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EMC CLARiiON DAE2P Hardware Reference Manual

Disk-array enclosures
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DAE2P and DAE3P Disk-Array Enclosures
EMC CLARiiON
HARDWARE REFERENCE
P/N 300-002-407
EMC Corporation
Corporate Headquarters:
Hopkinton, MA 01748
-
1
508
www.EMC.com
REV A04
-
9103
-
-
435
1000

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  • Page 1 EMC CLARiiON DAE2P and DAE3P Disk-Array Enclosures HARDWARE REFERENCE P/N 300-002-407 REV A04 EMC Corporation Corporate Headquarters: Hopkinton, MA 01748 9103 1000 www.EMC.com...
  • Page 2 Use, copying, and distribution of any EMC software described in this publication requires an applicable software license. For the most up-to-date listing of EMC product names, see EMC Corporation Trademarks on EMC.com. All other trademarks used herein are the property of their respective owners. DAE2P/DAE3P Hardware Reference...
  • Page 3 This product complies with EN55022, CISPR22 and AS/NZS CISPR22 Class A. This is a Class A product. In a domestic environment this product may cause radio interference in which case the user may be required to take adequate measures. DAE2P/DAE3P Hardware Reference...
  • Page 4 Apparatus CE Mark European EMC Directive & Low Voltage Directive Requirements. VCCI Class A, Voluntary Control Council for Interference AS/NZS CISPR22 Class A, Electromagnetic Interference - Limits & Methods of Measurement of ITE CNS13438 BSMI EMC Requirements DAE2P/DAE3P Hardware Reference...

  • Page 5: Table Of Contents

    Installing a disk enclosure in a cabinet ......... 2-3 Setting up an installed disk enclosure .......... 2-4 Connecting AC Power..............2-5 Setting the enclosure address............2-10 Connecting the DAE2P/DAE3P to the back end bus....2-12 Binding disk modules into RAID groups........2-15 Chapter 3 Servicing a DAE2P/DAE3P Monitoring disk enclosure status ..........
  • Page 6 Contents Appendix A Technical specifications Enclosure specifications ..............A-2 Operating limits ................A-5 Index ..........................i-1 DAE2P/DAE3P Hardware Reference...
  • Page 7 Disk modules ....................1-10 Power/cooling module LEDs ..............1-12 Plugging in the AC line cords ..............2-5 Connecting DAE2P power cords (CX300/CX500 storage system) ..2-7 Connecting DAE3P power cords (CX3-80 storage system) ....2-8 Setting the enclosure address (EA) ............2-11 Connecting a disk enclosure to another FC device ........
  • Page 8 Reconnecting a copper cable to an LCC ..........3-19 3-15 Unplugging the AC power cord ............... 3-20 3-16 Removing a power/cooling module ............3-21 3-17 Installing a power/cooling module ............3-21 3-18 Plugging in the power cord ............... 3-22 viii DAE2P/DAE3P Hardware Reference...

  • Page 9: Preface

    The DAE2P/DAE3P is often called a disk enclosure. Audience This guide is part of the DAE2P and DAE3P documentation set, and is intended for use by system administrators and others responsible for the installation, setup, and maintenance of the product.
  • Page 10 DANGER A danger notice contains information essential to avoid a hazard that will cause severe personal injury, death, or substantial property damage if you ignore the message. DAE2P/DAE3P Hardware Reference...
  • Page 11 LUN-name | LUN-number means you can use either the LUN-name or the LUN-number. Finding current The most up-to-date information about the DAE2P and DAE3P is information posted on the EMC Powerlink website. We recommend that you download the latest information before you install or service your enclosure.
  • Page 12 Your comments Your suggestions will help us continue to improve the accuracy, organization, and overall quality of user publications. Please send a message to techpub_comments@emc.com with your opinions of this manual. DAE2P/DAE3P Hardware Reference...

  • Page 13: Warnings And Cautions

    Un circuit de terre continu est essentiel en vue du fonctionnement sécuritaire de l'apareil. Ne jamais mettre l'appareil en marche lorsque le conducteur de mise a la terre est débranché. WARNUNG Nur für Fachpersonal. STROMSTREUVERLUST: Gerät muss geerdet werden, bevor es am Stromnetz angeschlossen wird. xiii DAE2P/DAE3P Hardware Reference...
  • Page 14 Store all printed-circuit boards in antistatic bags. Use a ground strap whenever you handle a printed-circuit board. Unless specifically designed for nondisruptive replacement, never plug or unplug printed-circuit boards with the power on. Severe component damage may result. DAE2P/DAE3P Hardware Reference...
  • Page 15 (RTC) for three to four years in the absence of power. Only trained personnel should change or replace this battery. WARNING Danger of explosion if battery is incorrectly replaced. Replace only with the same or equivalent type recommended by the equipment manufacturer. Discard used batteries according to manufacturer's instructions. DAE2P/DAE3P Hardware Reference...
  • Page 16 Warnings and Cautions DAE2P/DAE3P Hardware Reference...

  • Page 17: About Dae2P And Dae3P Disk Enclosures

    Invisible Body Tag About DAE2P and DAE3P disk enclosures Topics in this chapter include: Introduction ..................1-2 Link Control Cards (LCCs)...............1-8 Disk modules ..................1-9 Power supply/system cooling modules........1-11 About DAE2P and DAE3P disk enclosures...

  • Page 18: Introduction

    The examples and illustrations in this manual show the rackmounted DAE2P/DAE3P in a standard 40U EMC cabinet. DAE2P enclosures include high-performance Fibre Channel disk drives. DAE3P enclosures can include either Fibre Channel or economical Serial Advanced Technology Attach (SATA 3 Gb/s, sometimes called SATA II) drives.
  • Page 19 4-gigabit disk modules and operate at either 2- or 4-gigabit bus speed. 2 Gb processors, enclosures, and disk modules cannot support or operate on a 4 Gb bus. The DAE2P and DAE3P are externally identical except for a distinguishing "4GB" label on the back of DAE3P enclosures.

  • Page 20: Dae2P/Dae3P Front Led Display

    EMC2166a DAE2P/DAE3P front LED display Figure 1-2 A blue power LED indicates a DAE3P enclosure operating at four gigabits per second. The power LED is green in DAE2P enclosures, and DAE3Ps operating at two Gb. Figure 1-3 Figure 1-4 show the DAE2P/DAE3P components visible from the rear of the enclosure.

  • Page 21: Dae2P/Dae3P Rear Components

    About DAE2P and DAE3P disk enclosures Power/Cooling Module B Link Control Card B Power/Cooling Module A Link Control Card A EMC3232 DAE2P/DAE3P rear components Figure 1-3 SPS (Not used in Expansion Primary CLARiiON) (Out) (In) Blower Fault (Amber) Power Fault...

  • Page 22: Disk Enclosure Bus And Address Indicators

    About DAE2P and DAE3P disk enclosures EA Selection Enclosure (Press here to Bus ID Address change EA) EMC3210 Disk enclosure bus and address indicators Figure 1-5 The enclosure address is set at installation. Disk module IDs are numbered left to right (looking at the front of the unit) and are contiguous throughout an array: enclosure 0 contains modules 0-14;...

  • Page 23: Disk Enclosure Front Bezel

    About DAE2P and DAE3P disk enclosures to remove and install drive modules. EMI compliance requires a properly installed front bezel. EMC2173 Disk enclosure front bezel Figure 1-6 Introduction...

  • Page 24: Link Control Cards (Lccs)

    Figure 1-7 A blue Link Active LED indicates a DAE3P enclosure operating at four gigabits. The Link Active LED(s) is green in DAE2P enclosures, and DAE3Ps operating at two Gb. The LCCs in a DAE2P/DAE3P connect to other Fibre Channel devices (processor enclosures, or other DAEs) with twin-axial copper cables.

  • Page 25: Disk Modules

    Channel and ATA (Advanced Technology Attachment) DAE2 enclosures with DAE2P/DAE3Ps within a storage system, but you cannot use ATA disks within a DAE2P or DAE3P. (DAE3P SATA disks will not work in a DAE2-ATA enclosure.) A DAE3P enclosure can include Fibre Channel or SATA disk modules, but not both types;...

  • Page 26: Disk Modules

    4 Gb Fibre Channel connection for the module. The 4 Gb drives in a DAE2P will operate at 2 Gb; a DAE3P supports 2 Gb drives only if the entire back-end bus that contains the drives is operating at 2 Gb.

  • Page 27: Power Supply/System Cooling Modules

    If two blowers in a system (both in one power/cooling module, or one in each module) fail, the DAE2P/DAE3P will go off line within two minutes. Each power/cooling module has three visible status lights. The green LED indicates power to the supply;...

  • Page 28: Power/Cooling Module Leds

    Figure 1-9 A captive screw on the power/cooling module locks it into place to ensure proper connection to the midplane. You can add or remove one power/cooling module in a DAE2P/DAE3P while the system is powered up. 1-12 DAE2P/DAE3P Hardware Reference...

  • Page 29: Installing A Dae2P/Dae3P

    Installing a disk enclosure in a cabinet ...........2-3 Setting up an installed disk enclosure ..........2-4 Connecting AC power...............2-5 Setting the enclosure address ............2-10 Connecting the DAE2P/DAE3P to the back end bus....2-12 Binding disk modules into RAID groups........2-15 Installing a DAE2P/DAE3P...

  • Page 30: Requirements

    The air conditioning must be able to handle the BTU requirements of the DAE2P/DAE3P disk enclosures. Cabling The DAE2P/DAE3P supports copper cable for a Fibre Channel requirements connection to another Fibre Channel device (for example, a storage processor, DAE2, or another DAE2P/DAE3P).

  • Page 31: Installing A Disk Enclosure In A Cabinet

    Installing a DAE2P/DAE3P Interconnections between disk enclosures should maintain LCC consistency; that is, one Fibre Channel (FC) loop should interconnect all and only the LCC As, and the other Fibre Channel loop should interconnect all and only LCC Bs. Connect all cables at both ends, or remove unused cables completely from the host or LCC ports.

  • Page 32: Setting Up An Installed Disk Enclosure

    Set the enclosure address (EA) Connect the DAE2P/DAE3P to a back end bus (loop) Bind disk modules into RAID groups You must set the DAE2P/DAE3P enclosure address with power ON while the enclosure is not connected to a BE bus. DAE2P/DAE3P Hardware Reference...

  • Page 33: Connecting Ac Power

    Installing a DAE2P/DAE3P Connecting AC power CAUTION The disk-array enclosure will power up immediately once you attach it to an active AC power source. Plan your power configuration before connecting to a power distribution unit or standby power supply. 1. Plug an AC line cord into each power/cooling module, as shown Figure 2-1.
  • Page 34 You can configure a driveless disk enclosure within a Fibre Channel bus. High availability with write-caching requires disks in slots 0-4 in the first disk enclosure (DPE2, DAE, DAE2P, or DAE3P) connected to a storage processor (Enclosure Address 0, bus 0).

  • Page 35: Connecting Dae2P Power Cords (Cx300/Cx500 Storage System)

    240 V SPS B SPS A EMC3207 Connecting DAE2P power cords (CX300/CX500 storage system) Figure 2-2 b. Highly available, write-caching configurations require that you connect the first disk enclosure in a storage system (EA 0, bus 0) to a Standby Power Supply (SPS) for enclosure power.

  • Page 36: Connecting Dae3P Power Cords (Cx3-80 Storage System)

    Installing a DAE2P/DAE3P If you do connect a DAE2P/DAE3P to an SPS (if, for example, the DAE2P/DAE3P is the first disk enclosure in a CX700- or CX3-series configuration), be sure that you maintain power/bus integrity; always connect power module A to SPS A, and module B to SPS B.
  • Page 37 The only power switches that control DAE2Ps and DAE3Ps are those on the SPS and the cabinet master switch or circuit breakers, which are normally on. As a result, a DAE2P/DAE3P is always active. When you initially apply AC power to a disk enclosure, the disk drive modules power up according to their specifications, and spin up in a staggered sequence.

  • Page 38: Setting The Enclosure Address

    Setting the enclosure address Before you specify an enclosure address or connect your DAE2P/DAE3P to a back end bus, make certain the loop (bus) and EA are in agreement. Each disk enclosure in a Fibre Channel bus must have a unique enclosure address (also called an EA, or enclosure ID) that identifies the enclosure and determines disk module IDs.

  • Page 39: Setting The Enclosure Address (Ea)

    Installing a DAE2P/DAE3P CAUTION Each drive reads its FC-AL physical address at powerup or when the drive is reset. To avoid losing data, you must set the enclosure address when power is on and the enclosure is not part of a back-end bus;...

  • Page 40: Connecting The Dae2P/Dae3P To The Back End Bus

    Installing a DAE2P/DAE3P Connecting the DAE2P/DAE3P to the back end bus Attach your DAE2P/DAE3P to a back end bus after you have set the enclosure address. 1. Attach the copper cable from the external device (storage processor, DAE2, or another DAE2P/DAE3P) to the PRI...

  • Page 41: Cabling Disk Enclosures Together - Two Fibre Channel Buses

    Installing a DAE2P/DAE3P The figures in this chapter show configurations with DAE2P/DAE3Ps as the only disk-array enclosures. Environments with a mix of DAE2 and DAE2P/DAE3P enclosures follow the same EA, bus balancing, and cabling conventions whenever possible and practical. The configuration example in...

  • Page 42: Cabling Dae2Ps/Dae3Ps Together - Four Fibre Channel Buses

    Installing a DAE2P/DAE3P Figure 2-7 shows a more complicated configuration with ten DAE3Ps and four Fibre Channel buses. EA1/Bus 3 LCC B LCC A EA0/Bus 3 Bus 3 Bus 3 EA1/Bus 2 EA0/Bus 2 Bus 2 Bus 2 EA2/Bus 1...

  • Page 43: Binding Disk Modules Into Raid Groups

    Installing a DAE2P/DAE3P Binding disk modules into RAID groups ® After cabling the disk enclosure, use EMC Navisphere Manager software to bind the disks into RAID groups. Refer to the EMC Navisphere Manager Administrator’s Guide and your storage processor configuration and planning guide for detailed information.
  • Page 44 Installing a DAE2P/DAE3P • Within any specific capacity, place drives of the highest speed first, followed by drives of lower speed. You should always use disks of the same speed and capacity in any RAID group. Do not use ATA or SATA drives to store boot images of an operating system.

  • Page 45: Servicing A Dae2P/Dae3P

    FRUs, and replace or add a Field Replaceable Unit (FRU). Topics are: Monitoring disk enclosure status ............3-2 Handling FRUs...................3-6 Replacing or adding a disk module ..........3-10 Replacing an LCC module..............3-17 Replacing a power supply/system cooling module....3-20 DAE2P/DAE3P For more information about upgrading your , contact your service provider. Servicing a DAE2P/DAE3P...

  • Page 46: Monitoring Disk Enclosure Status

    Servicing a DAE2P/DAE3P Monitoring disk enclosure status Status lights on the DAE2P/DAE3P and its FRUs indicate error conditions. These lights are visible outside the disk enclosure. Some lights are visible from the front, and the others from the back. Figures...
  • Page 47 Servicing a DAE2P/DAE3P Status lights visible from the front of the disk enclosure Table 3-1 Light Quantity Color Meaning Disk Enclosure Power Green Power to enclosure is on; back-end bus running at 2 Gb/s Blue Power to DAE3P enclosure is on; back-end bus running at 4 Gb/s Disk Enclosure Fault Amber On when any fault condition exists;...

  • Page 48: Enclosure Address And Bus Id Indicators

    Figure 3-2 shows the enclosure address and bus ID indicators, visible from the back of the enclosure. In this example, the DAE2P/DAE3P is enclosure 2 on loop (bus) 1; note that the indicators for LCC A and LCC B must always match.

  • Page 49: Power/Cooling Module Status Indicators

    Servicing a DAE2P/DAE3P Power LED (Green) Power Fault LED (Amber) Blower Fault LED (Amber) Blower Fault LED (Amber) Power Fault LED (Amber) Power LED (Green) EMC3179 Power/cooling module status indicators Figure 3-3 Figure 3-4 shows the status LEDs for the link control cards.

  • Page 50: Handling Frus

    On when a single blower in the power supply is faulty. * The DAE2P/DAE3P will continue running with a single power supply and three of its four blowers. Removing a power/cooling module constitutes a multiple blower fault condition, and will power down the enclosure unless you replace a blower within two minutes.
  • Page 51 DAE2P. If you need to power down a DAE2P/DAE3P, simply unplug the unit. You do not need to shut down main AC lines to the disk enclosure unless you need to power down all the cabinet contents connected to that line.
  • Page 52 Servicing a DAE2P/DAE3P Use the ESD kit when handling any FRU. If an emergency arises and the ESD kit is not available, follow the procedures in the Emergency Procedures (Without an ESD Kit) section. Emergency In an emergency when an ESD kit is not available, use the following...
  • Page 53 Servicing a DAE2P/DAE3P Never use excessive force to remove or install a FRU. Store a FRU in the antistatic bag and specially designed shipping container in which you received it. Use that container if you need to return the FRU for repair.

  • Page 54: Replacing Or Adding A Disk Module

    Servicing a DAE2P/DAE3P Replacing or adding a disk module CAUTION Disk modules are extremely sensitive electronic components. Always handle a disk module gently, and observe the following guidelines: Follow the instructions in the preceding section “Avoiding Electrostatic Discharge (ESD) damage” on page 3-7.
  • Page 55 Servicing a DAE2P/DAE3P Always wear a properly attached ESD wristband when removing or replacing a disk module. Disk modules are sensitive to the extreme temperatures sometimes encountered during shipping. We recommend that you leave new disk modules in their shipping material and...

  • Page 56: Unlocking And Removing The Front Bezel

    Servicing a DAE2P/DAE3P Unlocking and removing the front bezel Follow these steps to remove the front bezel and gain access to the disk modules. Refer to Figure 3-6. 1. Insert the key that shipped with your enclosure into the bezel lock, and turn it to release the lock.

  • Page 57: Removing A Disk Filler Module

    Servicing a DAE2P/DAE3P Removing a disk filler module Locate the slot where you want to install the disk module, and remove the filler module, as shown in Figure 3-7. EMC2210 Figure 3-7 Removing a disk filler module Skip to the disk installation procedure...

  • Page 58: Removing A Disk Module

    An enclosure running at 4 Gb/s will recognize only 4 Gb disks (with a 2/4 mark on the front label). A DAE2P will support 4 Gb disks at 2 Gb/s. 1. Make sure an ESD wristband is attached to your wrist and the...

  • Page 59: Installing A Disk Or Filler Module

    Servicing a DAE2P/DAE3P 3. Refer to Figure 3-9 as you insert the new disk module. a. With the disk module latch fully open, gently push the module into the slot. b. The disk module latch will begin to rotate downward when its tabs meet the enclosure chassis.

  • Page 60: Installing And Locking The Front Bezel

    Servicing a DAE2P/DAE3P Installing and locking the front bezel Refer to Figure 3-10 as you do the following: 1. Align the bezel with the disk enclosure. 2. Gently push the bezel into place on the cabinet until it latches. 3. Secure the bezel by turning the key in the lock.

  • Page 61: Replacing An Lcc Module

    Make sure you have the correct replacement part before removing the LCC. A DAE2P or DAE3P must have at least one LCC installed while it is powered up. Do not remove both LCCs while the disk enclosure is powered up.

  • Page 62: Installing An Lcc

    Servicing a DAE2P/DAE3P Captive Screw Captive Screw EMC3227 Removing an LCC Figure 3-12 Continue to the next section to install the replacement LCC. Installing an LCC 1. Gently insert the LCC as shown in Figure 3-13. Be sure the module is completely seated in the enclosure midplane.

  • Page 63: Reconnecting A Copper Cable To An Lcc

    Servicing a DAE2P/DAE3P The LCC Power light turns on. 2. Secure the module with the captive screws. 3. Reattach the copper cables to the same connector from which you removed them, as shown in Figure 3-14. Connector To Previous Enclosure...

  • Page 64: Replacing A Power Supply/System Cooling Module

    Servicing a DAE2P/DAE3P Replacing a power supply/system cooling module CAUTION Handle a power supply/system cooling (power/cooling) module gently and use an ESD wristband. Do not remove a power/cooling module until you have a replacement module available. Access to the disks in your enclosure will time out and the disks will spin down two minutes after a power/cooling module is removed from the enclosure.

  • Page 65: Removing A Power/Cooling Module

    Servicing a DAE2P/DAE3P To protect a running system from overheating, the enclosure will time out unless you replace the power/cooling module within two minutes. Captive Screw EMC3228 Removing a power/cooling module Figure 3-16 3. Gently insert the new power/cooling module into the enclosure,...

  • Page 66: Plugging In The Power Cord

    Servicing a DAE2P/DAE3P 5. Plug the AC power cord into the new supply as shown in Figure 3-18. Generic Plug Retention Bail Retention Bail Generic EMC3213 Plug Figure 3-18 Plugging in the power cord Make certain you secure the power cord with the retention bails at each connector.

  • Page 67: Enclosure Specifications

    Invisible Body Tag Technical specifications Body Tag This appendix describes the disk-array enclosure technical specifications, operating limits, and shipping and storage requirements. Major topics are: Enclosure specifications ..............A-2 Operating limits ................A-5 Technical specifications...

  • Page 68: Enclosure Specifications

    IEC320-C14 appliance coupler, per power supply Ride-through time 30 ms min Current sharing 60% max, 40% min, between power supplies * Ratings assume a fully configured DAE2P/DAE3P that includes two power supplies, two LCCs, and 15 disk drives. DAE2P/DAE3P Hardware Reference...

  • Page 69: Size And Weight

    8.2 kg (18 lbs) chassis and midplane Drive type The DAE2P/DAE3P uses 3.5-inch (8.75 cm) by 1.0-inch (2.54 cm) disk drives. Standard, Fibre Channel drives are 12-volt, and support the Fibre Channel interface. SATA drives (DAE3P only) are 12- and 5-volt and support the SATA 3 Gb/s interface;...

  • Page 70: Fibre Channel Related Standards

    Physical and signaling interface, FC-PI-2, draft Rev. 7 or higher Fibre Channel Arbitrated Loop (FC-AL), Revision 4.5 Fibre Channel Private Loop Direct Attach (PLDA), Revision 2.1 In some cases, the DAE2P/DAE3P uses functions from later revisions of specifications. DAE2P/DAE3P Hardware Reference...

  • Page 71: Operating Limits

    SPs, and — in a DPE2 enclosure — powers down the disks. LCCs in each DAE2P/DAE3P will power down their disks but remain powered on. If the system detects that the temperature has dropped to an...

  • Page 72: Shipping And Storage Requirements

    Technical specifications Shipping and storage requirements Requirement Description Ambient temperature C to 65 C (-40 F to 149 Temperature gradient C/hr (45 F/hr) Relative humidity 10% to 90% noncondensing Elevation 7625 m (25,000 ft) DAE2P/DAE3P Hardware Reference...

  • Page 73: Index

    1-11 EA indicator 3-4 binding RAID groups 2-15 front bezel description 1-6 operating limits A-5 cabinet, installing DAE2P in 2-3 power supply 1-11 cables powering down 3-7, 3-20 reattaching to LCC 3-19 powering up 3-22 removing from LCC 3-17...
  • Page 74 ID 3-4 midplane description 1-6 installation requirements 2-2 rear, description 1-5 installing Enclosure Address (EA) DAE2P in cabinet 2-3 requirements 2-10 disk filler modules 3-14 setting 2-11 Enclosure ID, see Enclosure Address environmental recovery A-5 LCC (link control card)
  • Page 75 Cooling Check 3-6 status turning off 3-20 monitoring DAE2P 3-2 turning on 3-22 status lights, DAE2P 3-2 powering down DAE2P 3-7, 3-20 powering up DAE2P 3-22 technical specifications, DAE2P A-2 technical support xii RAID groups 2-15 turning off power supply 3-7, 3-20...
  • Page 76 Index DAE2P/DAE3P Hardware Reference...

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