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UM027 FC6301 User Manual
Table 15 : Power supply
4.11 Hotswap
Hot Swap is the act of removal and insertion of cards into a platform while that system is
operational. This process should not cause any failures on the systems power supply and
system's I/O signals. Protection of the card's circuitry also needs to be taken into account in
this process.
A compact PCI board can implement three different types of hot swap:
Non Hot Swap do not have hot swap features
Basic Hot Swap boards have the minimum features required
Full Hot Swap have the minimum requirements plus the ability for software
connection control
The Pericom bridge is a hot swap friendly device but full hot swap is not supported. A hot
swap controller is required to monitor all power levels, pre-charge the cPCI signals and to
switch the backend power on and off. The LTC1643A hot swap controller from linear
technologies is used. For more information on hot swap refer to the hot swap specifications.
4.12 Power and temperature monitor
Two ADT7411 devices are used to monitor the power on the different voltage rails as well as
the temperature. The ADT7411 data are constantly passed to the Virtex-6 device.
Measurements can be accessed from the host computer via the PCI bus.
Parameter:
On-chip temperature
On-chip AIN0 (V
)
DD
External temperature
External AIN3
External AIN4
External AIN5
External AIN6
External AIN7
External AIN8
Table 16: Monitoring device 1 connections
UM027
Device 1
ADT7411 Die Temperature
+3.3V
FPGA A temperature
12V
1V0
3V3
1V2
MGT1V2
MGT1V0
www.4dsp.com
-
r1.3
Formula
AIN3*(1249/249)
AIN4
AIN5
AIN6
AIN7
AIN8
- 24
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