Removing And Replacing The Retention Module; Removing And Replacing The System Board - IBM 8836 - Eserver xSeries 306 Maintenance And Troubleshooting Manual

Hardware maintenance manual
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Removing and replacing the retention module

Complete the following steps to remove the retention module.
Note:
v Read "Installation guidelines" on page 27.
v Read Appendix B, "Safety information," on page 83.
v Read "Handling static-sensitive devices" on page 27.
1. Turn off the server, and disconnect all power cords and external cables; then,
2. Remove the air baffle (see "Removing and replacing the air baffle" on page 52).
3. Remove the heat sink:
4. Loosen the four screws on the corners of the retention module, and lift the
To install a retention module, reverse the previous steps.

Removing and replacing the system board

Important: When replacing the system board, you must:
v Either update the firmware to the latest level, or restore the pre-existing firmware
v Update the UUID (see "Updating the UUID" on page 26).
v Update the DMI/SMBIOS (see "Updating the DMI/SMBIOS data" on page 26).
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xSeries 306 Type 1878, 8489 and 8836: Hardware Maintenance Manual and Troubleshooting Guide
remove the server cover (see "Removing the cover" on page 32).
a. Loosen the screw on each of the two leaf springs on the retention module.
Note: Loosening one screw fully before loosening the other screw will help
to break the thermal bond that adheres the heat sink to the microprocessor.
b. Pivot the leaf-spring enclosure outward.
c. Gently twist the heat sink until you break the thermal bond, and pull the heat
sink away from the retention module and the microprocessor.
retention module out of the server.
that the customer provides on a diskette or CD.
Retention module

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