Table Of Contents - 4DSP FC6301 User Manual

UM027 FC6301 User Manual

Table of Contents

1 Acronyms and related documents ............................................................................. 5
1.1 Acronyms ................................................................................................................ 5
1.2 Related Documents ................................................................................................. 6
2 General description ..................................................................................................... 6
3 Installation ................................................................................................................... 8
3.1 Requirements and handling instructions .................................................................. 8
3.2 Firmware and Software ........................................................................................... 8
4 Hardware Specification ............................................................................................... 8
4.1 Phycisal specifications ............................................................................................ 8
4.1.1 Front panel layout ............................................................................................ 8
4.2 cPCI P0 connector .................................................................................................. 9
4.3 Front panel IO ........................................................................................................11
4.3.1 Gigabit Ethernet ..............................................................................................11
4.3.2 UART ..............................................................................................................11
4.3.3 LED .................................................................................................................11
4.4 FPGA Mezzanine Card (FMC) ...............................................................................12
4.4.1 Bank A (LA, HA) connections ..........................................................................12
4.4.2 Bank B (HB) connections ................................................................................15
4.4.3 Gigabit transceiver connections ......................................................................16
4.4.4 Miscellaneous FMC connections .....................................................................17
4.5 SPI flash .................................................................................................................18
4.6 Virtex-6 FPGA device .............................................................................................18
4.7 BLAST sites ...........................................................................................................19
4.8 Clock tree ...............................................................................................................19
4.8.1 FMC GTX Reference Clock .............................................................................20
4.8.2 FMC Clock connections ..................................................................................20
4.9 FPGA device configuration .....................................................................................21
4.9.1 Flash storage ..................................................................................................21
4.9.2 CPLD device ...................................................................................................21
4.9.3 DIP Switch ......................................................................................................21
4.9.4 CPLD LEDs and board status .........................................................................22
4.9.5 JTAG ...............................................................................................................22
4.10 Power supply ......................................................................................................23
4.11 Hotswap .............................................................................................................24
4.12 Power and temperature monitor ..........................................................................24
5 Environment ................................................................................................................26
5.1 Temperature ..........................................................................................................26
5.2 Convection cooling .................................................................................................26
6 Safety...........................................................................................................................26
7 EMC .............................................................................................................................26
8 Warranty ......................................................................................................................26
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