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Ta b l e 1 : C O M e - b P 5 0 2 0 M a i n S p e c i f i c a ti o n s ( c o n t 'd )
COMe-bP5020
Gigabit Ethernet
SATA
SRIO
PCI Express
Debug Interface
Serial Interface
GPIO
Onboard Connectors
microSD card Socket
DIP Switch
Module Health Monitor
LEDs
Watchdog Timer
System Timer
Thermal Monitoring
Power Consumption
Temperature Range
Mechanical
Dimensions
Board Weight
11
Up to five Gigabit Ethernet ports:
» One Gigabit Ethernet port through COMe MDI interface
» Up to four Gigabit Ethernet ports through SGMII interface
Two SATA ports
Up to two x4 Serial RapidIO interfaces operating in host or agent configuration, depend-
ing on configuration
Up to two x4 PCI Express interface operating in root complex configuration
If interface is configured for PCI Express, SRIO is not possible
One debug port
Up to four serial ports:
» 2x 4-wire UART interfaces (RxD, TxD, RTS, CTS), or
» 4x 2-wire UART interfaces (RxD, TxD)
Up to 12 GPIOs
Two 220-pin connectors for interfacing with a carrier board
One JTAG/COP connector, J3, for debugging
Standard microSD socket, J9, accepts microSD and microSDHC cards
One DIP switch for board configuration, SW1, consisting of four switches
LED7: indicates Reset Status
LED9: indicates "Power Good" status
Software-configurable, two-stage Watchdog with programmable timeout ranging from
125 ms to 4096 s in 16 steps
Serves for generating IRQ or hardware reset
There are several timers implemented in the CPU. For further information regarding
these timers, refer to the CPU reference manual from Freescale™.
One onboard temperature sensor for monitoring the board temperature
Refer to Chapter 4, "Power Considerations" for information related to the power
consumption of the COMe-bP5020.
Operational: Refer to Chapter 5, "Thermal" for further information
Storage: -40°C to +70°C
COM Express® basic
125 mm x 95 mm
99 grams (without heat spreader)
220 grams (with heat spreader)
SPECIFICATIONS
User Guide
COMe-bP5020
www.kontron.com
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