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ON Semiconductor NCP51810 User Manual

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NCP51810 HB GaN Driver
Evaluation Board
User's Manual
NCP51810 High−Speed, Half−Bridge, GaN
Driver Evaluation Board for Existing or
New PCB Designs
NCP51810GAN1GEVB
INTRODUCTION
Purpose
The NCP51810 HB GaN Driver Evaluation Board (EVB) is
intended to replace the driver and power MOSFETs used in existing
half−bridge or full−bridge power supplies. This EVB highlights the
performance, simplicity and minimal number of components required
to efficiently and reliably drive two gallium nitride power switches
used in a mid−voltage, totem pole configuration. Intended applications
include off−line power converter topologies such as: phase−shifted
full−bridge, active clamp flyback and forward, dual active−bridge, and
voltage synchronous buck. This document describes mating
techniques for the NCP51810 HB GaN Driver EVB.
NCP51810 GaN Driver Description
The NCP51810 high−speed, gate driver is designed to meet the
stringent requirements of driving enhancement mode (E−mode), high
electron mobility transistor (HEMT) and gate injection transistor
(GIT) HEMT, gallium nitride (GaN) power switches in half−bridge
power topologies. The NCP51810 offers short and matched
propagation delays with advanced level shift technology providing
−3.5 V to +100 V (typical) common mode voltage range for the
high−side drive and −3.5 V to +3.5 V common mode voltage range for
the low−side drive. In addition, the device provides stable and reliable
operation when used in high dV/dt environments up to 200 V/ns. In
order to fully protect the gates of the GaN power switches against
excessive voltage, both NCP51810 drive stages employ separate,
dedicated voltage regulators to accurately maintain the gate−source
drive signal amplitude. The circuit offers active clamping of the
driver's bias rails thus protecting against potential gate−source
over−voltage under various operating conditions.
The NCP51810 offers important protection functions such as
independent under−voltage lockout (UVLO), monitoring V
voltage, VDDH and VDDL driver bias and thermal shutdown based
on die junction temperature of the device. As shown in Figure 2, the
Schmitt trigger, EN, HIN and LIN inputs are internally pulled LOW to
assure the driver is always in a default 'OFF' state during initial
application of V
by the DT pin and can be configured to prevent or allow
cross−conduction.
© Semiconductor Components Industries, LLC, 2020
October, 2020 − Rev. 0
Arrow.com.
Downloaded from
bias. Programmable dead−time control is available
DD
www.onsemi.com
EVAL BOARD USER'S MANUAL
Figure 1. Evaluation Board Photo
bias
DD
1
Publication Order Number:
EVBUM2762/D

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Summary of Contents for ON Semiconductor NCP51810

  • Page 1 This document describes mating techniques for the NCP51810 HB GaN Driver EVB. NCP51810 GaN Driver Description The NCP51810 high−speed, gate driver is designed to meet the stringent requirements of driving enhancement mode (E−mode), high electron mobility transistor (HEMT) and gate injection transistor (GIT) HEMT, gallium nitride (GaN) power switches in half−bridge...
  • Page 2 Figure 2. NCP51810, Functional Block Diagram NCP51810 HB GaN Driver EVB Description temperature should not exceed ~90°C (90°C = 1.6 x The NCP51810 HB GaN Driver EVB is designed using an , normalized at 25°C). The EVB has only 27 DS(ON) 1880 mil x 1310 mil, four−layer printed circuit board (PCB)
  • Page 3 NCP51810GAN1GEVB Figure 3. NCP51810 HB GaN Driver EVB Figure 4. Tip−and−Barrel Measurement Method www.onsemi.com Arrow.com. Downloaded from...
  • Page 4 NCP51810GAN1GEVB NCP51810 EVB Schematic Figure 5. NCP51810 EVB Schematic www.onsemi.com Arrow.com. Downloaded from...
  • Page 5 NCP51810GAN1GEVB NCP51810 EVB Bill of Materials (BOM) Table 1. NCP51810 EVB BILL OF MATERIALS Item Reference Value Part Number Description Manufacturer Pkg Type 10 pF CC0603JRNPO9BN100 CAP, SMD, CERAMIC, 50 V, NPO Yageo 470 nF CC0603KRX7R8BB474 CAP, SMD, CERAMIC, 25 V, X7R...
  • Page 6 NCP51810GAN1GEVB NCP51810 Layers • • Top Layer: The large copper high current carrying etches Layer 3 (Internal): Layer 3 has additional high current used to connect the HS/LS GaN power switches also act carrying etches for the HS/LS GaN power switches.
  • Page 7 NCP51810GAN1GEVB NCP51810 EVB I/C Connections Input Connector Power Stage Figure 7. EVB I/O Connections Table 2. I/O CONNECTOR DESCRIPTION Pin Name Pin Type Description Value EN (Note 3) J1−1 Logic input for enabling/disabling the driver 2.5 V < EN < V + 0.3 V...
  • Page 8 Resistor on Power Board this resistor if not removed. The NCP51810 low−side drive Connect the EVB as shown in Figure 9. AWG #22 wire is circuit is able to withstand −3.5 V to +3.5 V of common mode suggested for LIN, HIN and VDD.
  • Page 9 NCP51810GAN1GEVB PGND CONTROLLER LOUT HOUT VBULK TWISTED PAIR TWISTED PAIR INSTALLED Figure 9. Connection Method #1 − No LS Current Sense Resistor RESISTOR PGND CONTROLLER LOUT FLOATING AT VCS HOUT VBULK TWISTED PAIR TWISTED PAIR REMOVED Figure 10. Connection Method #2 − LS Current Sense Resistor on Power Board www.onsemi.com Arrow.com.
  • Page 10 EVB. A voltage−isolated adhesive heatsink attached to the EVB top will aid in reducing the GaN power switch temperatures. Figure 12 shows the positioning of a heatsink. Figure 12. NCP51810 HB GaN Driver EVB and Heatsink www.onsemi.com Arrow.com.
  • Page 11 AND DEAD−TIME (DT) EN Function and External Control dead−time, anti−cross−conduction protection is The NCP51810 GaN Driver EN is internally pulled low enabled. If HIN and LIN are overlapping by X ns, to SGND, so the driver is always defaulted to a disabled then X ns of dead−time is automatically inserted.
  • Page 12 More typically operates. The goal of this EVB is to easily enable information on GaN driver PCB design and layout the evaluation of the NCP51810 GaN driver, mating it with techniques are available at Semiconductor/NCP51810.
  • Page 13: Additional Information

    onsemi, , and other names, marks, and brands are registered and/or common law trademarks of Semiconductor Components Industries, LLC dba “onsemi” or its affiliates and/or subsidiaries in the United States and/or other countries. onsemi owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of onsemi’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf.

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