Welding Operation Guidance; Reflow Soldering Temperature; Reflow Soldering Curve - Ebyte E104-BT40 User Manual

Chengdu Ebyte Electronic Technology Co.,Ltd.

9. Welding operation guidance

9.1 Reflow Soldering Temperature

Profile Feature
Solder Paste
Preheat Temperature min （Tsmin）
Preheat temperature max (Tsmax)
Preheat Time (Tsmin to Tsmax)(ts)
Average ramp-up rate(Tsmax to Tp)
Liquidous Temperature (TL)
Time（tL）Maintained Above（TL）
Peak temperature（Tp）
Aveage ramp-down rate（Tp to Tsmax）
Time 25℃ to peak temperature

9.2 Reflow Soldering Curve

Copyright ©2012–2019，Chengdu Ebyte Electronic Technology Co.,Ltd.
9-29
Curve feature
Solder paste
Minimum preheating
temperature
Maximum preheating
temperature
Preheating time
Average rising rate
Liquid phase temperature
Time above liquidus
Peak temperature
Average descent rate
Time of 25 ° C to peak
temperature
E104-BT40 User Manual
Sn-Pb Assembly
Sn63/Pb37
100℃
150℃
60-120 sec
3℃/second max
183℃
60-90 sec
220-235℃
6℃/second max
6 minutes max
Pb-Free Assembly
Sn96.5/Ag3/Cu0.5
150℃
200℃
60-120 sec
3℃/second max
217℃
30-90 sec
230-250℃
6℃/second max
8 minutes max