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Kontron COMe-bP5020 User Manual page 13

Com express form factor compliant power architecture processor module

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Kontron performs comprehensive environmental testing of its products in accordance with
applicable standards.
Customers desiring to perform further environmental testing of Kontron products must con-
tact Kontron for assistance prior to performing any such testing. This is necessary, as it is
possible that environmental testing can be destructive when not performed in accordance
with the applicable specifications.
In particular, for example, boards without conformal coating must not be exposed to a
change of temperature exceeding 1K / minute, averaged over a period of not more than five
minutes. Otherwise, condensation may cause irreversible damage, especially when the board
is powered up again.
Kontron does not accept any responsibility for damage to products resulting from destructive
environmental testing.
1.5 Related Publications
Ta bl e 3 : Re l ate d P u b l i c at i o n s
SPECIFICATION /
ORGANIZATION
COM Express®
PICMG® COM.0, COM Express® Module Base Specif ication, Revision 2.0, August 8, 2010
Freescale™, Kontron and Emerson Common Pinout Def inition
PCI Express
PCI Express Base Specif ication Revision 2.0, Dec. 20, 2006
Serial RapidIO
RapidIO™ Interconnect Specif ication Part 6: LP-Serial Physical Layer Specif ication,
Rev. 2.0.1, March 2008
Serial ATA
Serial ATA International Organization: Serial ATA Revision 2.6, 15th February 2007
Ethernet
IEEE802.3: Part 3: Carrier Sense Multiple Access with Collision Detection (CSMA/CD) Access
Method and Physical Layer Specif ication, Clause 22 and Clause 45
Platform Firmware
DENX "U-Boot" (Universal Boot Loader) online documentation at www.denx.de
Kontron
Kontron's Product Safety and Implementation Guide, ID 1021-9142
13
NOTICE
PUBLICATION
User Guide
COMe-bP5020
www.kontron.com

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