Fibocom L716-LA Hardware Manual
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Fibocom L716-LA Hardware Manual

Fibocom L716-LA Hardware Manual

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L716-LA
Hardware Guide
V1.5

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Summary of Contents for Fibocom L716-LA

  • Page 1 L716-LA Hardware Guide V1.5...
  • Page 2 Contact Information Website: https://www.fibocom.com Address: 10/F-14/F, Block A, Building 6, Shenzhen International Innovation Valley, Dashi First Road, Xili Community, Xili Subdistrict, Nanshan District, Shenzhen Tel: 0755-26733555 Safety Instructions Do not operate wireless communication products in areas where the use of radio is not recommended without proper equipment certification.

  • Page 3: Table Of Contents

    4.4 USB ..........................27 4.5 UART ..........................28 4.6 SPI ........................... 30 4.7 I2C ........................... 31 4.8 SDIO ..........................31 4.9 RMII ..........................33 4.10 PCM ..........................34 4.11 SIM ..........................35 4.12 ADC ..........................40 Copyright © Fibocom Wireless Inc.
  • Page 4 7.1 Physical Appearance ....................63 7.2 Physical Indicator ......................63 7.3 PCB ..........................64 8 Storage Manufacture Packaging ..............66 8.1 Storage .......................... 66 8.2 SMT ..........................67 8.3 Packaging........................67 Appendix A: Reference Documents .............. 71 Copyright © Fibocom Wireless Inc.
  • Page 5 Contents Appendix B: Acronyms and Abbreviations ........... 72 Appendix C: Certification Statement ............74 Copyright © Fibocom Wireless Inc.

  • Page 6: Applicable Models

    Applicable Models Applicable Models No. Applicable Model Description CAT4, 128Mb FLASH, 256Mb DDR, LA band, MAIN+DIV ANT, L716-LA 2/3/4G, Standard model Copyright © Fibocom Wireless Inc.

  • Page 7: Change History

    Add module type and IO reset value V1.3 (2022-9-26) Add module type and USB description V1.2 (2022-7-21) Add module type and modify WAKEUP_IN default voltage state V1.1 (2022-5-19) Add module type and power consumption V1.0 (2022-3-15) Initial version Copyright © Fibocom Wireless Inc.

  • Page 8: Foreword

    Combined with the reference documents provided by Fibocom, customers can quickly design and debug the wireless part of the circuit. 1.2 Reference standard This product is designed with reference to the following standards: 3GPP TS 51.010-1 V10.5.0：Mobile Station（MS）conformance specification;...
  • Page 9 1 Foreword 3GPPTS27.005 V10.0.1：Use of Data Terminal Equipment -Data Circuit terminating  Equipment （DTE - DCE）interface for Short Message Service（SMS）and Cell Broadcast Service （CBS） Universal Serial Bus Specification 2.0  Copyright © Fibocom Wireless Inc.

  • Page 10: Product Overview

    2 Product Overview 2 Product Overview 2.1 Product Introduction The L716-LA series product support LTE/WCDMA/GSM network systems. It is a highly integrated wireless communication module and can be widely used in security monitoring, power, industrial routing, CPE and MIFI scenarios.
  • Page 11 LTE TDD: 130Mbps DL/30.5Mbps UL (Cat 4) Uplink: BPSK/Downlink: QPSK WCDMA mode HSDPA+: 21Mbps DL (Cat 14)/HSUPA: 5.76Mbps UL (Cat 6) GSM&GPRS: GMSK, EDGE: 8-PSK GSM mode GPRS: 85.6kbps DL/85.6kbps UL (multi-slot class 12) EDGE(E-GPRS): 236.8kbps DL/236.8kbps UL (multi-slot class 12) Copyright © Fibocom Wireless Inc.

  • Page 12: Hardware Architecture

    Storage temperature: –40℃ to +90℃ The module application terminal store in certain temperature conditions. Modules may not operate properly or may be damaged beyond this range. 2.3 Hardware Architecture The hardware of the L716-LA product includes: Copyright © Fibocom Wireless Inc.

  • Page 13: Adp & Evb Description

     Antenna 2.4 ADP & EVB Description In order to help customers develop applications with L716-LA module, Fibocom supplies an evaluation board to control or test the module. For more details, please refer to Fibocom_L716_Series_Evaluation Board User Guide and Fibocom_EVB-LGA-F01_User Guide.

  • Page 14: Pin Definition

    3 Pin Definition 3 Pin Definition 3.1 Pin Distribution The L716-LA module adopts LCC+LGA packaging with a total of 144 pins, including 80 LCC pins and 64 LGA pins. The pin distribution is shown in the following figure. Figure 2. Pin distribution...

  • Page 15: Pin Details

    PU: Pull up PD: Pull down Voltage Indicates the power domain the port is in. Description The detailed meaning of the pin and the handling when not in use. “*” indicates that the function is in development. Copyright © Fibocom Wireless Inc.
  • Page 16 Reset Power Pin Name Description Value Domain External device wakeup module, active WAKEUP_IN 1.8V low by default, configurable by software Module flight mode control, pulled up W_DISABLE# 1.8V by default, low level enables the module Copyright © Fibocom Wireless Inc.
  • Page 17 Pin Name Description Domain Value DBG_RXD 1.8V Debug serial port receiving DBG_TXD 1.8V Debug serial port transmitting (U)SIM data signal line, external pull-up USIM_DATA 1.8 V/3V is required USIM_CLK 1.8 V/3V (U)SIM clock signal line Copyright © Fibocom Wireless Inc.
  • Page 18 SPI clock signal C clock signal (pulled up inside the I2C_SCL 1.8V module) C data signal (pulled up inside the I2C_SDA 1.8V module) Analog-to-digital conversion 1 (1k ADC1 0V–5V resistor in series is recommended to Copyright © Fibocom Wireless Inc.
  • Page 19 USB differential data signal+ USB_DM USB differential data signal- 3.3~5.2 USB_VBUS USB plugin detection, typical 5V 113 PHY_RST 3.3V PHY restart 114 PHY_INT 3.3V PHY interrupt 116 PHY_WAKE 3.3V PHY wakeup DIG_26M_OU 1.8V 26M clock output Copyright © Fibocom Wireless Inc.
  • Page 20 133 SD0_CLK 1.8V SDIO clock line 134 SD0_CMD 1.8V SDIO control line 135 WLAN_WAKE 1.8V WLAN wakeup 136 WLAN_EN 1.8V WLAN enable COEX_UART_R 1.8V Coexisting serial port receiving 138 COEX_UART_T 1.8V Coexisting serial port transmitting Copyright © Fibocom Wireless Inc.
  • Page 21 Pin Name Description Domain ANT_DIV Diversity antenna ANT_MAIN Main antenna Table 8. Reserved interface Power Pin No. Pin Name Description Domain 2、3、55、73、140、 RESERVED Reserved 143、144 RESERVED (L716-CN-70/80/85 43、47、74、75、 and L716-LA-00) Reserved 77~81、83、84、128 NC (other type) Copyright © Fibocom Wireless Inc.

  • Page 22: Application Interfaces

    If the power supply capacity is insufficient, the power supply voltage drops instantly, which may cause the module power- off or restart. The following figure shows the power supply limit. Copyright © Fibocom Wireless Inc.
  • Page 23 Assuming that VBAT is the power pin of the module, and the reference design is shown in the following figure. Figure 4. Power supply circuit reference design Design description: Table 11. Design description Design Consideration Mode Recommended Parameter Copyright © Fibocom Wireless Inc.

  • Page 24: Power Output

    The power output interfaces of the module are described in the following table. Table 12. Module power interfaces DC Parameter Pin No. Pin Name Description Minimum Typical Maximum Value (V) Value (V) Value (V) VDD_EXT_1V8 PO 1.62 1.98 Digital 1.8V level, Copyright © Fibocom Wireless Inc.

  • Page 25: Power-On/Off

    PWRKEY pin be at least 30ms, and that the PWRKEY pin be pulled down for at least 3s. One way is to use OC/OD driver circuit to control the PWRKEY pin. The reference circuit is shown in the following figure. Copyright © Fibocom Wireless Inc.
  • Page 26 The AT command does not apply to auto power-on. Power-off modes: Hardware power-off: Pull down the PWRKEY pin for 2.5s to power off the module. Software power-off: Power off the module through the AT+CPWROFF command, only applicable to non-master control module. Copyright © Fibocom Wireless Inc.

  • Page 27: Reset

    4.3 Reset Background information The module can be reset to the initial state. The module can be reset by hardware and software. Hardware reset  Hardware reset control sequence is shown in the following figure. Copyright © Fibocom Wireless Inc.
  • Page 28 RESET_N pin can be controlled using the OC/OD driver circuit or a button. Figure 10. Reference circuit of OC/OD driver reset Figure 11. Reference circuit of button control reset Software reset  AT+CFUN=15 Copyright © Fibocom Wireless Inc.

  • Page 29: Usb

    EMI. In order to meet that signal integrity requirement of the USB data line, a common mode choke and a 0R resistor are placed close to the module, and the TVS is prevent the module from being damaged by static electricity, the interface circuit design is as follows. Copyright © Fibocom Wireless Inc.

  • Page 30: Uart

    If the USB function is not used, suggest reserve test points for easy log capture. Need to ensure that the VBUS signal connected to 5V power supply, if VBUS signal floating, USB port can't normal operation. 4.5 UART Background information Copyright © Fibocom Wireless Inc.
  • Page 31 The following figures show the reference circuit design of the serial port level conversion circuit. Figure 13. UART_TXD level conversion reference circuit Copyright © Fibocom Wireless Inc.

  • Page 32: Spi

    The following figure shows the circuit design of the level conversion chip. Figure 15. Reference circuit of level conversion chip 4.6 SPI The module provides a set of general SPI interfaces to communicate with devices that Copyright © Fibocom Wireless Inc.

  • Page 33: I2C

    The module provides two groups of SDIO interfaces and supports SDIO 3.0 protocol. 2.8V SD card is recommended for SD1, and 1.8V SD card is not supported. SD0 supports master mode only and is often used to connect peripheral WIFI devices. Copyright © Fibocom Wireless Inc.
  • Page 34 Schematic diagram design SD1 reference circuit design is shown in the following figure. Figure 16. SD1 reference circuit design SD0 reference circuit design is shown in the following figure. Figure 17. SD0 reference circuit design PCB design Copyright © Fibocom Wireless Inc.

  • Page 35: Rmii

    Supports IEEE 802.3 and adapts to 10Mbps/100Mbps RMII interface, and uses RMII  interface Ethernet PHY for communication. Supports full-duplex/half-duplex operation mode.  Supports transmission channel flow control operation.  Supports optional MDIO Master interface to realize the configuration and management  Copyright © Fibocom Wireless Inc.

  • Page 36: Pcm

    European E1 standard in China and the coding of 16-bit/32-bit linear format. PCM_SYNC works at 8 KHz (488 ns). Module serves as master, supporting PCM as slave. Schematic diagram design The reference circuit is shown in the following figure. Copyright © Fibocom Wireless Inc.

  • Page 37: Sim

    It is recommended to use (U)SIM card slot with hot plug detection function. Without detection signal: it does not support the detection of SIM card insertion and pull-out. Refer to the following design for normally closed SIM card slot. Copyright © Fibocom Wireless Inc.
  • Page 38 When SIM card is pulled out, CD and SW are opened, and USIM_PRESENCE pin is at a high level. When SIM card is inserted, CD and SW are shorted, and USIM_PRESENCE pin is at a Copyright © Fibocom Wireless Inc.
  • Page 39 SIM card to drop abnormally. The filter capacitor and ESD device of SIM signal cable are placed close to the SIM card  slot. Less than 11pF capacitor is recommended for ESD device. Copyright © Fibocom Wireless Inc.
  • Page 40 SIM card hot plug function is enabled by default, if the function is not used, it is recommended to choose one of the following operation 1. Disabled by running the AT+MSMPD=0 command 2. Disable hot plug function by default on software 3. Pull-up USIM_PRESENCE by 47KΩ resistor to VDD_EXT_1V8 Copyright © Fibocom Wireless Inc.
  • Page 41 Pay attention to the design of the ground, especially the connectivity of SIM card, ◦ module and the system ground. Fully ground each layer of PCB and increase holes to enhance the EMC performance ◦ of the system. Copyright © Fibocom Wireless Inc.

  • Page 42: Adc

    ADC voltage range is from 0V to 5V, sampling rate is 5KHz, sampling accuracy is 5/4096(V). When using the ADC function, a 1KΩ resistor in series is recommended to enhance ESD protection. Use the AT+CBC command to query the current VBAT voltage value. Copyright © Fibocom Wireless Inc.

  • Page 43: Status Indicator

    Speed flash (75 ms high level/75 ms low level) Established a data connection Low level Voice call High Sleep Schematic diagram design The reference circuit of network status indicators is shown in the following figure. Copyright © Fibocom Wireless Inc.

  • Page 44: Flight Mode

    Send AT+GTFMODE=1 to open the flight mode control function. The module is in normal mode when the W_DISABLE# pin is pulled up or disconnected (pull-up by default), and the module enters flight mode when the pin is pulled down. Software control:  Copyright © Fibocom Wireless Inc.

  • Page 45: Sleep Mode

    WAKEUP_IN pin and enters sleep mode at high level. X=1: Level wake-up. The module enters wakeup mode when pulling up the ◦ WAKEUP_IN pin and enters sleep mode at low level. WAKEUP_IN pin is pulled down by default. Software control:  Copyright © Fibocom Wireless Inc.
  • Page 46 2s, and the setting will not be saved after power failure of the module. The system supports automatic sleep. The time from standby to sleep can be configured through software. The module can be waked up by sending an AT command through the main serial port. Copyright © Fibocom Wireless Inc.

  • Page 47: Antenna Interfaces

    The antenna interface configuration of L716 series product is the same. During laboratory test, please select the correct antenna according to the tested frequency band for connection. For other support, please contact FAE of Fibocom. 5.2 RF Band Table 14. RF band and frequency range...

  • Page 48: Rf Antenna

    In addition, the RF cable connecting the antenna, and the position of the fixed antenna also may affect antenna performance. Add a shield cover on the DCDC device or keep DCDC device away from the module antenna, Copyright © Fibocom Wireless Inc.

  • Page 49: Antenna Reference Design

    (H). The control of the characteristic impedance of the PCB is usually in two ways: microstrip line and coplanar waveguide. To illustrate the design principles, the following figures show the structural designs of microstrip route and coplanar waveguide Copyright © Fibocom Wireless Inc.
  • Page 50 Complete structure of microstrip line  Figure 24. Two-layer PCB microstrip line structure Complete structure of coplanar waveguide  Figure 25. Two-layer PCB coplanar waveguide structure Figure 26. Four-layer PCB coplanar waveguide structure (refer to ground layer 3) Copyright © Fibocom Wireless Inc.
  • Page 51 RF performance; the distance between the ground hole and the signal line should be at least 2 times the line width (2 x W). The equivalent capacitance of TVS shall be less than 0.5pF.  Copyright © Fibocom Wireless Inc.

  • Page 52: Factors Affecting Antenna Performance

    Therefore, this kind of component should have a good grounding to eliminate or reduce secondary radiation. 5.3.5 Antenna Design Requirements The design requirements of antenna are shown in the following table: Copyright © Fibocom Wireless Inc.
  • Page 53 Design requirement VSWR ≤ 2 Efficiency > 30% Gain: 1dBi Maximum input power: 50W Input impedance: 50Ω GSM/UMTS/LTE Polarization: Vertical Line loss (insertion loss): < 1Db: LB（< 1GHz） < 1.5Db: MB（1~2.3GHz） < 2Db: HB（> 2.3GHz） Copyright © Fibocom Wireless Inc.

  • Page 54: Electrical Characteristics

    Table 17. Power consumption Power Parameter Standard Test Condition (VBAT=3.8V) Consumption (mA) Power on without turn module on Shutdown PWRKEY control module shutdown 0.011 leakage current AT control module shutdown AT+CFUN=4 Flight sleep sleep mode ATS24=3 Copyright © Fibocom Wireless Inc.
  • Page 55 DRX=8 (USB sleep) WCDMA DRX=8 (USB wakeup) IDLE Paging cycle #256 frames (USB sleep) LTE FDD Paging cycle #256 frames (USB wakeup) Paging cycle #256 frames (USB sleep) LTE TDD Paging cycle #256 frames (USB wakeup) Copyright © Fibocom Wireless Inc.
  • Page 56 EDGE Data transfer DCS1800; PCL=2; MCS9 1Rx/4Tx EDGE Data transfer DCS1900; PCL=2; 1Rx/4Tx WCDMA Data transfer Band 1 @+23.5dBm 680 WCDMA WCDMA Data transfer Band 2 @+23.5dBm TBD WCDMA-RMS WCDMA Data transfer Band 3 @+23.5dBm TBD Copyright © Fibocom Wireless Inc.

  • Page 57: Transmitting Power

    10% is normal. 6.3 Transmitting power The maximum transmit power refers to the power at the antenna pin at the ambient temperature of 25°C. Users should fully consider the insertion loss on the RF path when Copyright © Fibocom Wireless Inc.
  • Page 58 10 MHz Bandwidth, 1 RB Band 7 23.5±2 10 MHz Bandwidth, 1 RB Band 8 23.5±2 10 MHz Bandwidth, 1 RB Band 28 23.5±2 10 MHz Bandwidth, 1 RB Band 66 23.5±2 10MHz Bandwidth，1 RB Copyright © Fibocom Wireless Inc.

  • Page 59: Receiving Sensitivity

    WCDMA Band 4 BER < 0.1% -106 Band 5 –109 BER < 0.1% -104 Band 8 –109.5 BER < 0.1% -103 Band 1 –100.5 10 MHz Bandwidth -96.3 LTE FDD Band 2 10MHz Bandwidth -94.3 Copyright © Fibocom Wireless Inc.

  • Page 60: Esd

    The allowable ESD discharge range of the module is as follows (temperature: 25 ℃, relative humidity: 40%): Table 20. ESD indicator Test Point Air Discharge (kV) Contact Discharge (kV) Copyright © Fibocom Wireless Inc.

  • Page 61: Reliability

    Corner test and low voltage, six groups of combinations, each combination running test for 24 hours. Temperature shock 90/-45℃, 200C Frequency range: (200～2000)Hz, PSD = 0.04g /Hz, 1 Random vibration hour for each X/Y/Z axis. Copyright © Fibocom Wireless Inc.

  • Page 62: Thermal Design

    Sweep frequency: 0.5 Octave/min, linear; 2H per axis; Salt spray test Neutral salt spray, 48H 6.7 Thermal Design 6.7.1 Main Board Main board design suggestions: Increase PCB size, and keep the module away from other heat source devices. Copyright © Fibocom Wireless Inc.

  • Page 63: Product Structure

    6.7.2 Product Structure Recommendations for product structure: Reduce the distance between module and heat sink and shell. Thermal conductive material thickness should not exceed 3 mm. The thermal conduction path is shown in the following figure. Copyright © Fibocom Wireless Inc.
  • Page 64 Place the heat sink above the module. Allow direct contact between the heat sink and thermal conductive material on the module if the heat sink can be exposed to the product surface. Consider convection if the product has cooling holes. Copyright © Fibocom Wireless Inc.

  • Page 65: Structural Specifications

    7 Structural Specifications 7 Structural Specifications 7.1 Physical Appearance The appearance of the L716-LA series module is shown in the following figures. Figure 32. Top view Figure 33 Bottom view 7.2 Physical Indicator The structural size of the module is shown in the following figure.

  • Page 66: Pcb

    7.3 PCB The following figure shows the PCB package size of the module, and the user can design the PCB package. At the same time, Fibocom also provides users with the designed "Fibocom_L716_V3T_Package", which can be found in the document...
  • Page 67 7 Structural Specifications Figure 1. PCB Package（unit: mm） Copyright © Fibocom Wireless Inc.

  • Page 68: Storage Manufacture Packaging

     Failure to complete production or storage in accordance with clause 3 above after unpacking of the module;  Air leakage in vacuum packaging and bulk materials;  Before module repair. 5. Baking of modules:  Baking at 120 ±5 °C for 8 hours; Copyright © Fibocom Wireless Inc.

  • Page 69: Smt

    8.2 SMT Module steel mesh design, solder paste and furnace temperature control please refer to FIBOCOM L716 SMT Application Design Notes 8.3 Packaging The module adopts tape packaging, so that the storage, transportation and the usage of the module can be protected to the greatest extent.
  • Page 70 3. Before vacuumizing, place 3 bags of desiccant and a humidity card above the tape, and paste the label of the carrier tape. 4. Put the whole into a vacuum bag and vacuumizing. 5. Put the vacuum electrostatic bag into a white box, only one electrostatic Copyright © Fibocom Wireless Inc.
  • Page 71 7. Seal the top of the outer box in an I-shape, paste an outer box label in the rectangular frame on the side, and paste a box sealing label on the top and bottom of the outer box respectively. Tape size Tape size:  Figure 36. Carrier tape size Reel size:  Copyright © Fibocom Wireless Inc.
  • Page 72 8 Storage Manufacture Packaging Figure 37. Reel size Copyright © Fibocom Wireless Inc.

  • Page 73: Appendix A: Reference Documents

    Document Software Fibocom_L716_Series_AT_Commands_User_Manual Fibocom_L716_V3T_Package Fibocom_L716_3D Module Diagram Hardware Fibocom_L716_V3T_Series_Reference_design Fibocom_L716_V3T_Customer SCH&PCB Design Checklist Fibocom_L716_ Compatibility Design Guide Fibocom_L716 Series Evaluation Board User Guide Development Fibocom_EVB-LGA-F01_User Guide Fibocom_L716_SMT Application Design Notes Other Fibocom_ Thermal Design Guide Copyright © Fibocom Wireless Inc.

  • Page 74: Appendix B: Acronyms And Abbreviations

    Frequency Division Duplexing Front End Module GPRS General Packet Radio Service Global Standard for Mobile Communications Low Dropout Regulator Long Term Evolution MIFI Mobile WIFI Inter Integrated Circuit Printed Circuit Board Pulse Code Modulation Power Manager Unit Copyright © Fibocom Wireless Inc.
  • Page 75 Reduced Media Independent Interface SDIO Secure Digital Input and Output Subscriber Identification Module Serial Peripheral Interface Time Division Duplexing UART Universal Asynchronous Receiver Transmitter Universal Serial Bus WCDMA Wideband Code Division Multiple Access WLAN Wireless Local Area Network Copyright © Fibocom Wireless Inc.

  • Page 76: Appendix C: Certification Statement

    RF radiation, maximum antenna gain (including cable loss) must not exceed: FCC Max Antenna Gain（dBi） Antenna Type Band GSM850 1.32 GSM1900 1.92 WCDMA BII 1.92 Dipole WCDMA BIV 2.86 WCDMA BV 1.32 LTE B2 1.92 LTE B4 2.86 Copyright © Fibocom Wireless Inc.
  • Page 77 FCC ID of the module is visible; then an additional permanent label referring to the enclosed module: “Contains Transmitter Module FCC ID: ZMOL716LA” or “Contains FCC ID: Copyright © Fibocom Wireless Inc.
  • Page 78 Part 15B unintentional radiator requirements. Copyright © Fibocom Wireless Inc.

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