Chengdu Ebyte Electronic Technology Co., Ltd.
11. Welding operation guidance
11.1 Reflow temperature
Profile Feature
Solder Paste
Preheat Temperature min (Tsmin)
Preheat temperature max (Tsmax)
Preheat Time (Tsmin to Tsmax)(ts)
Average ramp-up rate(Tsmax to Tp)
Liquidous Temperature (TL)
Time(tL)Maintained Above(TL)
Peak temperature(Tp)
Aveage ramp-down rate(Tp to
Tsmax)
Time 25℃ to peak temperature
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Curve feature
Solder paste
Mini.preheating
temperature
Max. preheating
temperature
Preheating temperature
Average Rising Rate
Liquid phase temperature
Time above liquidus
Peak Temperature
Average Decline Rate
Time from 25℃ to peak
temperature
Sn-Pb Assembly
Sn63/Pb37
100℃
150℃
60-120 sec
3℃/second max
183℃
60-90 sec
220-235℃
6℃/second max
6 minutes max
E43-900T13S3 User manual
Pb-Free Assembly
Sn96.5/Ag3/Cu0.5
150℃
200℃
60-120 sec
3℃/second max
217℃
30-90 sec
230-250℃
6℃/second max
8 minutes max
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