property
•
change of materials, and metal corrosion.
• Lasting low relative humidity can cause washer contraction and ESD and bring problems including
loose captive screws and circuit failure.
High temperature can accelerate aging of insulation materials and significantly lower the reliability
•
and lifespan of the switch.

Cleanness

Dust buildup on the chassis might result in electrostatic adsorption, which causes poor contact of metal
components and contact points, especially when indoor relative humidity is low. In the worst case,
electrostatic adsorption can cause communication failure.
Table 2 Dust concentration limit in the equipment room
Substance
Dust
NOTE:
Dust diameter ≥ 5 μm
The equipment room must also meet limits on salts, acids, and sulfides to eliminate corrosion and
premature aging of components, as shown in
Table 3 Harmful gas limits in the equipment room
Gas
SO
2
H S
2
NH
3
Cl
2

EMI

Electromagnetic interference (EMI) might be coupled from the source to the switch through the following
coupling mechanisms:
specifications."
Concentration limit (particles/m³)
≤ 3 x 10 4 (no visible dust on the tabletop over three days)
Table 3.
Maximum concentration (mg/m
0.2
0.006
0.05
0.01
2
"Appendix A Chassis views
3 )