Chapter 1 Product Introduction; Main Features - Foxconn 755 series User Manual

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Main Features

Size:
ATX form factor of 12" x 8.8"
Microprocessor:
Supports AMD
Athlon64 Processor Hyper Transport
®
8/16 links
Supports AMD
Athlon64 Processor Hyper Transport
®
1600 MT/s bandwidth
Chipset:
SiS Chipset: SiS 755/760 (North Bridge) +SiS 964 (South Bridge)
System Memory
Three 184-pin DDR DIMM slots
Supports PC3200/2700/2100 memory
Supports 128/256/512 Mb technology up to 3GB
USB 2.0 Port
Supports hot-plug
Eight USB 2.0 ports (four rear panel ports, two onboard USB headers
providing four extra ports)
Supports wake-up from S1 and S3 mode
Supports USB 2.0 protocol up to 480Mbps transmission rate
Onboard Serial ATA
150MBps transfer rate
Supports four S-ATA devices, such as HDD, etc
Supports Raid0, Raid1 and JBOD
Onboard 1394(optional)
Supports hot-plug
With rate of transmission at 400Mbps
Self-configured addressing
Supports two independent 1394 units synchronously at most, such as HDD,
CD-ROM
2
755A01-032604.p65

Chapter 1 Product Introduction

755/760A01 Series User Manual
2
Technology with
TM
Technology up to
TM
2004-3-26, 15:28

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