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User Guide - COMh-sdIL (E2)
COMh-sdIL (E2)
Rev 1.0
www.kontron.com

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Summary of Contents for Kontron COMh-sdIL E2

  • Page 1 User Guide - COMh-sdIL (E2) COMh-sdIL (E2) Rev 1.0 www.kontron.com...
  • Page 2 User Guide - COMh-sdIL (E2) This page has been intentionally left blank // 2 www.kontron.com...
  • Page 3 Kontron with respect to technical processes described in the user guide or any product characteristics set out in the user guide. Kontron assumes no responsibility or liability for the use of the described product(s), conveys no license or title under any patent, copyright or mask work rights to these products and makes no representations or warranties that these products are free from patent, copyright or mask work right infringement unless otherwise specified.
  • Page 4: Intended Use

    (collectively, “high risk applications”). You understand and agree that your use of Kontron devices as a component in High Risk Applications is entirely at your risk. To minimize the risks associated with your products and applications, you should provide adequate design and operating safeguards.
  • Page 5: Revision History

    Kontron sells products worldwide and declares regional General Terms & Conditions of Sale, and Purchase Order Terms & Conditions. Visit www.kontron.com/terms-and-conditions. For contact information, refer to the corporate offices contact information on the last page of this user guide or visit...
  • Page 6: Symbols

    Eye protection per manufacturer notice shall review before servicing. This symbol indicates general information about the product and the user guide. This symbol also indicates detail information about the specific product configuration. This symbol precedes helpful hints and tips for daily use. // 6 www.kontron.com...
  • Page 7: For Your Safety

    Therefore, in the interest of your own safety and of the correct operation of your new Kontron product, you are requested to conform with the following guidelines.
  • Page 8: General Instructions On Usage

    General Instructions on Usage In order to maintain Kontron’s product warranty, this product must not be altered or modified in any way. Changes or modifications to the product, that are not explicitly approved by Kontron and described in this user guide or received...
  • Page 9: Table Of Contents

    3.4.13. SMBus ............................... 32 3.5. Features ................................ 32 3.5.1. ACPI Power States ..........................32 3.5.2. Embedded Controller - Hardware Monitor ..................32 3.5.3. Trusted Platform Module ........................32 3.5.4. Watchdog ............................33 3.5.5. Real-Time Clock (RTC) ......................... 33 // 9 www.kontron.com...
  • Page 10 3.7. Thermal Management ..........................36 3.7.1. Heatspreader Plate Assembly ......................36 3.7.2. Active/Passive Cooling Solutions ......................37 3.7.3. Operating with Kontron Heatspreader Plate (HSP) Assembly ............37 3.7.4. Operating without Kontron Heatspreader Plate (HSP) Assembly ............37 3.7.5. Temperature Sensors ......................... 37 3.7.6.
  • Page 11: List Of Tables

    Table 2: COM-HPC® Server and COMh-sdIL (E2) functionality..................17 Table 3: Product Number for Industrial Grade Modules (-40°C to +85°C) ..............18 Table 4: Cooling Equipment for COMh-sdIL (E2) available from Kontron ..............18 Table 5: Evaluation Carrier ............................18 Table 6: Technical Data ...............................
  • Page 12: List Of Figures

    Figure 5: Module Temperature Sensor ........................38 Figure 6: Module Dimensions ............................. 39 Figure 7: Module and Carrier Height with 5 and 10mm connector height ..............40 Figure 8: COM-HPC Interface Connectors ........................42 Figure 9: Setup Menu Selection Bar ..........................52 // 12 www.kontron.com...
  • Page 13: 1/ General Safety Instructions

    Only connect the product to an external power supply providing the voltage type (AC or DC) and the input power (max. current) specified on the Kontron Product Label and meeting the requirements of the Limited Power Source (LPS) and Power Source (PS2) of UL/IEC 62368-1 .
  • Page 14: Electrostatic Discharge (Esd)

    – as stipulated by EN62368-1 or VDE0100 or EN60204 or UL61010-1 regulations. For the General Safety Instruction in German or French, visit Kontron’s product web page> Downloads> Manuals> General Safety Instructions. 1.1. Electrostatic Discharge (ESD) A sudden discharge of electrostatic electricity can destroy static-sensitive devices or micro-circuitry.
  • Page 15 Do not dispose of lithium batteries in general trash collection. Dispose of the lithium battery according to the local regulations dealing with the disposal of these special materials, (e.g. to the collecting points for dispose of batteries). // 15 www.kontron.com...
  • Page 16: 2/ Product Introduction

    2.4. COM-HPC® Server Functionality All Kontron COM-HPC® Server modules are popolated two 400-pin connectors, each has 4 rows called A to D on connector J1 and row E to H on connector J2. The COM-HPC® Server Computer-on-Module features the following maximum amount of interfaces according to the PICMG module pinout type.
  • Page 17: Com-Hpc® Benefits

    COM-HPC® defines a Computer-On-Module (COM), with all the components necessary for a bootable host computer, packaged as a highly integrated computer. All Kontron COM-HPC® modules are very compact and feature a standardized form factor and a standardized connector layout that carry a specified set of signals. Each COM module is based on the COM-HPC®...
  • Page 18: 3/ Product Specification

    Kontron Sales Representative or Kontron Inside Sales. 3.2.1. Cooling A standard heat spreader solutions can be used, which are available in a threaded and non-threaded (through hole) version. Table 4: Cooling Equipment for COMh-sdIL (E2) available from Kontron Kontron PN Product Name Description...
  • Page 19: Functional Specification

    Commercial temperature: 0 °C to +60 °C operating, -30 °C to +85 °C non-operating Industrial temperature: -40 °C to +80 °C operating, -30 °C to +85 °C non-operating Humidity 93 % relative Humidity at 40 °C, non-condensing (according to IEC 60068-2-78) // 19 www.kontron.com...
  • Page 20: Block Diagram

    Embedded Controller PCIe x1 1x USB 3.0 1x SATA NVMe Power UART GPIO Sequencing 1x SATA #0,#1 PwrCtrl eSPI GSPI Sy sMgmt COM-HPC® connector J1– Pin-out Server Standard Connector Option component Figure 1: COMh-sdIL (E2) Block Diagram // 20 www.kontron.com...
  • Page 21: Top Side

    4. Four mounting holes - for heatspreader to module, module to carrier mounting 2. COM-HPC connector J2 5. Soldered memory - populated for 64GB 3. Four mounting holes - for heatspreader memory capacity mounting to module backplate (Kontron specific) // 21 www.kontron.com...
  • Page 22: Processor (Cpu)

    Compute 2400 1.7/1.7 For this processor family the Dynamic Temperature Range (DTR) behavior applies. DTR is the temperature range the processor can operate in. The temperature range starts with the temperature of the processor (Tj = junction www.kontron.com...
  • Page 23: System Memory

    The behavior is described in Intel whitepaper 814861 as DTR = Dynamic Temperature Range and in Intel document #595914, which is not public. Please contact Kontron Support for further information. Table 8: DTR Table Extended Temp: Commercial Temp: CPU Use Condition...
  • Page 24: Interfaces

    The integrated SoC PCH supports 24x HSIO lanes #0-23 (HSIO) which can be configured as PCIe Gen 3.0 lanes with up to 3 RPC (Root Port Controller), 4 RP (Root Port) per RPC (12 RPs max). The HSIO PCIe lanes are partly multiplexed with USB3.0 and SATA. Further information see Chapter 3.3.7 High-Speed Interface Overview // 24 www.kontron.com...
  • Page 25: Usb

    To realize a COM-HPC USB 3.2 Gen 1, Gen 2, Gen 2×2 or USB4 port, one of the four available USB 2.0 ports from the USB[0:3] pool must be used along with the SuperSpeed pins. The COMh-sdIL (E2) supports 4x USB 3.0 ports // 25 www.kontron.com...
  • Page 26: Sata

    HSIO lane #16 of the integrated SoC PCH is used as PCIe Gen 3.0 lane for the onboard 1/2.5 GbE Controller Intel i226 (see Chapter 3.3.7 High-Speed Interface Overview). The Intel® Xeon® D-1700/D-1800 processor family supports up to two integrated PHY Quads with 1G/2.5G/10G/25G/40G rates. // 26 www.kontron.com...
  • Page 27: Table 14: D-1700/D-1800 Ethernet Mac Configurations

    With CEI the Ethernet sideband and control signals are serialized in order to reduce the overall required signals between the module and the carrier. The carrier is to de-serialize these signals using small, low cost I2C based I/O expanders. Details are presented in the COM-HPC Carrier Board Design Guide. // 27 www.kontron.com...
  • Page 28: Table 15: Mapping Of Com-Hpc Server Specification To Cei Interface

    ETH4 on up In general the COMh-sdIL (E2) can support the LAN configurations - enabled by different LEK (LAN Enabling Kit) files - which are aligned with the CEI interface. These are overall described in the following table // 28 www.kontron.com...
  • Page 29: Graphics Interface

    Disabled 100G The COMh-sdIL (E2) is preconfigured with LAN-Enabling-Kit LEK-CFG 7.0 supporting 4 ports. For other configurations please contact Kontron Support. Please get familiar with Intel documents #631178 and #645149. 3.4.5. Graphics Interface A COM-HPC Server module doesn't support graphic interfaces.
  • Page 30: General Purpose Spi Interface

    Carrier Module Boot External Module Carrier Boot Do not use Carrier Module Do not use Carrier Module Do not use Carrier Module Do not use Carrier Module Do not use Carrier Module Do not use Carrier Module // 30 www.kontron.com...
  • Page 31: Espi

    The COMh-sdIL (E2) offers 12 GPIO pins on the dedicated pins of COM-HPC®. The type of termination resistor used sets the direction of the GPIO; where GPI terminations are pull-up resistors, and GPO terminations are pull-down resistors. // 31 www.kontron.com...
  • Page 32: Smbus

    The EC is accessible through the API in the Board Support Package. 3.5.3. Trusted Platform Module The COMh-sdIL (E2) supports a TPM chip which is directly connected to a dedicated SPI interface from the // 32 www.kontron.com...
  • Page 33: Watchdog

    (SMM). As such, specific BIOS code handles the interrupt. The current BIOS handler for the watchdog SMI currently does nothing. For special requirements, contact Kontron Support A system control interrupt (SCI) is a OS-visible interrupt to be handled by the OS using AML code...
  • Page 34: Boot Eeprom

    To protect external power lines of peripheral devices, make sure that the wires have the right diameter to withstand the maximum available current and the enclosure of the peripheral device fulfils the fire-protection requirements of IEC/EN 62368-1. // 34 www.kontron.com...
  • Page 35: Power Management

    If power is removed, the wake-up event (S0) requires 12V VCC to power on the module for normal operation. 3.6.2.2. Power Supply Control Signals Power supply control settings are set in the BIOS and enable the module to shut down, reset and wake from standby. // 35 www.kontron.com...
  • Page 36: Thermal Management

    USB devices on the Carrier that are to be active in S5 / S3 / S0 should not have their 5V supply applied before RSMRST_OUT# goes high. RSMRST_OUT# shall be a 3.3V CMOS Module output, active in all power states. 3.7. Thermal Management 3.7.1. Heatspreader Plate Assembly A heatspreader plate assembly is available from Kontron for the COMh-sdIL (E2). // 36 www.kontron.com...
  • Page 37: Active/Passive Cooling Solutions

    Both active and passive thermal management approaches can be used with the heatspreader plate. The optimum cooling solution depends on the aaplication and environmental conditions. Kontron's active or passive cooling solutions are designed to cover the power and thermal dissipation for a commercial temperature range used in housing with a suitable airflow.
  • Page 38: On-Module Fan Connector

    Figure 5: Module Temperature Sensor 3.7.6. On-Module Fan Connector The module's fan connector powers, controls and monitors an external fan. To connect a standard 3-pin connector fan to the module, use Kontron's fan cables: KAB-HSP 200 mm (96079-0000-00-0) KAB-HSP 400 mm (96079-0000-00-2) Position of the fan connector see Chapter 3.3.3...
  • Page 39: Mechanical Specification

    PCB board to the top of the heatspreader. The overall height of the module and carrier board depends on: which carrier board connectors are used (5mm and 10mm height are available) which cooling solution is used. The height of the cooling solution is not specified in the COM-HPC specification // 39 www.kontron.com...
  • Page 40: Heatspreader Plate Assembly Dimension

    3.10. Compliance The COMh-sdIL complies with the following or the latest status thereof. If modified, the prerequisites for specific approvals may no longer apply. For more information, contact Kontron Support Europe and Asia Kontron Table 32: Compliance CE Mark Europe - CE Mark...
  • Page 41: Mtbf

    Kontron is not responsible for any radio television interference caused by unauthorized modifications of the delivered product or the substitution or attachment of connecting cables and equipment other than those specified by Kontron. The correction of interference caused by unauthorized modification, substitution or attachment is the user’s responsibility.
  • Page 42: 4/ Com-Hpc Interface Connector

    The enclosure of the peripheral device fulfills the fire-protection requirements of IEC/EN 62368. 4.2. J1 and J2 Signals The type of an interface pin consists of the pin type and the buffer type. // 42 www.kontron.com...
  • Page 43: Connector J1 - Primary

    Main Supply Input Ground WD_STROBE# In - 10K PU (3.3V S0) BATLOW# In - 10K PU (3.3V S5) WD_OUT Out – 10K PD PLTRST# Out – Push-Pull Ground Ground USB5- Not Connected USB7- Not Connected USB5+ Not Connected // 43 www.kontron.com...
  • Page 44 HSIO Transmit PCIe12_RX+ HSIO Receive PCIe12_TX+ HSIO Transmit Ground Ground PCIe13_RX- HSIO Receive PCIe13_TX- HSIO Transmit PCIe13_RX+ HSIO Receive PCIe13_TX+ HSIO Transmit Ground Ground PCIe14_RX- HSIO Receive PCIe14_TX- HSIO Transmit PCIe14_RX+ HSIO Receive PCIe14_TX+ HSIO Transmit Ground // 44 www.kontron.com...
  • Page 45: Pins C1 - C100 / D1 - D100

    HSIO Transmit / 100nF series USB2_SSRX- HSIO Receive USB2_SSTX+ HSIO Transmit / 100nF series USB2_SSRX+ HSIO Receive Ground Ground USB1_SSTX0- HSIO Transmit / 100nF series USB1_SSRX0- HSIO Receive USB1_SSTX0+ HSIO Transmit / 100nF series USB1_SSRX0+ HSIO Receive Ground // 45 www.kontron.com...
  • Page 46: Connector J2 - Secondary

    Bi – 2K2 PU (1.8V S5) NBASET0_LINK_MAX# Out – Push-pull NBASET0_SDP Bi – No Termination (3.3V S5) NBASET0_LINK_MID# Out – Push-pull NBASET0_CTREF 1uF to Ground NBASET0_LINK_ACT# Out – Push-pull TYPE1 Ground TYPE2 Not connected 4.4. Connector J2 - Secondary // 46 www.kontron.com...
  • Page 47: Pins E1 - E100 / F1 - F100

    HSIO Receive PCIe20_TX- HSIO Transmit / 100nF series PCIe20_RX+ HSIO Receive PCIe20_TX+ HSIO Transmit / 100nF series Ground Ground PCIe21_RX- HSIO Receive PCIe21_TX- HSIO Transmit / 100nF series PCIe21_RX+ HSIO Receive PCIe21_TX+ HSIO Transmit / 100nF series Ground // 47 www.kontron.com...
  • Page 48: Pins G1 - G100 / H1 - H100

    RSVD Not connected RSVD Not connected RSVD Not connected RSVD Not connected RSVD Not connected Ground RSVD Not connected RSVD Not connected RSVD Not connected RSVD Not connected RSVD Not connected RSVD Not connected RSVD Not connected // 48 www.kontron.com...
  • Page 49 PCIe58_TX- Not connected PCIe58_RX- Not connected PCIe58_TX+ Not connected PCIe58_RX+ Not connected Ground Ground PCIe59_TX- Not connected PCIe59_RX- Not connected PCIe59_TX+ Not connected PCIe59_RX+ Not connected Ground Ground PCIe60_TX- Not connected PCIe60_RX- Not connected PCIe60_TX+ Not connected // 49 www.kontron.com...
  • Page 50 In – 2K2 PU (3.3V S5) ETH0-3_MDIO_CLK Out – 2K2 PU (3.3V S5) – Shared ETH4-7 ETH0-3_INT# In – 2K2 PU (3.3V S5) ETH0-3_MDIO_DAT Bi – 2K2 PU (3.3V S5) – Shared ETH4-7 PCIe_WAKE_OUT0# Not connected PCIe_WAKE_OUT1# Not connected // 50 www.kontron.com...
  • Page 51: 5/ Uefi Bios

    5/ UEFI BIOS 5.1. Starting the UEFI BIOS The COMh-sdIL (E2) uses a Kontron-customized, pre-installed and configured version of AMI Aptio® V BIOS based on the Unified Extensible Firmware Interface (UEFI) specification and the Intel® Platform Innovation Framework for EFI.
  • Page 52: Getting Help

    5.5. UEFI Shell The Kontron UEFI BIOS features a built-in and enhanced version of the UEFI Shell. For a detailed description of the available standard shell scripting, refer to the EFI Shell User Guide. For a detailed description of the available standard shell commands, refer to the EFI Shell Command Manual.
  • Page 53: Uefi Shell Scripting

    1. Initially searches for Kontron flash-stored startup script. 2. If there is no Kontron flash-stored startup script present, then the UEFI-specified startup.nsh script is used. This script must be located on the root of any of the attached FAT formatted disk drive.
  • Page 54: 6/ Technical Support

    RMA number. The buyer accepts responsibility for all freight charges for the return of goods to Kontron's designated facility. Kontron will pay the return freight charges back to the buyer's location in the event that the equipment is repaired or replaced within the stipulated warranty period. Follow these steps before returning any product to Kontron.
  • Page 55 User Guide - COMh-sdIL (E2) Include the RMA-Number with the shipping paperwork and send the product to the delivery address provided in the RMA form or received from Kontron RMA Support. // 55 www.kontron.com...
  • Page 56: 7/ Storage And Transportation

    The storage facility must meet the products environmental storage requirements as stated within this user guide. Kontron recommends keeping the original packaging material for future storage or warranty shipments.
  • Page 57: About Kontron

    User Guide - COMh-sdIL (E2) About Kontron Kontron is a global leader in IoT/Embedded Computing Technology (ECT) and offers individual solutions in the areas of Internet of Things (IoT) and Industry 4.0 through a combined portfolio of hardware, software and services.

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