Table of Contents
Advertisement
USER'S NOTICE
COPYRIGHT OF THIS MANUAL BELONGS TO THE MANUFACTURER. NO PART OF THIS
MANUAL, INCLUDING THE PRODUCTS AND SOFTWARE DESCRIBED IN IT MAY BE
REPRODUCED, TRANSMITTED OR TRANSLATED INTO ANY LANGUAGE IN ANY FORM OR
BY ANY MEANS WITHOUT WRITTEN PERMISSION OF THE MANUFACTURER.
THIS MANUAL CONTAINS ALL INFORMATION REQUIRED TO USE NF6100-400 / 405 PPC
MOTHERBOARD AND WE DO ASSURE THIS MANUAL MEETS USER'S REQUIREMENT BUT
WILL CHANGE, CORRECT ANY TIME WITHOUT NOTICE. MANUFACTURER PROVIDES THIS
MANUAL "AS IS" WITHOUT WARRANTY OF ANY KIND, AND WILL NOT BE LIABLE FOR ANY
INDIRECT, SPECIAL, INCIDENTIAL OR CONSEQUENTIAL DAMAGES (INCLUDING
DAMANGES FOR LOSS OF PROFIT, LOSS OF BUSINESS, LOSS OF USE OF DATA,
INTERRUPTION OF BUSINESS AND THE LIKE).
PRODUCTS AND CORPORATE NAMES APPEARING IN THIS MANUAL MAY OR MAY NOT.2
BE REGISTERED TRADEMARKS OR COPYRIGHTS OF THEIR RESPECTIVE COMPANIES, AND
THEY ARE USED ONLY FOR IDENTIFICATION OR EXPLANATION AND TO THE OWNER'S
BENEFIT, WITHOUT INTENT TO INFRINGE.
Manual Revision Information
Reversion
Revision History
2.0
Second Edition
Item Checklist
AMD 780G/780V Platform Processor Chipset based motherboard
Cable for IDE
CD for motherboard utilities
Cable for Serial ATA IDE Port
AMD 780G/780V Platform Processor Chipset motherboard User's Manual
Kuroshio Promotion Card
AMD K8 Processor Family
Cooling Solutions
As processor technology pushes to faster speeds and higher performance with increasing operation
clock, thermal management becomes increasingly crucial while building computer systems. Maintaining
the proper computing environment without thermal increasing is the key to reliable, stable, and 24
hours system operation. The overall goal is keeping the processor below its specified maximum case
temperature. Heatsinks induce improved processor heat dissipation through increasing surface area
and concentrated airflow from attached active cooling fans. In addition, interface materials allow
effective transfers of heat from the processor to the heatsink. For optimum heat transfer, AMD
recommends the use of thermal grease and mounting clips to attach the heatsink to the processor.
Please refer to the website below for collection of heatsinks evaluated and recommended for
Socket-AM2+ processors by AMD. In addition, this collection is not intended to be a comprehensive
listing of all heatsinks that support Socket-AM2+ processors.
For vendor list of heatsinks and Active cooling fans, please visit：
http://www.amd.com/us-en/Processors/DevelopWithAMD/0,,30_2252_869_9460^9515,00.html
Date
May 2008
iii
Advertisement
Table of Contents
