HP Pavilion 14, Trixie, G7GA Disassembly Manual

Also See for Pavilion 14:

Maintenance and service manual (142 pages)

Product end-of-life disassembly instructions (8 pages)

Technical white paper (8 pages)

Also fits for
Trixie
G7ga

Table of Contents

Contents

1 Product End-of-Life Disassembly Instructions
2 Documents / Resources
- 2.1 Download manual

HP Pavilion 14, Trixie, G7GA Disassembly Manual

Product End-of-Life Disassembly Instructions

Product Category: Notebooks and Tablet PCs

Marketing Name / Model
[List multiple models if applicable.]

HP Pavilion 14 Laptop PC / Trixie / G7GA

Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions for the disassembly of HPI products to remove components and materials requiring selective treatment, as defined by EU directive 2012/19/EC, Waste Electrical and Electronic Equipment (WEEE).

warning NOTE: Recyclers should sort plastic materials into resin streams for recycling based on the ISO 11469 plastic marking code on the plastic part. For any questions on plastic marking, please contact HP's Sustainability Contact.

Items Requiring Selective Treatment

Items listed below are classified as requiring selective treatment.
Enter the quantity of items contained within the product which require selective treatment in the right column, as applicable.

Item Description	Notes	Quantity of items included in product
Printed Circuit Boards (PCB) or Printed Circuit Assemblies (PCA)	With a surface greater than 10 sq cm	2
Batteries, excluding Li-Ion batteries.	All types including standard alkaline, coin or button style batteries
Li-Ion batteries. Include all Li-Ion batteries if more than one is provided with the product (such as a detachable notebook keyboard battery, RTC coin cell, etc.)	Battery(ies) are attached to the product by (check all that apply with an "x" inside the "[ ]"): [x] screws [ ] snaps [ ] adhesive [ ] other. Explain NOTE: Add detailed removal procedures including required tools in the Product Disassembly Process section.	1
Mercury-containing components	For example, mercury in lamps, display backlights, scanner lamps, switches, batteries
Liquid Crystal Displays (LCD) with a surface greater than 100 sq cm	Includes background illuminated displays with gas discharge lamps 14"	1
Cathode Ray Tubes (CRT)
Capacitors / condensers (Containing PCB/PCT)
Electrolytic Capacitors / Condensers measuring greater than 2.5 cm in diameter or height
External electrical cables and cords	DC Cable for External Power Supply	1
Gas Discharge Lamps
Plastics containing Brominated Flame Retardants weighing > 25 grams (not including PCBs or PCAs already listed as a separate item above)
Components and parts containing toner and ink, including liquids, semi-liquids (gel/paste) and toner	Include the cartridges, print heads, tubes, vent chambers, and service stations.
Components and waste containing asbestos
Components, parts and materials containing refractory ceramic fibers
Components, parts and materials containing radioactive substances

Tools Required

List the type and size of the tools that would typically be used to disassemble the product to a point where components and materials requiring selective treatment can be removed.

Tool Description	Tool Size (if applicable)
Screw driver	#0
Screw driver	#1

Product Disassembly Process

List the basic step
that should typically be followed to remove components and materials requiring selective treatment including the required steps to remove the external enclosure:

Remove rubber foot of front and rear side and dis-fasten BASE screw*6
Remove BASE and dis-fasten battery screw*4
Remove battery
Pull out FFC*5 (USB, Finger print, Touchpad, Keyboard Membrane, Keyboard Back light))
Dis-fasten USB Board screw*2
Remove USB Board
Dis-fasten WLAN screw*1, SSD card screw*1, fan screw*3, and thermal module screw*4
Remove WLAN fan, SSD card, thermal module and RAM*2
Dis-fasten M/B screw*4
Pull out speaker wire, LVDS cable, DC-IN cable and remove M/B
Dis-fasten hinge L/R screw*4
Remove LCD bezel
Pull out the adhesive & Remove panel
Dis-fasten hinge screw*10
Remove CCD module, LVDS cable, antenna wire

Optional Graphic.
If the disassembly process is complex, insert a graphic illustration below to identify the items contained in the product that require selective treatment (with descriptions and arrows identifying locations).

Remove rubber foot of front and rear side and dis-fasten BASE screw*6
Remove BASE and dis-fasten battery screw*4
Remove battery
Pull out FFC*5 (USB, Finger print, Touchpad, Keyboard Membrane, Keyboard Back light)
Dis-fasten DB screw*2
Remove DB
Dis-fasten WLAN screw*1, SSD card screw*1,fan screw*3,and thermal module screw*4
Remove WLAN fan, SSD card, thermal module and RAM*2
Dis-fasten M/B screw*4
Pull out speaker wire, LVDS cable, DC-IN cable and remove M/B
Dis-fasten hinge L/R screw*4
Remove LCD bezel
Pull out the adhesive & Remove panel
Dis-fasten hinge screw*10
Remove CCD module, LVDS cable, antenna wire