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Fig. 9.3
Vapor Phase Reflow Recommended Conditions
After soldering, eliminate/clean remaining flux off the PCB because it affects reliability of the parts and PCB
wiring, as a rule.
As an example, ultrasonic cleaning is employed under the following conditions.
destruction of the device, pay attention to an applied frequency, electric power(particularly peak power), time
and resonance of the device.
Frequency
Ultrasonic output
Time
Others
The epoxy resin used for the plastic package cannot resist absorbing moisture when it is stored in a
high-humidity place.
and cause exfoliation of the resin/lead frame interface, resulting in the cracks of the package in the worst case.
As it is important to store in a dry atmosphere(preferably normal temperature and humidity; 5~35°C and
45~75 % RH as guides), the package is packed damp-proof.
environment in order to minimize moisture absorption, and perform reflow mounting as quickly as possible.
When you re-store it in damp-proof packing, put moisture-free silica gel in it and seal again.
want to eliminate moisture absorbed during transportation, storage, or handling, it is recommended to dry(At
125°C) for 16~24 hours.
The external terminals should be stored unprocessed.
of rust at the time of mounting.
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28~29kHz (The device should not resonate)
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15W/each time
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30sec or less
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The device and PCB should not directly touch a vibration source.
If more moisture is absorbed, it will be abruptly vaporized at the time of soldering
After unpacking it, store it under a prescribed
This is to avoid a soldering failure due to occurrence
41
CBM-202PC-04 User's Manual
In order to prevent
When you
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