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PREPARATION FOR USE
Table 2-2.
User-Furnished Connector Information (continued)
Function /I of Centers Connector
Vendor
Vendor /I
Pins Inches
Type
Soldered
GTE
6ADOI-25-IA1-DD
Pierced Tail
Masterite
NDD8GR25-DR-H-X
Viking
3KH25/9JN5
Wire Wrap
Viking
3KH25/JND5
TI
H421011-25
ITT Cannon EC4A050A1A
Notes:
1.
Connector heights are not guaranteed to conform to Intel
packaging equipment.
Intel
II
102237
-001
N/A
2.
Wirewrap pin lengths are not guaranteed to conform to Intel
packaging equipment.
2-8.
USER-FURNISHED COMPONENT INSTALLATION
Instructions for installing the user-provided components (EPROM and line
driver/terminator devices) onto the iSBC 86/14/30 board is contained in
the following paragraphs.
When installing these components, ensure that
pin 1 of the chip is closest to the white dot indicating pin 1 of the
respective IC socket.
The text provides grid references on the parts
location diagram (see Figure 5-2) for locating the sockets for each
component.
Grid references listed in the text may be located in Figure
5-2.
CAUTION
All MOS devices such as EPROM and
RAM
devices are highly succeptible to
damage from static electricity.
Use
extreme caution when installing MOS
devices in a low humidity environment.
Always ground yourself before handling
MOS devices to ensure that a static
charge build-up is not dissipated
through or around the MOS devices.
2-7
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