Ⅻ. Welding Operation Guidance; Reflow Temperature; Reflow Soldering Curve - Ebyte E52-400/900NW22S User Manual

Chengdu Ebyte Electronic Technology Co.,Ltd..
Ⅻ. Welding Operation Guidance

12.1 Reflow temperature

Reflow soldering curve characteristics
Preheating/insulation
Heating slope (TL~Tp)
Liquid phase temperature (TL)
Holding time above TL
Package peak temperature Tp
Time (Tp) within 5 ℃ of the specified grading
temperature (Tc), as shown in the following figure
Cooling slope (Tp~TL)
Time from room temperature to peak temperature
※The peak temperature (Tp) tolerance of the temperature curve is defined as the user's upper limit

12.2 Reflow soldering curve

Minimum temperature
(Tsmin)
Maximum temperature
(Tsmax)
Time (Tsmin~Tsmin)
Assembly with lead process
100℃
150℃
60-120 seconds
3 ℃/s, maximum
183℃
60-90 seconds
Users cannot exceed
temperature indicated on the
"Moisture Sensitivity" label.
20 seconds
6℃/seconds，maximum
6 minutes, maximum
32
CopyriCopyright ©2012–2023, Chengdu Ebyte Electronic Technology Co.,Ltd.
E52-400/900NW22S User Manual
Lead free process assembly
150℃
200℃
60-120 seconds
3 ℃/s, maximum
217℃
60~90seconds
Users cannot
the
temperature indicated on the
"Moisture Sensitivity" label of
the product.
30 seconds
6℃/seconds，maximum
8 minutes, maximum
exceed the