Powerpc 970Mp Microprocessor Package Dimensions - IBM POWERPC 970MP Application Note

Application Note
(Includes Differences for 970FX to 970MP)
®
IBM PowerPC 970MP RISC Microprocessor Preliminary
Table 8-4. Deleted 970FX Pins - not found on 970MP
970FX Pin 970FX Function
PROCID2 Least significant bit in the 3 bit processor ID, automatically set on PowerPC 970MP
THERM_INT_B Dedicated thermal interrupt signal, removed due to lack of use
TRIGGERIN Initiate trace collection from outside, removed due to lack of use
PSYNC_OUT Used to check phase alignment while debugging, removed due to lack of use
SPARE_GND Unneeded Spare

8.3 PowerPC 970MP Microprocessor Package Dimensions

IBM offers the 970MP in a ceramic ball grid array, CBGA, package which supports 575 balls. The 970MP is
offered in a lead reduced package with SnAgCu (SAC) balls. The following figures contain views of the
970MP package.
Figure 8-1 shows the side and top views of the Pb-reduced package including the height from the top of the
die to the bottom of the solder balls. Figure 8-2 shows a bottom view of the PowerPC 970MP package.
8. Package AppNote_970FX-MP_Differences_Body.fm.1.0
Page 22 of 25 November 15, 2006