8
REMARKS FOR MOUNTING
8.1
TEMPERATURE CONDITIONS FOR MOUNTING
Infrared Reflow System
Recommended Conditions
Peak temperature : 230ºC and less (package surface temp.)
Time
No of times
Flux
VPS Reflow System
Recommended Conditions
Peak temperature : 215ºC and less (boiling temp. of solvent)
Time
No of times
Flux
Wave Soldering System
Recommended Conditions
Temperature
Time
Preheating temperature
No of times
Flux
: Within 30 seconds (at 210ºC or above)
: 1
: Rosin type flux with less chlorine content(chlorine 0.2Wt% or less)
: 25 40 seconds (at 200ºC or above)
: 1
: Rosin type flux with less chlorine content(chlorine 0.2Wt% or less)
: 260 ºC (fused solder temp.)
: within 10 seconds
: 120ºC or less (package surface temp.)
: 1
: Rosin type flux with less chlorine content(chlorine 0.2Wt% or less)
25