Toshiba TECRA S4 Maintenance Manual page 326

4 Replacement Procedure
Assembly of outside Tape and Cover shield
1. Assembly of Cover shield (S).
CAUTION: Pressure or stress should not be given on Source PCB.
Usage of gloves with anti-electric discharge coating is recommended.
To eliminate possible damage on circuits occurred by ESC.
2. Assembly of Cover shield (G).
CAUTION: Pressure or stress should not be given on Gate TCP.
3. Assembly of Tape Adhesive used for Top case fixing.
Assembly of Tape Adhesive used for B/L Wire fixing.
CAUTION: Pressure or stress should not be given on Top case during this process.
Figure 4-64 Replacing LG.Philips fluorescent lamp (XGA) (8)
4-84 [CONFIDENTIAL]
4.30 Fluorescent Lamp
TECRA S3 Maintenance Manual (960-532)