This Document Is The Sole And Exclusive Property Of Wavecom. Not To Be Distributed Or Divulged Without Prior Written; Agreement - Wavecom Integra M2106+ Product Specification

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Table Of Contents

Table of Contents

Notes :

Short description of Class IE13 (For more information see standard IEC 60721-3-1.)

"Locations without controlled temperature and humidity, where heating may be used to raise low

temperatures, locations in buildings providing minimal protection against daily variations of external climate,

prone to receiving rainfall from carrying wind"

Short description of Class IE23 (For more information see standard IEC 60721-3-2.)

"Transportation in unventilated compartments and in conditions without protection against bad weather, in all

sorts of trucks and trailers in areas of well developed road network, in trains equipped with buffers specially

designed to reduce shocks and by boat"

Short description of Class IE35 (For more information see standard IEC 60721-3-3.)

"Locations with no control on heat or humidity where heating may be used to raise low temperatures, to

places inside a building to avoid extremely high temperatures,

staircases, cellars, certain workshops, equipment stations without surveillance"

Short description of Class IE73 (For more information see standard IEC 60721-3-7.)

"Transfer to places where neither temperature nor humidity are controlled, but where heat may be used to

raise low temperatures, to places exposed to water droplets, products can be subjected to ice formation;

these conditions are found in hallways and building staircases, garages, certain workshops, factory building

and places for industrial processes and hardware stations without surveillance"

WARNING:

The specification in the above table applies to the Integra M2106+ Wireless CPU

Customers are advised to verify that the environmental specification of the SIM Card used is

compliant with the M2106+ environmental specifications. Any application must be qualified by the

customer with the SIM Card in storage, transportation and operation.

Notes :

• The use of standard SIM cards may drastically reduce the environmental conditions in which the

Product can be used. These cards are particularly sensible to humidity and temperature changes.

These conditions can produce oxidation of the SIM card metallic layers and cause, in the long term,

electrical discontinuities. This is particularly true in left alone applications, where no frequent

extraction/insertion of the SIM card is performed.

• In case of mobility when the application is moved through different environments with temperature

variations, some condensation may appear. These events have a negative impact on the SIM and can

favor oxidation.

If no solution other than the use of standard SIM card, with exposition to the environmental conditions

described above, is possible, special attention must be paid in the integration of the final application in order

to minimize the impact of these conditions. The solutions that can be proposed are:

• Lubrication of the SIM card to protect the SIM Contact from oxidation.

• Putting the Wireless CPU

Lubrication of the SIM card had been tested by Wavecom (using Tutela Fluid 43EM from MOLYDUVAL) and

gives very good results.

If waterproof enclosure with a desiccant solution is used, check with your desiccant retailer the quantity that

must be used according to enclosure dimensions. Ensure humidity has been removed before sealing the

enclosure.

Any solution selected must be qualified by the customer on the final application.

Note : To minimize oxidation problem on the SIM card, its manipulation must be done with the greatest

precautions. In particular, the metallic contacts of the card must never bee touched with bare fingers or any

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