IBM POWERPC 970MP Application Note page 24

Application Note
(Includes Differences for 970FX to 970MP)
®
IBM PowerPC 970MP RISC Microprocessor
Figure 8-2. PowerPC 970MP Bottom Surface of CBGA Package (Bottom View)
Legend
DATUM A is the center plane of feature labeled DATUM A.
1
2 DATUM B is the center plane of feature labeled DATUM B.
3 Unless otherwise specified part is symmetrical about centerlines defined by DATUMs A and B.
Where not otherwise defined, centerlines indicated are to be interpreted as a datum frame work, established by DATUM
4
D, A, and B, respectively.
This line defines the approximate boundary configuration of encapsulant as dispensed. For underfill requirements see IBM
7
Engineering Specification 71X8781 Module Encapsulation Specification.
The chip's assembled height (which include silicon thickness and melted C4) for 300mm wafers is: 0.829mm - 0.908mm.
9
The 300mm silicon thickness is 0.785mm +/- 0.020mm.
8. Package
Page 24 of 25
AppNote_970FX-MP_Differences_Body.fm.1.0
November 15, 2006
Preliminary