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TN1393
Technical note
Mounting instruction for STPOWER module ACEPACK DMT-32
Introduction
ACEPACK DMT-32 is an advanced power module designed to integrate power devices with different nature. Making use of
power module simplifies the design and increase reliability while optimizing PCB size and system costs.
This mounting instructions paper gives the main recommendations to appropriately handle, assemble and rework the ACEPACK
DMT-32 power module. It is necessary to follow some basic assembly rules either to limit thermal and mechanical stresses or
assure the best thermal conduction and electrical insulation.
TN1393 - Rev 2 - August 2023
www.st.com
For further information contact your local STMicroelectronics sales office.
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Table of Contents
Related Manuals for ST ACEPACK DMT-32
Summary of Contents for ST ACEPACK DMT-32
- Page 1 Mounting instruction for STPOWER module ACEPACK DMT-32 Introduction ACEPACK DMT-32 is an advanced power module designed to integrate power devices with different nature. Making use of power module simplifies the design and increase reliability while optimizing PCB size and system costs.
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Page 2: Heat Sink
Heat sink When attaching a heat sink to a ACEPACK DMT-32 make sure not to apply excessive force to the device for assembly. Drill holes for screws in the heat sink exactly as specified. Smooth the surface by removing burrs and protrusions of indentations. -
Page 3: Figure 2. Heat Sink Flatness Specification
TN1393 Basic guidelines Figure 1. Device flatness specification Figure 2. Heat sink flatness specification TN1393 - Rev 2 page 3/18... -
Page 4: Thermal Conductive Grease
TN1393 Thermal conductive grease Thermal conductive grease To get the most effective heat dissipation, it is necessary to enlarge the contact area as much as possible, which minimizes the contact thermal resistance. Properly apply thermal-conductive grease over the contact surface between a module and heat sink, which is also useful for preventing the contact surface from corrosion. -
Page 5: Recommended Screws
TN1393 Recommended screws Figure 4. Recommended fastening order of mounting screws Recommended screws All mounting screws should have washers and spring washer for best mounting results. It is recommended to use SEMS screw (included spring/plain washer M3) as shown in the following figure. Figure 5. -
Page 6: Electrical Insulation: Creepage And Clearance
TN1393 Electrical insulation: creepage and clearance Electrical insulation: creepage and clearance The electrical insulation is compliant with the IEC60664-1: the minimum creepage and clearance distances are guaranteed according to the material class, pollution degree, altitude and voltage. The creepage distance is defined as the shortest distance along the surface of a solid insulating material between two conductive parts. -
Page 7: Package Handling
TN1393 Package handling Package handling ESD protective measures Semiconductors are normally electrostatic discharge sensitive devices (ESDS) requiring specific precautionary measures regarding handling and processing. Static discharges caused by human touch or by processing tools may cause high-current and/or high-voltage pulses, which may damage or even destroy sensitive semiconductor structures. -
Page 8: Storage And Transportation Conditions
TN1393 Storage and transportation conditions Storage and transportation conditions Improper transportation and unsuitable storage of components can lead to a number of problems during subsequent processing, such as poor solderability, delamination, and package cracking effects. These relevant standards should be taken into account as appropriate: •... -
Page 9: Soldering
TN1393 Soldering Soldering ACEPACK DMT-32 is parts THD packages that are typically soldered by wave soldering. Selective wave soldering Wave soldering is a large-scale soldering process by which electronic components are soldered to a PCB to form an electronic assembly. The name is derived from the fact that the process uses a tank to hold a quantity of molten solder;... -
Page 10: Other Soldering Techniques
TN1393 Other soldering techniques Figure 8. Typical dual-wave soldering profile Other soldering techniques Beside wave and reflow soldering, other techniques are used in special applications. Examples include selective wave soldering, laser welding and laser soldering, hot bar soldering, and manual soldering with solder irons and hot air guns. -
Page 11: Cleaning
TN1393 Cleaning Cleaning After the soldering process, flux residues can be found around the solder joints. However, if the solder joints have to be cleaned, the cleaning method (e.g. ultrasonic, spray, or vapor cleaning) and solution have to be selected with consideration of the packages to be cleaned, the flux used (rosin-based, water-soluble, etc.), and environmental and safety aspects. -
Page 12: Inspection
TN1393 Inspection Inspection After component placement: A visual inspection after component placement can be done by AOI. It is used to check if the mounting is done completely and if severe misplacements have occurred. Sometimes the correct orientation of the component can also be checked. -
Page 13: Rework
TN1393 Rework Rework If a defective component is observed after board assembly, the device can be removed and replaced by a new one. Repair of single solder joints is generally possible, but requires proper tools. For example, repairing the solder joint of an exposed die pad cannot be done with a soldering iron. Whatever rework process is applied, it is important to recognize that heating a board and components above 200 °C may result in damage. -
Page 14: Coating Of Assembled Pcb's
TN1393 Coating of assembled PCB’s Coating of assembled PCB’s In some applications, coatings are used to prevent damage due to external influences such as: • Mechanical abrasion • Vibration • Shock • Humidity • Hand perspiration • Chemicals and corrosive gases These influences may cause: •... -
Page 15: Revision History
TN1393 Revision history Table 3. Document revision history Date Revision Changes 17-Dec-2021 First release. 18-Aug-2023 Added Section 1.5 Electrical insulation: creepage and clearance TN1393 - Rev 2 page 15/18... -
Page 16: Table Of Contents
TN1393 Contents Contents Heat sink ................2 Basic guidelines . -
Page 17: List Of Figures
TN1393 List of figures List of figures Figure 1. Device flatness specification............3 Figure 2. - Page 18 ST’s terms and conditions of sale in place at the time of order acknowledgment. Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of purchasers’...
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