Quectel AF51Y Hardware Design page 7

4.1. General Description ................................................................................................................. 32
4.2. Electrical Characteristics .......................................................................................................... 32
4.3. I/O Interface Characteristics .................................................................................................... 33
4.4. Current Consumption ............................................................................................................... 34
4.5. RF Performances ..................................................................................................................... 35
4.5.1. Conducted RF Output Power ........................................................................................ 35
4.5.2. Conducted RF Receiving Sensitivity ............................................................................. 36
4.6. Electrostatic Discharge ............................................................................................................ 37
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Mechanical Dimensions ................................................................................................................... 38
5.1. Mechanical Dimensions of the Module .................................................................................... 38
5.2. Recommended Footprint ......................................................................................................... 40
5.3. Top and Bottom Views of the Module ...................................................................................... 41
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Storage, Manufacturing and Packaging ......................................................................................... 42
6.1. Storage ..................................................................................................................................... 42
6.2. Manufacturing and Soldering ................................................................................................... 43
6.3. Packaging ................................................................................................................................ 44
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Worning .............................................................................................................................................. 46
7.1. Important Notice to OEM integrators ....................................................................................... 46
7.2. FCC Statement ........................................................................................................................ 47
7.3. IC Statement ............................................................................................................................ 48
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Appendix References ....................................................................................................................... 49
AF51Y_Hardware_Design
Wi-Fi&Bluetooth Module Series
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