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Motorola i425e Detailed Service Manual

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Detailed Service Manual
Detailed Test Procedures
425e
425t
290
Digital Multi-Service,
Data-Capable Portable

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Summary of Contents for Motorola i425e

  • Page 1 Detailed Service Manual Detailed Test Procedures 425e 425t Digital Multi-Service, Data-Capable Portable...
  • Page 2 This Page is left Blank intentionally...
  • Page 3 & 425t 425e Digital Multi-Service, Data-Capable Portable Detailed Service Manual Detailed Test Procedures August 2007...
  • Page 4 The Motorola products described in this manual may include Motorola computer programs stored in semiconductor memories or other media that are copyrighted with all rights reserved worldwide to Motorola. Laws in the United States and other countries preserve for Motorola, Inc. certain exclusive rights to the copyrighted computer programs, including the exclusive right to copy, reproduce, modify, decompile, disassemble, and reverse-engineer the Motorola computer programs in any manner or form without Motorola’s prior written consent.
  • Page 5 If you wear a radio product on your body when transmitting, always place the radio Your phone contains a transmiter and receiver. When it is ON, it receives and product in a Motorola approved clip, holder, holster, case or body harness. If you transmits RF energy. When you communicate with your phone, the system do not use a body-worn accessory supplied or approved by Motorola and are not handling your call controls the power level at which your phone transmits.
  • Page 6 S A F E T Y A N D G E N E R A L I N F O R M A T I O N Approved Accessories Operational Warnings Obey all posted signs when using mobile devices in public areas. For a list of approved Motorola accessories call 1 -800-453-0920, or visit our website at www.motorola.com/iden. Potentially Explosive Atmospheres...
  • Page 7 If you have experienced seizures or blackouts, or if you have a family history of customer care options. You can also contact the Motorola Customer Support such occurrences, please consult with your physician before playing video...
  • Page 8 If your battery or mobile device has • Remove the battery and inspect it to confirm that it been subjected to such damage, take it to a Motorola bears a Motorola “Original Equipment” hologram; Authorized Service Center before using. Do not •...

  • Page 9: Model Information

    M O D E L I N F O R M A T I O N MODEL INFORMATION This manual applies to the following iDEN Digital Portable models: i425 = H98XAH6JR5AN iDEN: 806- 940 MHz/ Multi-Service, Data-Capable Portable i290 = H98XAH6JR4AN iDEN: 806- 940 MHz/ Multi-Service, Data-Capable Portable MODEL NUMBERING SYSTEM H 9 8 X A H 6 J R 4 A N Typical Model Number:...

  • Page 10: Model Specifications

    MODEL SPECIFICATIONS MODEL SPECIFICATIONS TRANMITTER GENERAL RECEIVER i425 FCC # IHDT56HH1 Direct Conversion Receiver Type Transmitter Type Single Conversion i290 FCC # IHDT56HG1 Frequency Range 851-870 MHz Frequency Range 806-825 MHz Operational Modes Phone 935-940 MHz 896-901 MHz Private Group Circuit Data Packet Data 902-928 MHz...

  • Page 11: Preface

    PREFACE The i425/i290 Digital Multi-Service, Data-Capable Portable Field Service Manual contains the information necessary to identify and fix problems in the Motorola i425/i290 Digital Portable. This unit is based on digital technology and is designed to operate on iDEN systems.
  • Page 12 PREFACE: Conventions Used in This Manual Conventions Used in This Manual The following conventions are used throughout this manual: Used for emphasis and new terms italics Defines menu items, fields, and buttons b o l d Used for sample input and output c o d e Related Publications The following publications are available separately:...

  • Page 13: Table Of Contents

    CONTENTS SAFETY AND GENERAL INFORMATION ..........v MODEL INFORMATION ................ix MODEL SPECIFICATIONS ..............x PREFACE ....................xi CONTENTS ....................xiii Chapter 1 ....................17 iDEN Digital Modulation Technology..................17 iDEN Voice Compression Technology ..................19 iDEN Power Management......................20 Digital Section ..........................21 1.4.1 Patriot Processor ............................ 22 1.4.2 MCU Digital Phase Locked Loop (DPLL) ....................
  • Page 14 Battery Cover, Battery, and SIM Card Removal ..................42 2.4.3 Opening Unit and removing the Keypad Board ..................43 2.4.4 Removing Display and Main Board .......................44 i425e and i425t Assembly Procedure ..................45 2.5.1 Main Board Inspection ...........................45 2.5.2 Back Housing Inspection........................46 2.5.3...
  • Page 15 3.14 Reference Oscillator Test......................94 3.15 DC Distribution (V2) Test ......................96 3.16 DC Distribution (V3) Test ......................97 3.17 DC Distribution (V4) Test ......................98 3.18 DC Distribution (4.5V Pre-Regulator) Test ................99 3.19 DC Distribution (V_VIB) Test ....................100 3.20 DC Distribution (VUSB) Test....................
  • Page 16 APPENDIX A ..................139 A.1 Customer Service ..........................139 A.2 Replacement Parts .......................... 139 A.3 Domestic Orders ..........................139 A.4 International Orders ........................139 A.5 Replacement Kits ..........................140 A.6 Recommended Test Equipment and Tools................... 141 A.7 Recommended Programming Equipment ..................142 6880401P26-O...

  • Page 17: Chapter 1

    OVERVIEW: iDEN Digital Modulation Technology Chapter 1 iDEN SYSTEM OVERVIEW iDEN Digital Modulation Technology The Integrated Digital Enhanced Network or iDEN of the i425/i290 operates in multiple modes: phone, private, data, and group; and uses two digital modulation technologies: Quad QAM, and Time Division Multiple Access (TDMA). Quadrature Amplitude Modulation (QAM) is a modulation technique that transmits information by altering the amplitude and phase of the radio frequency (RF) signal.
  • Page 18 OVERVIEW: iDEN Digital Modulation Technology Time Division Multiple Access (TDMA) is used to allocate portions of the RF signal by dividing time into 6 slots, one for each unit. Time allocation enables each unit to transmit its voice information without interference from another unit’s transmission.

  • Page 19: Iden Voice Compression Technology

    OVERVIEW: iDEN Digital Modulation Technology iDEN Voice Compression Technology Voice is converted into a digital bit stream by sampling the voice signal at a high rate and converting the samples into numbers, which are represented by bits. A sample consists of 8 bits. Approximately 8000 samples per second (64 Kbps) are required to maintain a reasonable quality.

  • Page 20: Iden Power Management

    OVERVIEW: iDEN Digital Modulation Technology iDEN Power Management The Roadrunner IC is a 223 I/O MAP BGA integrated circuit (IC) and provides the following DC distribution for the i425: • V1 – 1.55 VDC. The V1_LDO is intended to power the external FLASH and SDRAM memories in a Zeus-based platform, and the INDY core itself in a low tier platform.

  • Page 21: Digital Section

    OVERVIEW: iDEN Digital Modulation Technolo he Roadrunner IC is designed to support the needs of po rtable iDEN cellular telephone products. It rovides the necessary control and regulator functions. The following functions are provided: • Turn on control signals to pro perly activate the unit •...

  • Page 22: Patriot Processor

    OVERVIEW: iDEN Digital Modulation Techn ology 1.4.1 Patriot Processor he Patriot Dual-Core Baseband Processor (U802) integrates a reduced instruction-set computer ISC) microprocessor unit (MCU) and a general-purpose DSP on a single chip (See Figure 5) Figure 5: Patriot Functional Block Diagram 6880401P26-O...

  • Page 23: Mcu Digital Phase Locked Loop (Dpll)

    OVERVIEW: iDEN Digital Modulation Technology The following summarizes the key PATRIOT features: • RISC integer processor capable of running at 52 MHz at Vco re of 1.55 V DC, a 32-bit RISC architecture, high performance and high code density • ONYX 56600 DSP core running up to 133 MHz at Vcore of 1.55 VDC •...

  • Page 24: Patriot Digital Signal Processor

    OVERVIEW: iDEN Digital Modulation Technology 1.4.4 PATRIOT Digital Signal Processor The P T A RIOT SPS 56600 digital signal processor contains the DSP Engine S_ONYXU, which is capable of executing an instruction on every clock cycle. The DSP56600 consists of the following: •...

  • Page 25: Iden Transceiver Architecture

    OVERVIEW: iDEN Digital Modulation Technology iDEN Transceiver Architecture he i425/i290 radio is capable of iDE N 800 MHz and 900 MHz operation. The block diagram of e transceiver is shown in Figure 6. Figure 2 iDEN Transceiver Block Diagram he RX and TX front end consisting of the RF switches, SAW filters, LNA, RX balun, TX output stage (including the TX balum, power amplifier, low-pass filter, and antenna swi tch).

  • Page 26: Iden Tx Path

    OVERVIEW: iDEN Digital Modulation Technology iDEN TX Path The iDEN TX lineup consists of the Patriot/Bravo processor, Roadrunner for baseband D/A onversion, SledgeHammer IC for analog baseband to RF, and JANUS IC providing PA mplification for transmission. Balun Figure 3 iDEN TX Path 6880401P26-O...

  • Page 27: Roadrunner

    OVERVIEW: iDEN Digital Modulation Technology 1.6.1 ROADRUNNER ROADRUNNER IC includes th e following blocks: RX Blocks: • ADC and Digital Filtering X Blocks: • Digital interface The transmitter receives inputs from the SSI. The SSI has a sin gle data line.

  • Page 28: Balun

    OVERVIEW: iDEN Digital Modulation Technology .6.3 BALUN he differential RF signal is converted to a traditional single-ended (unbalanced) signal through e balance/unbalance circuitry. The balun is implemented using multilayer ceramic technolog .6.4 RF Power Amplifier Module The signal is then routed to the RF PA. The RF PA will be enabled when the ASW line goes low The PA gain can be adjusted by the PA_BIAS_DAC from Roadrunner ADC.

  • Page 29: Cartesian Feedback

    OVERVIEW: iDEN Digital Modulation Technology .6.5 Cartesian Feedback The iDEN transmitters require a highly linear PA with wide dynamic range. Linear PAs are highly inefficient, so a Class AB PA is used for better efficiency and longer battery life. The Class AB PA is fairly linear, but can cause splatter in the RF spectrum around the transmitted frequency band.
  • Page 30 OVERVIEW: iDEN Digital Modulation Technology The Javelin level set circuit topology was modified slightly for Sledgehammer. The modification removed itches used to select the I-channel training waveform to the Q-channel V-I input. The current level-set circuitry contains a programmable gain V-I on the I channel for boosting the reference signal level durin level training.

  • Page 31: Iden Receiver Path

    OVERVIEW: iDEN Digital Modulation Technology iDEN Receiver Path he receiver is a direct conversion receiver. It operates in the commercial portion of the nd-mobile receiver band (851-870MHz and 935-940). It also operates in the ISM band 02-928MHz) using the MOTOTALK protocol. Figure 10 iDEN Receiver Path The receiver takes an incoming RF signal, down-converts it to baseband where it is amplified, filtered, digitized and then provided to...

  • Page 32: Roadrunner Ic (Rx Path)

    OVERVIEW: iDEN Digital Modulation Technology 1.7.3 Roadrunner IC (RX Path) The Roadrunner IC performs the digital conversion, digital filtering, and the AGC control of the dio. The main function of the IC, from an RX perspective is the A/D conversion performed by the Sigma Delta converter.

  • Page 33: Mototalk [Available Only On I290]

    OVERVIEW: iDEN Digital Modulation Technolo Reference Oscillator The 33.6 MHz referen ce is sourced to Sledgehammer to serve as a stable and accurate 33.6 MHz reference frequency for the internal synthesizers. This 33. 6 MHz reference signal is additionally routed ROADRUNNER IC and is frequency divided down to a 4.2 MHz to serve as a reference for JANUS (TCLK).
  • Page 34 OVERVIEW: iDEN Digital Modulation Technology The asynchronous nature of MOTOtalk requires a constant scan of frequencies for an indication (known as preamble) of an upcoming transmission. Frequency scanning is further complicated by frequency hopping of the spread spectrum operation. Frequency hopping spread spectrum is used to provide both interference avoidance, and a powerful combination of time and frequency diversity.
  • Page 35 OVERVIEW: iDEN Digital Modulation Technolog The 902 - 928 MHz band is broken up into 10 hop-sets of 50 carriers, each separated by 50 kHz for a sub-total of (500 carriers x 50 kHz) = 25 MHz, plus two 500 kHz guard bands yielding a to f 26 MHz.
  • Page 36 This Page Left Blank Intentionally 6880401P26-O...

  • Page 37: Chapter 2

    Consider the following information to create a proper ground: • Ground the working surface of your service bench. If possible, use the Motorola Static Protection Assembly (P/N 01803 86A82) to ground your service bench. This assembly contains a wrist strap, two ground cords, a table mat, and a floor mat •...

  • Page 38: Using Rss

    PREPARING FOR FIELD LEVEL TESTING: Preparing Equipment for Testing Refer to Service and Repair Note SRN-F 1052 for more information. This note is available through: Motorola Literature Distribution Center 2290 Hammond Drive Schaumburg, IL 60173 847-576-2826 The following should be considered when storing or transporting a circuit board: •...
  • Page 39 PREPARING FOR FIELD LEVEL TESTING: Preparing Equipment for Testing 5.0 to 12.0 Vdc Power Supply Figure 7.2 Ensure the unit is powered off, and then turn on the R-2660. Remove the antenna from the unit. See page 7-6 for instructions. Remove the battery cover and battery from the unit, and insert the reference SIM card.

  • Page 40: Operating The R-2660

    PREPARING FOR FIELD LEVEL TESTING: Preparing Equipment for Testing Operating the R-2660 Most of the technician tests performed with the R-2660 Communications System Analyzer require that the analyzer use the Initial Registration test mode. To enter Initial Registration mode: 1. Turn on the R-2660. 2.

  • Page 41: I425E And I425T Disassembly Procedure

    PREPARING FOR FIELD LEVEL TESTING: i290 Disassembly Procedure i425e and i425t Disassembly Procedure Motorola recommends the service technician follow a prescribed disassembly sequence to access specific items or components of the unit. This product is an efficiently designed package that incorporates the physical overlap and integration of some modular components.

  • Page 42: Battery Cover, Battery, And Sim Card Removal

    PREPARING FOR FIELD LEVEL TESTING: Battery Cover, Battery, and SIM Card Removal 2.4.2 Battery Cover, Battery, and SIM Card Removal Remove Battery Cover. Preparation: Place Unit face down, insert finger nail between Lanyard Holder and Battery Cover. Lift Battery cover off of unit. Lift battery out of unit as a shown Push SIM card from the back as a shown.

  • Page 43: Opening Unit And Removing The Keypad Board

    PREPARING FOR FIELD LEVEL TESTING: Disassembly/ Opening Housing 2.4.3 Opening Unit and removing the Keypad Board Tools Required: T-6 Torx bit, Black Stick, and a Pair of Plastic tweezers Remove six (6) Torx screws from the back housing. Separate the Front Housing gently from the Back Housing Use the flat end of the black stick to disengage the keypad board from the main board in the corner shown.

  • Page 44: Removing Display And Main Board

    PREPARING FOR FIELD LEVEL TESTING: Disassembly/Assembly Board Removal 2.4.4 Removing Display and Main Board Tools Required: Black stick Using Tweezers remove the Kapton tape from the Display connector and using the black stick unlock and remove Display flex from the Main Board. Remove the two Torx screws holding the Main Board.

  • Page 45: I425E And I425T Assembly Procedure

    PREPARING FOR FIELD LEVEL TESTING: Assembly Procedure i425e and i425t Assembly Procedure 2.5.1 Main Board Inspection Inspect the main board for the proper placement for the following parts. Verify that the parts are not damaged, bent or defective. Audio Jack...

  • Page 46: Back Housing Inspection

    PREPARING FOR FIELD LEVEL TESTING: Back Housing Inspection 2.5.2 Back Housing Inspection Inspect the back housing for damage or chipped paint 1. Ensure the transducer is placed properly 2. Ensure visible rib holes in the back housing 3. Check placement of serial number label and FCC label The transducer housing is at proper The two posts of the transducer housing must location.

  • Page 47: Keypad Board And Popple Installation

    PREPARING FOR FIELD LEVEL TESTING: Keypad Board and Popple Installation 2.5.3 Keypad Board and Popple Installation Equipment& Tool: Main Keypad Press Fixture # 130-1069 Inspect the keypad for print quality; ensure there are no defects 1. Check the placement of the 4 contact fingers for proper placement Check for the Kapton tape. 2.

  • Page 48: Keypad And Display Preparation

    PREPARING FOR FIELD LEVEL TESTING: Keypad and Display Preparation 2.5.4 Keypad and Display Preparation Equipment& Tool: LCD bend press fixture: 130-1204 1. Apply 1 Poron Pad onto the keypad. Note: Inspect the 5 silk print on the LCD flex 2. Fold the LCD flex silk between #2 and #3 lines. 3.

  • Page 49: Assembly Of Display And Keypad Board

    PREPARING FOR FIELD LEVEL TESTING: Assembly of Display and Keypad Board 2.5.5 Assembly of Display and Keypad Board Tools Required 1. Connect the Display flex to the Main board Ziff connector 2. Using a pair of tweezers apply the Kapton tape to the 21 pin ZIF connector. 3.

  • Page 50: Assembly Of Front Housing

    PREPARING FOR FIELD LEVEL TESTING: Assembly of Front Housing 2.5.6 Assembly of Front Housing Tools Required: Popple Fixture 1. Inspect the front housing for any scratches, nicks, spot and paint defect. 2. Inspect for the two posts should insert through holes of the felt and the transducer felt is not damaged. 3.

  • Page 51: Closing The Unit

    PREPARING FOR FIELD LEVEL TESTING: Assembly of Main Board to Back Housing 2.5.7 Closing the Unit 1. Press the Front Cover to the unit till is snapped. 2. Place the unit in screw nest fixture. 3. Place 6 screws on the unit in correct order. 4.

  • Page 52: I290 Disassembly Procedure

    PREPARING FOR FIELD LEVEL TESTING: i290 Disassembly Procedure i290 Disassembly Procedure Motorola recommends the service technician follow a prescribed disassembly sequence to access specific items or components of the unit. This product is an efficiently designed package that incorporates the physical overlap and integration of some modular components. Refer to the Disassembly Sequence Flowchart for a suggested path to reach specific components.

  • Page 53: Battery Cover, Battery, And Sim Card Removal

    PREPARING FOR FIELD LEVEL TESTING: Battery Cover, Battery, and SIM Card Removal 2.6.2 Battery Cover, Battery, and SIM Card Removal Remove Battery Cover. Preparation: Place Unit face down, push battery latch with finger nail toward the top of unit. Lift Battery cover off of the unit. Lift battery out of unit as a shown Push SIM card from the back as a shown.

  • Page 54: Opening Unit And Removing The Keypad Board

    PREPARING FOR FIELD LEVEL TESTING: Opening Unit and removing the Keypad Board 2.6.3 Opening Unit and removing the Keypad Board Tools Required: T-6 Torx bit, Black Stick, and a Pair of Plastic tweezers 1. Remove six (6) Torx screws from the back housing. 2.

  • Page 55: Removing Display And Main Board

    PREPARING FOR FIELD LEVEL TESTING: Removing Display and Main Board 2.6.4 Removing Display and Main Board Tools Required: Black stick & Tweezers Using Tweezers to remove the Kapton tape from the Display connector and use the black stick to unlock and remove Display flex from the Main board. Remove the two Torx screws holding the main board.

  • Page 56: I290 Assembly

    PREPARING FOR FIELD LEVEL TESTING: Main Board Inspection i290 Assembly 2.7.1 Main Board Inspection Audio Jack Main Board Connector Connector Label Sin Connector Connector Antenna Connector Water Indicator Stick the SIM label and the tape on the main board proper placement with the tweezers.

  • Page 57: Back Housing Inspection

    PREPARING FOR FIELD LEVEL TESTING: Back Housing Inspection 2.7.2 Back Housing Inspection Inspect the back housing for damage or chipped paint 1. Ensure the transducer is placed properly 2. Ensure visible rib holes in the back housing 3. Check placement of serial number label and FCC label The transducer housing is at proper The two posts of the transducer housing must location.

  • Page 58: Keypad Board And Keypad Installation

    PREPARING FOR FIELD LEVEL TESTING: Keypad Board and Keypad Installation 2.7.3 Keypad Board and Keypad Installation Equipment& Tool: Main Keypad Press Fixture # 130-1069 Inspect the keypad for print quality; ensure there are no defects 1. Check the placement of the 4 contact fingers for proper placement Check for the Kapton tape. 2.

  • Page 59: Keypad And Display Preparation

    PREPARING FOR FIELD LEVEL TESTING: Keypad and Display Preparation 2.7.4 Keypad and Display Preparation Equipment& Tool: LCD bend press fixture: 130-1204 Note: Inspect the 5 silk print on the LCD flex 1. Fold the LCD flex silk between #2 and #3 lines. 2.

  • Page 60: Assembly Of Display And Keypad Board

    PREPARING FOR FIELD LEVEL TESTING: Assembly of Display and Keypad Board 2.7.5 Assembly of Display and Keypad Board Tools Required Tweezers 1. Insert the display flex into Ziff connector on Main Board. 2. Lock the Ziff connector by closing the hinge door. 3.

  • Page 61: Assembly Of Front Housing

    PREPARING FOR FIELD LEVEL TESTING: Assembly of Front Housing 2.7.6 Assembly of Front Housing Tools Required: Tweezers 1. Inspect the front housing for any scratches, nicks, spot and paint defect. 2. Remove the Pad of the lens and ensure it is clean and has no scratches. 3.

  • Page 62: Closing The Unit

    PREPARING FOR FIELD LEVEL TESTING: Closing the Unit 2.7.7 Closing the Unit 1. Press the Front Cover to the unit until the snaps engage. 2. Place the unit into the screw nest fixture. 3. Place 6 screws on the unit in correct orderand torque to 1.4 -/+ 0.1 in-lbs.. 4.

  • Page 63: Chapter 3

    TROUBLESHOOTING: Digital Analysis Test Chapter 3 TROUBLESHOOTING Digital Analysis Test Use this test for troubleshooting the digital section. Apply 7.8V at J7 pin 4 (EMU_ID) Assert MOD, and then power on the unit. Check the voltages on the ROADRUNNER. Fail the unit drawing Check 32 kHz (CKIL).
  • Page 64 TROUBLESHOOTING: Digital Analysis Test Digital Analysis Test (Continued) Continued from previous Page Initialize the DSP. Fail the unit pass the Check for a Initialize DSP defective PATRIOT. test? Pass Load Setfiles to configure the chip selects. Fail the unit pass the Check for a Load Setfiles defective PATRIOT.
  • Page 65 TROUBLESHOOTING: Digital Analysis Test Digital Analysis Test (Continued) Continued from previous Page Did the Fail unit pass the 4M Test the Flash for the unit pass the x16 SRAM test all similar failure. Initialize DSP test? cells? Check the PATRIOT Pass and Main Board for opens or shorts.
  • Page 66 TROUBLESHOOTING: Digital Analysis Test Digital Analysis Test (Continued) Continued from previous Page Test the backlight by turning it on. Fail the backlight Replace or repair, turn on as needed. Pass Test the vibrator. Fail the vibrator Replace or repair, vibrate as needed.

  • Page 67: Lo Output Test

    TROUBLESHOOTING: LO Output Test LO Output Test Use this test on a unit with the following symptom: no RX. Note: Run the RX BER LO Frequency Range: RX Main VCO injection to 851.0125 Test before 1699.535 MHz to 1740 MHz (800 band) SLEDGEHAMMER.

  • Page 68: Rx Main Vco Test

    TROUBLESHOOTING: RX Main VCO Test RX Main VCO Test Use this test on a unit with the following symptom: no RX. Note: Run the RX BER 851.0125 Test before Using a high impedance probe on LO Frequency Range: 2x RX Freq. the spectrum analyzer, check the LO beginning this test.
  • Page 69 TROUBLESHOOTING: RX Main VCO Test RX Main VCO Test (Continued) Continued from previous Page Check that the voltage at R603 is between 0.5 and 2.1 Vdc. There is no issue with the control voltage. Fail Is the the voltage Fail Fail voltage between the voltage railed...

  • Page 70: Power-Up Test (V6, Filt_B+)

    TROUBLESHOOTING: Power-Up Test Power-Up Test (V6, FILT_B+) Note: The following are the DC power distribution voltages with their correct values and the appropriate location to check the voltages: _B+ (3.6 Vdc) @ M3 pin 1 battery contact VSIM (3.0 Vdc) @ C714 ilt_B+ (3.6 Vdc) @ C724 V1 (1.55 Vdc @ C707 Vdc) W2 (1.875 Vdc) @ C702...

  • Page 71: Keypad Failure Test

    TROUBLESHOOTING: Keypad Failure Test Keypad Failure Test. 6880401P26-O...

  • Page 72: Sledgehammer Test

    TROUBLESHOOTING: SLEDGEHAMMER Test SLEDGEHAMMER Test Use this test to check the SLEDGEHAMMER circuitry. Check L653 for 2.775 Vdc (V2-RX). Go to the Fail the voltage test flowcharts for at L653 voltage regulator correct ﾱ10% verification. Pass Is the Go to the Fail voltage at R669 test flowcharts for...
  • Page 73 TROUBLESHOOTING: SLEDGEHAMMER Test SLEDGEHAMMER Test (Continued) 1. In BERBUG, type the following: >rx static >mode rx (Ignore the message returned). 2. Check the voltage on C332 and C331. Is the Fail Remove U300, voltage at C332 and check ~ 0 Vdc and voltage at the voltage again.

  • Page 74: Rx Analysis Test

    TROUBLESHOOTING: RX Analysis Test RX Analysis Test 6880401P26-O...
  • Page 75 TROUBLESHOOTING: RX Analysis Test RX Analysis Test (Continued) At the antenna connector Abbreviations: M1, test for a -60 dBm US = Unsoldered components or connections (ﾱ1 dBm) 851.0125 MHz, MP = Missing parts 935.01875 MHz for 900 DFP = Defective parts Quad 16QAM signal.
  • Page 76 TROUBLESHOOTING: RX Analysis Test RX Analysis Test (Continued) Continued Abbreviations: from previous US = Unsoldered components or connections Page MP = Missing parts DFP = Defective parts Test 851.0125 MHz Fail Check U3004 (935.01875 MHz for US, MP, DFP, etc. 900) for -64 dBm at U3004 at Pin1 or C60060 Pass...
  • Page 77 TROUBLESHOOTING: RX Analysis Test RX Analysis Test (Continued) Continued Abbreviations: from previous US = Unsoldered components or connections Page MP = Missing parts DFP = Defective parts Fail Check C621, C622, R204, L204, C222 , C223, C623, C624, C221, R609 E602, C629, C630, C212, C213, voltages for S, US, MP, DFP.
  • Page 78 TROUBLESHOOTING: RX Analysis Test RX Analysis Test (Continued) Continued Abbreviations: from previous US = Unsoldered components or connections Page MP = Missing parts DFP = Defective parts Is voltage on Fail Check DC and Bravo section, TP_RX_AC then if no fault found replace the Q ~ 1.875V Bravo IC (U801).

  • Page 79: Tx Power Test

    TROUBLESHOOTING: TX Power Test TX Power Test Use this test to check the transmit power circuitry. Set the unit to the Open LoopPower Test at 813.5125 MHz or 898.51875 MHz. Is the Fail power level With the unit in the Open Loop Power Test, between 11 and measure the RF level at the PA input (C520) 24 dBm...

  • Page 80: Rf Pa Module Test

    TROUBLESHOOTING: RF PA Module Test RF PA Module Test Use this test to check the RF PA (Radio-Frequency Power Amplifier) circuitry. Note: Perform the Transmit Power Test before beginning the RF PA Module Test. Set the unit to the PA Gain Test at 813.5125 MHz or 898.51875 MHz.
  • Page 81 TROUBLESHOOTING: RF PA Module Test RF PA Module Test (Continued) Continued from previous Page Check U501 (RF PA Fail Module) power level pin 1, 5, and 15 for > 11 dBm (RAW B+). Pass Do the following: 1. Check U501 for bad solder connections.
  • Page 82 TROUBLESHOOTING: RF PA Module Test RF PA Module Test (Continued) Continued from previous Page Check U501 pin 16 with a scope for > 5.0 V during a TX slot. Fail the correct Check Q500 pin 2 for a voltage voltage present at of 5 V during a TX slot.

  • Page 83: Sledgehammer Tx Test

    TROUBLESHOOTING: SLEDGEHAMMER TX Test 3.10 SLEDGEHAMMER TX Test Do the following: 1. Set the unit to the Open Loop Power Test at 813.5125 MHz. 2. Measure the RF level at the PA input Do the following: Fail Measure the DC voltage the power level at L503.It should be equal >...
  • Page 84 TROUBLESHOOTING: SLEDGEHAMMER TX Test SLEDGEHAMMER TX Test (Continued) Continued from previous Page Do the following: 1. Remove the SLEDGEHAMMER shield. 2. Visually check all components and solder connections. 3. Check R507 for 2.795V dc. Measure the RF level at C312 (Main VCO Injection to SLEDGEHAMMER).
  • Page 85 TROUBLESHOOTING: SLEDGEHAMMER TX Test SLEDGEHAMMER TX Test (Continued) Continued Note: from previous Baseband modulation output is approx. 11 Hz Page at 1.77V dc offset during the TX slot Is the Fail Signal 770 mVp-p during the TX slot? Pass With the oscilloscope measure REFCLK_IN to Using the SLEDGEHAMMER at TP_REFCLK_IN_SL test Oscilloscope, verify DMCS...

  • Page 86: Earpiece Speaker Test

    TROUBLESHOOTING: Earpiece Speaker Test 3.11 Earpiece Speaker Test Use this test on a unit with the following symptom: no earpiece speaker audio. Reconnect back housing flex connector. Check earpiece speaker contacts for 1.38 Vdc and an audio signal of 1 kHz at approx.
  • Page 87 TROUBLESHOOTING: Earpiece Speaker Test Earpiece Speaker Test (Continued) Continued Abbreviations: from previous US = Unsoldered components or connections Page MP = Missing parts DFP = Defective parts Check E782 , C771, Is the C471, R471 for Correct voltage and Fail missing parts, defective Signal present at parts, shorts, US, MP,...

  • Page 88: High Audio Speaker Test

    TROUBLESHOOTING: High Audio Speaker Test 3.12 High Audio Speaker Test Use this test on a unit with the following symptoms: no high speaker audio Measure the resistance across the speaker contacts Replace Fail the speaker resistance back housing approx. 8 assembly.
  • Page 89 TROUBLESHOOTING: High Audio Speaker Test High Audio Speaker Test (Continued) Continued from previous Page Measure the output of Filter Plus and Gnd, and between Filter Minus and Gnd. Outputs should be +,Gnd = 470 mVp -,Gnd =470 mVp Fail Fail Correct Voltage Correct Check continuity...
  • Page 90 TROUBLESHOOTING: High Audio Speaker Test High Audio Speaker Test (Continued) Continued from previous Page Check RX Clock test points for a digital signal. Are RX and Fail Clock signals Check PATRIOT correct? Pass Replace ROADRUNNER (U701) and retest. 6880401P26-O...

  • Page 91: Audio Loopback Level Test

    TROUBLESHOOTING: Audio Loopback Level Test 3.13 Audio Loopback Level Test Ensure that the microphone is properly soldered and that the microphone is present and properly seated. Place the unit in MA Test Mode, and proceed to the Earpiece Tone test. Go to the Fail there a...
  • Page 92 TROUBLESHOOTING: Audio Loopback Level Test (Continued) Audio Loopback Level Test Continued from previous Page Check continuity between VR701 and TP_MIC. Check L752, C751, C754, and VR701 Fail Is there for US, MP, DFP, etc. Also, check the continuity? trace from L752 to MIC_+. Pass Continued on next...
  • Page 93 TROUBLESHOOTING: Audio Loopback Level Test (Continued) Audio Loopback Level Test Continued from previous Page Check continuity between C780 and TP_MIC. Fail Check C780 for US, there continuity MP, DFP, etc. Pass Replace the ROADRUNNER (U701). and retest. 6880401P26-O...

  • Page 94: Reference Oscillator Test

    TROUBLESHOOTING: Reference Oscillator Test 3.14 Reference Oscillator Test Check test point TP_REFCLK_IN_SL for 33.6 MHz (reference oscillator frequency). the frequency at Power off the unit, Fail TP_REFCLK_IN_SL and then power it 33.6 MHz +84 Hz? back on. Pass the frequency at Fail TP_REFCLK_IN_SL 33.6 MHz +84 Hz?
  • Page 95 TROUBLESHOOTING: Reference Oscillator Test Reference Oscillator Test (Continued) Continued from previous Page Check 33.6 MHz at the TCXO output at C670 (high impedance probe). Check Fail the voltage voltage at P-P 0.6 < Vp-p C650. < 1Vpp? Pass Is the Fail the voltage Voltage at R651 ~...

  • Page 96: Dc Distribution (V2) Test

    TROUBLESHOOTING: DC Distribution (V2) Test 3.15 DC Distribution (V2) Test 6880401P26-O...

  • Page 97: Dc Distribution (V3) Test

    TROUBLESHOOTING: DC Distribution (V3) Test 3.16 DC Distribution (V3) Test 6880401P26-O...

  • Page 98: Dc Distribution (V4) Test

    TROUBLESHOOTING: DC Distribution (V4) Test 3.17 DC Distribution (V4) Test Use this test on a unit with the following symptom: no V4 (2.8Vdc). Check C705, C709, R651, R101, R723, R720, R707 for 2.8 Vdc. Check FILT_B+ Go to Fail Fail 2.8 Vdc 3.6 Vdc (3.6 Vdc)

  • Page 99: Dc Distribution (4.5V Pre-Regulator) Test

    TROUBLESHOOTING: DC Distribution (4.5V Pre-Regulator) Test 3.18 DC Distribution (4.5V Pre-Regulator) Test 6880401P26-O...

  • Page 100: Dc Distribution (V_Vib) Test

    TROUBLESHOOTING: DC Distribution (V_VIB) Test 3.19 DC Distribution (V_VIB) Test Use this test on a unit with the following symptom: no V_VIB (3.0 Vdc). Check E497 and C497 for 3.0 Vdc. 3.0 Vdc Check FILT_B+ Go to Fail Fail 3.6 Vdc present at (3.6 Vdc) FILT_B+...

  • Page 101: Dc Distribution (Vusb) Test

    TROUBLESHOOTING: DC Distribution (VUSB) Test 3.20 DC Distribution (VUSB) Test Use this test on a unit with the following symptom: no VUSB (3.3 Vdc). Check C713, for 3.3 Vdc. 3.3 Vdc Check FILT_B+ Go to Fail Fail 3.6 Vdc present at (3.6 Vdc) FILT_B+ present...

  • Page 102: Dc Distribution (Vsim) Test

    TROUBLESHOOTING: DC Distribution (VSIM) Test 3.21 DC Distribution (VSIM) Test Use this test on a unit with the following symptom: no VSIM (3.0 Vdc). Check C714 and R492 for 3.0 Vdc. 3.0 Vdc Check FILT_B+ Go to Fail Fail 3.6 Vdc present at (3.6 Vdc) at FILT_B+...

  • Page 103: Dc Distribution (Vhold) Test

    TROUBLESHOOTING: DC Distribution (VHOLD) Test 3.22 DC Distribution (VHOLD) Test 6880401P26-O...

  • Page 104: Dc Distribution (Vc Reg) Test

    TROUBLESHOOTING: DC Distribution (VC Reg) Test 3.23 DC Distribution (VC Reg) Test Use this test on a unit with the following symptom: no VC Reg (2.775 Vdc). Check C715 for 2.775 Vdc Check FILT_B+ Go to 2.775 Vdc Fail Fail 3.6 Vdc (3.6 Vdc) FILT_B+...

  • Page 105: Model Assembly (Ma) Test Mode Test

    • Model Assembly Test Mode is an embedded series of operational tests of the unit's user interface and functional features. • Motorola iDEN recommends MA Test Mode be performed after any servicing of the unit. • An Audio Test Cable is required to complete test mode correctly. See the Required Tools section or contact Motorola’s Aftermarket Accessories Division.
  • Page 106 TROUBLESHOOTING:: Model Assembly (MA) Test Mode Test Model Assembly (MA) Test Mode Test (cont.) 6880401P26-O...

  • Page 107: Gps Receiver Test

    TROUBLESHOOTING: GPS Receiver Test 3.25 GPS Receiver Test The Conducted signal testing described below can be performed to analyze or root cause an issue along the GPS RF subsystem, using a CW signal. The following tests are implemented in Factory Test Mode (BERBUG Mode). Test Setup 1.
  • Page 108 TROUBLESHOOTING: Digital Analysis Test GPS Receiver Test (Continued) Place UUT in BERBUG Notes: 1. US = Unsoldered component/connection. MODE and Power up. 2. MP = Missing part(s). Connect UUT to CW 3. DFP = Defective part(s). Generator. While in BERBUG Mode, type “gps on”...
  • Page 109 TROUBLESHOOTING: Digital Analysis Test GPS Receiver Test (Continued) Continued from previous Page Probe TP_ANA_CLK Fail Is clock signal Check R668 49.107mHz 1.875 vpp? For MP or US.. Pass End GPS testing 6880401P26-O...

  • Page 110: Mototalk (I290 Only)

    TROUBLESHOOTING: Digital Analysis Test 3.26 Mototalk (i290 ONLY) Since the iDEN Receiver and Transmitter Hardware are used for Dispatch (PTT), Phone Call, and MOTOtalk modes of operation; Hardware failures that occur during MOTOtalk will also occur in Dispatch (PTT) and Phone Call modes. Therefore, the electrical troubleshooting guide for MOTOtalk, Dispatch (PTT), and Phone Call are the same.

  • Page 111: Chapter 4

    Schematic Diagrams and COMPONENT LOCATION Chapter 4 SCHEMATIC DIAGRAMS AND COMPONENT LOCATION When ordering component parts, the part number and reference designator should be included. If the correct numbers cannot be located, call Motorola Parts Identification at 1-847-538-0021. 6880401P26-O...

  • Page 112: Component Layout Main Board - Front

    SCHEMATIC DIAGRAMS AND COMPONENT LOCATION Component Layout Main Board – Front C402 C406 L401 C820 L405 C804 C401 R820 R896 VR405 E405 L802 R1009 C1006 C1011 C803 L1000 FL1000 C1010 R1030 R852 R850 SH1000 R1010 R855 R851 R1005 R1001 C808 U801 R1023 R1011...

  • Page 113: Component Layout Main Board - Back

    SCHEMATIC DIAGRAMS AND COMPONENT LOCATION Component Layout Main Board – Back E750 E740 E756 FL751 J500 C502 E742 E744 C500 E758 E754 C758 M1400 E753 E757 E743 E741 E971 TP_ASW E941 E942 E943 E944 C103 E101 C2024 C2021 Q703 C2022 D876 E972 E973...

  • Page 114: Component Layout Keypad Board - Front

    SCHEMATIC DIAGRAMS AND COMPONENT LOCATION Component Layout Keypad Board – Front L750 C751 C750 VR750 M504 M508 M507 E423 E421 M505 M503 M506 R420 6880401P26-O...

  • Page 115: Component Layout Keypad Board - Back

    SCHEMATIC DIAGRAMS AND COMPONENT LOCATION Component Layout Keypad Board – Back VR753 VR752 C401 C402 R431 TP_KP_SUP M499 C406 C405 C403 M502 R430 L405 L407 L411 L415 TP_LG_SYNC L419 L429 C409 L421 C709 TP_SPKR_P TP_LED_SUP TP_VIB TP_KP_SYNC J405 TP_SPKR_M TP_MIC TP_GND L412 C407...

  • Page 116: Main Pcb - Block Hierarchy

    SCHEMATIC DIAGRAMS AND COMPONENT LOCATION MAIN PCB - Block Hierarchy SPIA_CLK SPIA_MOSI SPIA_MISO TP_SH_CS TP_RX_ACQ SPIA_MISO SPIA_MOSI TP_TXE SPIA_CLK DIGITAL ACC_CONN USB_D_PLUS SPIA_CLK RMT_CONTROL USB_D_MINUS SPI_CLK SPIA_CLK RMT_CONTROL SPIA_MOSI RR_BATTI USB_ID SPI_DW SPIA_MOSI RR_BATTI USB_ID SPIA_MISO SPI_DR SPIA_MISO SPIA_CS6_TOMAHAWK_CE CE_SH SPIA_CS6_SH_CE ROADRUNNER USB_VM...

  • Page 117: Battery_Block - Battery Connections

    SCHEMATIC DIAGRAMS AND COMPONENT LOCATION BATTERY_BLOCK - Battery Connections BRK4 BRK3 BRK2 BRK1 R101 5.6K R104 BATTERY_ID BATT_ID_FLTR BATT_ID_FLTR BRKAWY BRKAWY BRKAWY BRKAWY C101 75pF BATTERY_ID R103 PIN3 PIN2 BATT_THERMISTOR BATTERY BATT_THERMISTOR_FLTR PIN4 PIN1 RAW_B_PLUS M104 CONTACT E101 FBM3216HS800 C102 BATTERY RAW_B_PLUS 75pF...

  • Page 118: Acc_Conn_Block - Emu Connector

    SCHEMATIC DIAGRAMS AND COMPONENT LOCATION ACC_CONN_BLOCK - EMU Connector EMU Connector 16.2V E971 VR801 BLM21PG221SN1 7686949J14 EMU_CONN_PIN1_EXTBPLUS EXTB+ J7-1 J7-6 R902 EMU_CONN_D- 7685268E01 EMU_CONN_PIN2_D- J7-2 FHB1M1005JT E972 R901 J7-7 7685268E01 EMU_CONN_D+ EMU_CONN_PIN3_D+ J7-3 FHB1M1005JT E973 J7-8 USB_ID USB_ID J7-4 J7-9 J7-5 C2023 56pF...

  • Page 119: Roadrunner_Block - Audio Section

    SCHEMATIC DIAGRAMS AND COMPONENT LOCATION ROADRUNNER_BLOCK - Audio Section FILT_BATTI E751 7685268E01 SPKR_R_PLUS SPKR_R_PLUS SPKR_R_MINUS SPKR_R_MINUS E752 7685268E01 TP_MIC AUDIO_IN AUDIO_OUT AUDIO_IN EXT_MIC EXTOUT AUDIO_OUT E781 100nH L752 MIC_BIAS_1 0.47uF C780 MIC_INM 7685268E01 MICROPHONE MIC_INM 2414017H24 SPEAKER_M EARPHONE_MINUS E782 SPKRM EARPHONE_MINUS MIC_BIAS_1 7685268E01...

  • Page 120: Roadrunner_Block - Power Section

    SCHEMATIC DIAGRAMS AND COMPONENT LOCATION ROADRUNNER_BLOCK - Power Section RR_BATTI RAW_B_PLUS E703 4 1 3 A RR_BATTI 7605821Z02 SW2_UNDELAYED RAW_B_PLUS replace,4813970M62 FILT_BATTI R776 *Q701* 4809807C45 FILT_BPLUS delete,. 0688044N02 FILT_BPLUS E702 *Q702* R715 7605821Z02 Q1408 R775 EXT_B+ 0.16 R714 4809807C45 replace,4813970M62 MOB_PORTB CHARGE_SOURCE MAIN_FET_SOURCE...

  • Page 121: Roadrunner_Block - Interface And A/D

    SCHEMATIC DIAGRAMS AND COMPONENT LOCATION 4.10 ROADRUNNER_BLOCK - Interface and A/D D712 USB_ID 4816402H01 R763 CI_BLUE LEDB CI_BLUE CI_GREEN LEDG CI_GREEN CI_RED PRI_DIG_VCC LEDR CI_RED PRI_CE PRI_CE PRI_CE PRI_SPI_MISO PTT_LED_PWM PRI_SPI_MISO PRI_MISO LED1_DRV PTT_LED_PWM PRI_SPI_MOSI PRI_SPI_MOSI PRI_MOSI R730 PRI_SPI_CLK KP_LED_PWM 121K PRI_SPI_CLK PRI_SPI_CLK...

  • Page 122: Digital_Block - Jtag Test Connector

    SCHEMATIC DIAGRAMS AND COMPONENT LOCATION 4.11 DIGITAL_BLOCK - JTAG Test Connector JTAG Test Connector J410-33 J410-34 J410-1 J410-2 BT_UART_TX BT_UART_RX BT_UART_TX J410-3 J410-4 BT_UART_RX E910 EXT_POWER RR_BATTI J410-5 J410-6 V2_775_FLTR JTAG_TDI JTAG_TDO RMT_CONTROL JTAG_TDI J410-7 J410-8 JTAG_TDO JTAG_TMS JTAG_TCK JTAG_TMS J410-9 J410-10 JTAG_TCK...

  • Page 123: Digital_Block - Connectors, Sim, Misc

    SCHEMATIC DIAGRAMS AND COMPONENT LOCATION 4.12 DIGITAL_BLOCK - Connectors, SIM, misc. 4 1 3 A R470 EARPHONE_MINUS TP_EAR_M SW2_FLTR V2_775_FLTR R471 L422 L420 L424 EARPHONE_PLUS TP_EAR_P DISP_VDDIO DISP_VCI BL_SUPPLY B2B Connector C423 C422 C421 C420 C425 C424 C470 C471 J401-44 J401-41 33pF 0.10uF...

  • Page 124: Digital_Block - Patriot And Memory

    SCHEMATIC DIAGRAMS AND COMPONENT LOCATION 4.13 DIGITAL_BLOCK - Patriot and Memory 4 1 3 A RS232_RX SIM_RST_PAT SIM_RST_PAT RS232_RX_USB_VM *U801-2* SIM_DATA_PAT SIM_DATA_PAT SERIAL_PORTS_BLOCK SIM_CLK_PAT TP_RTS RS232_TX *U801-4* KEYPAD_GPIO_PB5 SIM_INT_TOUT_BLOCK USB_TRANS_ENABLE RS232_RX_USB_VM URXD1_PA15_USB_VMIN_TDI UTXD1_PA14_USB_VPOUT_ITXD_TDO RS232_TX_USB_DIN RS232_RTS_USB_XRXD URTS1_PA13_USBXRXD_IPWR_RESET_IN_IC2A UCTS1_PA12_USB_FSEN_MCU_DE SIM_D0TX_PB4 DTRA_PA11_TMS_SRDA_INT7 DSRA_PA10_TRST_STDA_URXD1_INT6 SIM_D0RX_PB5 SIM_RST0_PB6 DCDA_PA8_DSP_DE_SC2A...

  • Page 125: Bluetooth_Block - Bluetooth Circuit

    SCHEMATIC DIAGRAMS AND COMPONENT LOCATION 4.14 BLUETOOTH_BLOCK - Bluetooth Circuit VMMC R1010 R1005 L1005 2.2nH 2488090Y05 R1011 BT_DC_SUPPLY_OUTPUT BT_DC_SUPPLY_INPUT 2.2nH BT_DC_REGULATOR_2775V_IN C1004 C1003 0.1uF 1.0uF 2113946B04 2113946D02 R1012 L1000 22nH L1002 BT_DC_FEED BT_VDD_PIO_PADS 82nH C1006 C1032 U1001 C1031 R1030 15pF .01uF SN74LVC1G98 1.0uF...

  • Page 126: Transceiver - Xmit, Xcvr, Vco, Tcxo

    SCHEMATIC DIAGRAMS AND COMPONENT LOCATION 4.15 TRANSCEIVER - Xmit, Xcvr, VCO, TCXO RX COMPONENTS (200s) 2.7K 4 1 3 A R202 C60059 TP_RF_ATTN 56pF SHIELDED FL201 TP_AGC_DAC 56pF G5ED-938M00 L302 U3003 U3004 C204 56.05nH SKY13251 SKY13251 V2_RX L303 IN_800 OUT_800 56.05nH C300 C252...

  • Page 127: Keypad Board - Keypad, Bl, Logo, Spkr, Mic, Vib, Flex

    SCHEMATIC DIAGRAMS AND COMPONENT LOCATION 4.16 KEYPAD BOARD - Keypad, BL, Logo, Spkr, Mic, Vib, Flex On/Off Switch MOTOROLA INTERNAL USE ONLY 4 1 3 A Board Breakaway’s On/Off Switch SW_ON_OFF Keypad Keys BRK1 BRK2 BRK3 BRK4 SWITCH KEYPAD_ROW0 KEYPAD_ROW0...

  • Page 128: Component Locations

    SCHEMATIC DIAGRAMS AND COMPONENT LOCATION 4.17 Component Locations Ref. No. Part No. Description Ref. No. Part No. Description Ref. No. Part No. Description NOTPLACED 64AM DUMMY PART NUMBER C103 2113944A37 CAP,CHIP,75PF,+5%,-5%,50V-DC,0 C208 NOTPLACED 64AM DUMMY PART NUMBER BAT_DET_IN NOTPLACED 64AM DUMMY PART NUMBER C1031 NOTPLACED 64AM DUMMY PART NUMBER...
  • Page 129 SCHEMATIC DIAGRAMS AND COMPONENT LOCATION Component Locations [Continued] Ref. No. Part No. Description Ref. No. Part No. Description Ref. No. Part No. Description C303 2113946B04 CAP,CHIP,.1UF,+10%,-10%,10V-DC C420 2113946K02 CAP,CHIP,.1UF,+80%,-20%,16V-DC C492 2113946K02 CAP,CHIP,.1UF,+80%,-20%,16V-DC C304 2113944A26 CAP,CHIP,12PF,+5%,-5%,50V-DC,0 C421 2113944A31 CAP,CHIP,33PF,+5%,-5%,50V-DC,0 C500 2113944A31 CAP,CHIP,33PF,+5%,-5%,50V-DC,0 C305 2113946B02...
  • Page 130 SCHEMATIC DIAGRAMS AND COMPONENT LOCATION Component Locations [Continued] Ref. No. Part No. Description Ref. No. Part No. Description Ref. No. Part No. Description C527 2113946K02 CAP,CHIP,.1UF,+80%,-20%,16V-DC C625 2113946K02 CAP,CHIP,.1UF,+80%,-20%,16V-DC C719 2175511A01 CAP,CER,2.2UF,+20%,-20%,6.3V-D C528 2113946K02 CAP,CHIP,.1UF,+80%,-20%,16V-DC C626 NOTPLACED 64AM DUMMY PART NUMBER C720 2113945B02 CAP,CHIP,.01UF,+10%,-10%,25V-D...
  • Page 131 SCHEMATIC DIAGRAMS AND COMPONENT LOCATION Component Locations [Continued] Ref. No. Part No. Description Ref. No. Part No. Description Ref. No. Part No. Description C753 2113944A31 CAP,CHIP,33PF,+5%,-5%,50V-DC,0 C787 2175181C01 CAP,CER CHIP,22UF,+20%,-20%,6. C820 2113944A35 CAP,CHIP,62PF,+5%,-5%,50V-DC,0 C754 2113944A34 CAP,CHIP,56PF,+5%,-5%,50V-DC,0 C788 NOTPLACED 64AM DUMMY PART NUMBER C824 2113944A31 CAP,CHIP,33PF,+5%,-5%,50V-DC,0...
  • Page 132 SCHEMATIC DIAGRAMS AND COMPONENT LOCATION Component Locations [Continued] Ref. No. Part No. Description Ref. No. Part No. Description Ref. No. Part No. Description E500 NOTPLACED 64AM DUMMY PART NUMBER E742 NOTPLACED 64AM DUMMY PART NUMBER E972 7685268E01 FLTR,FERRITE BEAD,650MA,SM,040 E519 7685268E01 FLTR,FERRITE BEAD,650MA,SM,040 E743...
  • Page 133 SCHEMATIC DIAGRAMS AND COMPONENT LOCATION Component Locations [Continued] Ref. No. Part No. Description Ref. No. Part No. Description Ref. No. Part No. Description L1002 NOTPLACED 64AM DUMMY PART NUMBER L413 7685268E01 FLTR,FERRITE BEAD,650MA,SM,040 L751 2414017G19 IDCTR,CHIP,100NH,5%,300MA,2.5O L1003 NOTPLACED 64AM DUMMY PART NUMBER L414 7685268E01 FLTR,FERRITE BEAD,650MA,SM,040...
  • Page 134 SCHEMATIC DIAGRAMS AND COMPONENT LOCATION Component Locations [Continued] Ref. No. Part No. Description Ref. No. Part No. Description Ref. No. Part No. Description Q707 4885316E06 TRANSISTOR,BIP GENERAL PURPOSE R200 0613952Q74 RES,MF,1.1KOHM,5%,.0625W,SM,04 R600 0613952Q46 RES,MF,75OHM,5%,.0625W,SM,0402 Q708 4885316E36 XSTR,FET GP PWR,N,SOT-723,20V, R201 0613952Q69 RES,MF,680OHM,5%,.0625W,SM,040 R6000...
  • Page 135 SCHEMATIC DIAGRAMS AND COMPONENT LOCATION Component Locations [Continued] Ref. No. Part No. Description Ref. No. Part No. Description Ref. No. Part No. Description R716 NOTPLACED 64AM DUMMY PART NUMBER R752 NOTPLACED 64AM DUMMY PART NUMBER R782 0613952P30 RES,MF,200KOHM,1%,.0625W,SM,04 R719 0613952Q01 RES,MF,1OHM,5%,.0625W,SM,0402, R753 NOTPLACED 64AM DUMMY PART NUMBER...
  • Page 136 SCHEMATIC DIAGRAMS AND COMPONENT LOCATION Component Locations [Continued] Ref. No. Part No. Description Ref. No. Part No. Description Ref. No. Part No. Description R841 0613952R66 RES,MF,0OHM,5%,.0625W,SM,0402, SH301 2671768L01 SHLD,MULTI CAVITY,SMOOTH,SHLD TP_ASW NOTPLACED 64AM DUMMY PART NUMBER R850 0613952R17 RES,MF,47KOHM,5%,.0625W,SM,040 SH500 2671783L01 SHLD,MULTI CAVITY,SMOOTH,SHLD TP_BCLK NOTPLACED...
  • Page 137 SCHEMATIC DIAGRAMS AND COMPONENT LOCATION Component Locations [Continued] Ref. No. Part No. Description Ref. No. Part No. Description Ref. No. Part No. Description TP_RXI NOTPLACED 64AM DUMMY PART NUMBER U3004 5171972L01 IC,SW,SP3T RF SW VR755 4813978M23 DIODE,SWG,SM,SOT-563,1A,23V,.2 TP_RXIX NOTPLACED 64AM DUMMY PART NUMBER U501 5185633C54 IC,AMP,LOW TIER ADJUSTABLE GAI...
  • Page 138 SCHEMATIC DIAGRAMS AND COMPONENT LOCATION Component Locations [Continued] Ref. No. Part No. Description Ref. No. Part No. Description Ref. No. Part No. Description 6880401P26-O...

  • Page 139: Customer Service

    A.2 Replacement Parts When ordering replacement and accessory parts, the complete part number should be included. If the correct part number cannot be located, call Motorola Parts Identification at 1-800-422-4210. A.3 Domestic Orders Send written orders for replacement parts, test equipment, or manuals to: Motorola, Inc.

  • Page 140: Replacement Kits

    A.5 Replacement Kits When ordering replacement kits, the complete kit number should be included. If the correct number cannot be located, call Motorola Parts Identification at 1-800-422-4210. Refer to the exploded view and parts list in Chapter 7. Table: A-1.

  • Page 141: Recommended Test Equipment And Tools

    Battery Eliminator, Regulated Black Stick SLN7223A SLN7223A Cable, Audio Jack Test NNTN5171A NNTN5171A Cable, SMA to N-Type RF Contact Motorola Contact Motorola Communications System Analyzer Motorola R-2660 Motorola R-2660 Data Cable, Flash RJD2005A RJD2005A Data Cable, USB SKN6371C...

  • Page 142: Recommended Programming Equipment

    ORDERING REPLACEMENT PARTS AND KITS: Recommended Programming Equipment A.7 Recommended Programming Equipment The following tables list the programming equipment and software recommended for troubleshooting i290 units at the field level of service. Table A-3. Recommended Programing Equipment Name Part Number Description Cable, Data, codeplug RJD2005A...
  • Page 143 This Page Left Blank Intentionally...
  • Page 144 © 2007 by Motorola, Inc. 8000 W. Sunrise Blvd. Ft. Lauderdale, FL 33322 All Rights Reserved 6880401P26-A...

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