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ON Semiconductor NCP51705SMDGEVB User Manual

ON Semiconductor NCP51705SMDGEVB User Manual

Mini smd evaluation board

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NCP51705SMDGEVB
NCP51705 Mini SMD
Evaluation Board
User's Manual
NCP51705 SiC Driver SMD Evaluation
Board for Existing or New PCB Designs
Purpose
This document describes the use and applications for the NCP51705
SiC driver mini SMD EVB. The EVB is designed on a four layer PCB
and includes the NCP51705 driver and all the necessary drive
circuitry. The EVB also includes an on−board digital isolator and the
ability to solder any MOSFET or SiC MOSFET in a TO−247 high
voltage package. The EVB does not include a power stage and is
generic from the point of view that it is not dedicated to any particular
topology. It can be used in any low−side or high−side power switching
application. For bridge configurations two or more of these EVBs can
be configured in a totem pole type drive configuration. The EVB can
be considered as an isolator+driver+TO−247 discrete module.
NCP51705 Description
The NCP51705 driver is designed to primarily drive SiC MOSFET
transistors. To achieve the lowest possible conduction losses, the
driver is capable of delivering the maximum allowable gate voltage to
the SiC MOSFET device. By providing high peak current during
turn−on and turn−off, switching losses are also minimized. For
improved reliability, dv/dt immunity and even faster turn−off, the
NCP51705 can utilize its on−board charge pump to generate a user
selectable negative voltage rail. For full compatibility and to minimize
the complexity of the bias solution in isolated gate drive applications
the NCP51705 also provides an externally accessible 5 V rail to power
the secondary side of digital or high speed optical isolators. The
NCP51705 offers important protection functions such as
under−voltage lockout monitoring for the bias power and thermal
shutdown based on the junction temperature of the driver circuit.
Internal simplify block diagram can be seen in Figure 2. More detailed
information about all blocks could can be found in datasheet.
© Semiconductor Components Industries, LLC, 2018
April, 2019 − Rev. 2
EVAL BOARD USER'S MANUAL
Figure 1. Evaluation Board Photo
1
www.onsemi.com
Publication Order Number:
EVBUM2590/D

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Summary of Contents for ON Semiconductor NCP51705SMDGEVB

  • Page 1 NCP51705SMDGEVB NCP51705 Mini SMD Evaluation Board User's Manual NCP51705 SiC Driver SMD Evaluation www.onsemi.com Board for Existing or New PCB Designs EVAL BOARD USER’S MANUAL Purpose This document describes the use and applications for the NCP51705 SiC driver mini SMD EVB. The EVB is designed on a four layer PCB and includes the NCP51705 driver and all the necessary drive circuitry.
  • Page 2: Protection Logic

    NCP51705SMDGEVB SVDD 5V REG DESAT / 25 mA CURRENT 22 DESAT/CS SENSE UVSET UVLO 5V_OK VDD_OK PROTECTION LOGIC VEE_OK OUTSRC DRIVER INPUT LOGIC OUTSRC LOGIC IN− & LEVEL OUTSNK SHIFT OUTSNK CHARGE PUMP CPCLK 16 PGND SGND CHARGE PUMP POWER STAGE PGND Figure 2.
  • Page 3 CAP, SMD, CERAMIC, 25V, X7R RS1MWF Diode, Fast, 1A, 1000V, Std. Rec. Vishay SOD123F MBR0540 Diode, Shottky, 40V, 500mA, 510mV ON Semiconductor SOD−123 90122−0762 CON. 8P, RA, 266mil Mate, 114mil Post. Molex Thru−Hole 10081031 Header, 3 pin, 5.08mm Spacing Molex Thru−Hole...
  • Page 4 NCP51705SMDGEVB Table 1. NCP51705 SMD MINI BOARD BOM NCP51705 SiC Driver, Single, 6A, Single, MLP4x4−24 ON Semiconductor MLP ADuM142E1WBRQZ Digital Isolator, RF, 4−Channel Analog Devices QSOP−16 PCB Assembly and Layers is approximately the width of a TO*247 body. The length Figure 5 and Figure 6 shows the top and bottom assembly of the boards can be reduce by cutting the board if 90°...
  • Page 5 NCP51705SMDGEVB Table 2. I/O CONNECTORS DESCRIPTIONS Ref Def Name GND Ref Type Description Value [V] J1.1 XGND Power Primary Plated Hole Ground J1.2 XVDD Power Primary Plated Hole Positive primary power supply 5 V (Note 1) J1.3 XGND Power Primary...
  • Page 6 NCP51705SMDGEVB 10. Solder the other end of the PWM input (flying 12. Solder flying leads for bias voltage to the lead) to IN+ for non−inverting PWM applications NCP51705. Note that J3 are across the isolation or IN− for inverting PWM applications.
  • Page 7 NCP51705SMDGEVB Heatsink TO247 TO247 Heatsink Main PCB Figure 8. NCP51705 SMD Mini Board Installations Mounting into New PCB Design The NCP51705, SiC Driver mini SMD EVB can also be Figure 9, shoulder pins with appropriate flange are one used as an isolator+driver+TO−247 “driver module” that option that can be used as mounting pins between mini SMD can be integrated into a new PCB design.
  • Page 8 NCP51705SMDGEVB Figure 10. NCP51705 SiC EVB PCB Hole Pattern Testing without Installing into a PCB The NCP51705, SiC Driver mini SMD EVB can also be into the TO−247 holes as shown in Figure 9. Alternatively, tested without installing into a main PCB. However, since a TO−247 SiC MOSFET can also be soldered in place for Q1...
  • Page 9 NCP51705SMDGEVB Figure 11. Test Configuration of EVB without Installing into Main PCB section ‘UVSET’ but VEE is fixed at 80% of the VEE UVLO The EVB is preconfigured for VEE = 0 V. Operating the regulate value. If desired, the NCP5170 internal VEE charge...
  • Page 10 NCP51705SMDGEVB Figure 12. Normal Operation for Turn−on and Turn−off desat Figure 13. DESAT Functionality Test www.onsemi.com...
  • Page 11 NCP51705SMDGEVB desat Figure 14. Normal Operation including DESAT Pin Figure 15. Reaction of XEN Pin on DESAT Fault State www.onsemi.com...
  • Page 12 LIMITATIONS OF LIABILITY: ON Semiconductor shall not be liable for any special, consequential, incidental, indirect or punitive damages, including, but not limited to the costs of requalification, delay, loss of profits or goodwill, arising out of or in connection with the board, even if ON Semiconductor is advised of the possibility of such damages. In no event shall ON Semiconductor’s aggregate liability from any obligation arising out of or in connection with the board, under any theory of liability, exceed the purchase price paid for the board, if any.

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