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Applicability Type AIW PN Description MediaTek T700 NR SUB6/LTE FDD/LTE TDD/WCDMA M.2 3052 module B key, W/O SIM holder; w/o voice function; Only USB communication AIW-357 DK-G2U XS5G03-GBO interface, for USA, Europe, Japan and Taiwan region...
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Revision History Version Date Description V1.0 2023-06-07 First issue V1.1 2023-07-10 Section 2.10 edit LED Signal picture V1.2 2023-08-16 Add Section 5.1 Product picture Add Section 2.1 pin map schematic V1.3 2023-08-23 Add Section 2.6.1~2.6.3 USIM N.C./ N.O. description...
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Thermal solutions are necessary to be put on module, so that module can work smoothly in operating temperature range. For example, thermal pad, heat sink, fan. 1.2 Product Specification and Frequency Bands AIW-357 DK-G2U is standard version with GPS function. Cellular Item...
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Model AIW-357 DK-G2U LTE Category Cat 12 B1/2/3/4/5/7/8/12/13/14/17/18/19/20/25/26/ LTE Bands 28/29/30/32/34/38/39/40/41/42/43/46/48/66/71 4G LTE DL CA 4x4 MIMO, 3CC UL CA UMTS/ Bands B1/2/4/5/8 WCDMA UL 2x2 MIMO GPS/GLONASS/BeiDou/ Galileo Frequency Band L1 Table 1-2 Product Specification and Frequency Bands 1.3 Circuit Block Diagram The circuit block diagram is shown in Figure 1-1.
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Figure 1-1 Circuit block diagram of the module...
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1.4 Application Interface Features Description External Power Supply: DC 3.3V Typical USB Interface: USB3.1 Gen1 x 1, USB2.0 x 1 Audio Interface: I2S x 1 I2C Interface: I2C × 1 USIM Interface: USIM × 1, eSIM x 1 (optional) RF Ipex4 connector: RF Ipex4 connector ×...
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Pin Pin Name Description Voltage Type Setting vale: NC The interface of AIW-357 DK-G2U CONFIG_3 module is configured as the WWAN – PCIe Gen3, USB3.1 Gen1 +3.3V Power supply for Module 3.135-3.63V Module ground pin +3.3V Power supply for Module 3.135-3.63V...
Pin Pin Name Description Voltage Type I2S0_BCK I2S interface 1.8V Setting vale: GND The interface of AIW-357 DK-G2U CONFIG_0 module is configured as the WWAN – PCIe Gen3, USB3.1 Gen1 I2S0_DI I2S interface 1.8V Used to wake the platform by the WWAN WOWWAN# 1.8V...
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Pin Pin Name Description Voltage Type No connection pin Module ground pin I2C_SCL I2C clock 1.8V No connection pin I2C_SDA I2C data 1.8V No connection pin I2C_IRQ# I2C interrupt request 1.8V Module ground pin No connection pin No connection pin No connection pin No connection pin No connection pin...
USIM1 card detect pin 1.8V RESET# Module reset input pin 1.8V No connection pin Setting vale: GND The interface of AIW-357 DK-G2U CONFIG_1 module is configured as the WWAN – PCIe Gen3, USB3.1 Gen1 +3.3V Power supply for Module 3.135-3.63V Module ground pin +3.3V...
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Note: P indicates power pins; PI indicates input power pins; PO indicates output power pins; AI indicates pins for analog signal input; AO indicates pins for analog signal output; AIO indicates pins analog bidirectional, DI indicates pins for digital signal input; DO indicates pins for digital signal output;...
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2.2 Power Interface +3.3V pins (pin 2,4,70,72,74) are the power supply for AIW-357 DK-G2U module The recommended +3.3V power supply circuit is shown in the figure blow: Figure 2-2 power supply recommend circuit When power source voltage lower than 3.135V, the module may shutdown or restart.
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The following figure shows the voltage drop during Tx burst transmission Figure 2-3 power voltage lower than 3.135V The power consumption data of AIW-357 DK-G2U module under 3.3V power supply is 2.26A (Max.). Input power (V) Current avg (A) Current max (A) Condition 0.50...
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2.3 Control Signal Interface Pin 6 FULL_CARD_POWER_OFF# FULL_CARD_POWER_OFF# Pin Function: When module off, pull high this pin then the Module booting FULL_CARD_POWER_OFF# =0→1: PMIC inside the module sequence power on FULL_CARD_POWER_OFF# =1 →0: PMIC inside the module sequence power off ...
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Pin 67 RESET# RESET# Function: The RESET# pin is hardware reset pin used to reset the system of module. Active Low PU current: 5uA VIH: 1.45V VIL: 0.3V De-bounce time: ≤0.25ms Layout notice RESET# need to keep far from noise trace. If it is possible, please adding “GND” shielding to avoid noise coupled.
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2.3.1. M .2 Module Timing Note 2.3.1.1. Normal Boot Figure 2-6 Normal boot module timing 2.3.1.2. Reboot (Power off Power on) Figure 2-7 Reboot module timing...
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2.4 USB Interface 2.4.1. USB Schematic Notice USB application circuit on HS/FS receptacle side Reserve ESD protection device for USB differential pair (USB_D+/ USB_D-). The equivalent capacitance loading of ESD protection device should be less than 3pF. Beware the diode operate voltage for avoid the leakage current.
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2.4.2. USB Layout Notice The characteristic impedance must be implemented in PCB layout. The characteristic impedance recommends 90 +/-10% Ohm. USB 2.0 USB_D+ / USB_D- USB 3.1 USB3.0_TX+/ USB3.0_TX- USB3.0_RX+/ USB3.0_RX- USB differential pair trace length Must follow the rules as bellow: USB 2.0 ...
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2.5 I2C Interface AIW-357 DK-G2U module provides I2C interface. The I2C interface is open drain and requires external PU to 1.8 V. Pin No Pin Name Pad Type Description Typ. (V) I2C_SCL I2C clock I2C_SDA I2C data I2C_IRQ# I2C interrupt request Table 2-6 I2C interface 2.6 USIM Interface...
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2.6.1. N.C. (Normally Closed) SIM card Slot The reference circuit design for N.C. (Normally Closed) SIM card slot is shown in Figure 2-8: Figure 2-8. Ref. SIM Card Connector Schematic (Normally Closed SIM card slot) The principles of the N.C.SIM card slot are described as follows: ...
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2.6.2. N.O. (Normally Open) SIM card Slot The reference circuit design for N.C. (Normally Open) SIM card slot is shown in Figure 2-9: Figure 2-9. Ref. SIM Card Connector Schematic (Normally Open SIM card slot, Recommended use) The principles of the N.C.SIM card slot are described as follows: ...
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2.6.3. SIM Card connector layout Notice: (1) Place the ESD protection device near the corresponding pin. If an RC filter is required, place it on the appropriate ESD-protected device. (2) Isolate the SIM card signal from other high-speed signals to prevent the signal from receiving speed signals that are highly affected by the SIM card.
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Table 2-8 I2S interface 2.8 RF Interface AIW-357 DK-G2U module use 4 ipex-4 RF connectors to connect external antenna. Connector “M” is for main antenna connection, used to transmit and receive and RF signals. Connector “D/G” is for Diversity antenna connection, used to receive the diversity RF signals and L1 GNSS signal (optional).
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(Pin 75) (Pin 1) WWAN – USB3.1 Gen1 Table 2-10 AIW-357 DK-G2U module configuration 2.10 LED Signal Pin 10 LED1# provide LED current sink channels for general LED indicator application. LED1# supports up to 12mA and dropout voltage ≤ 225mV.
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3 RF Specifications 3.1 Operation Frequency 3.1.1. NR Operating Frequencies Uplink (UL) operating band Downlink (DL) operating operating Duplex Mode – F – F band F UL_low UL_high DL_low DL_high band 1920 MHz – 1980 MHz 2110 MHz – 2170 MHz 1850 MHz –...
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3.1.2. LTE Operating Frequencies Downlink (DL) operating E-UTRA Uplink (UL) operating band band Operating Duplex Mode Band – F – F UL_low UL_high DL_low DL_high 1920 MHz – 1980 MHz 2110 MHz – 2170 MHz 1850 MHz – 1910 MHz 1930 MHz –...
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Downlink (DL) operating E-UTRA Uplink (UL) operating band band Operating Duplex Mode Band – F – F UL_low UL_high DL_low DL_high 2010 MHz – 2025 MHz 2010 MHz – 2025 MHz 2570 MHz – 2620 MHz 2570 MHz – 2620 MHz 1880 MHz –...
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Table 3-3 UTRA/FDD is designed to operate in either of the following paired bands 3.2 Operating Band AIW-357 DK-G2U Band n1/2/3/5/7/8/20/25/28/30 NR Band /38/40/41/48/66/71/77/78/79 NR CA ENDC B1/2/3/4/5/7/8/12/13/14/17/18/19/20/25/26/28/29 LTE Band /30/32/34/38/39/40/41/42/43/46/48/66/71 LTE CA WCDMA Band B1/2/4/5/8 Table 3-4 Operating Band for AIW-357 DK-G2U...
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3.3 Conducted RF Measurement AIW-357 DK-G2U modules meet all 3GPP test standards relating to 3G, LTE and 5G. NR supports most main features in 3GPP Release 15 LTE supports most main features in 3GPP Release 14 3G supports most main features in 3GPP Release 7 and Release 8 3.4 Conducted RX Sensitivity...
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3.4.1. NR Conducted RX sensitivity 3GPP QPSK Design Duplex Bandwidth Prefsens Spec. NR Band Mode (KHz) (MHz) (dBm) (dBm) SIMO *2 SIMO *1 -97.1 -95.1 -94.1 -95.1 -101 -95.1 -97.5 -94.1 -101 -94.1 -101 -93.6 -95.6 -101.5 -97.1 -98.6 -97.1 -97.2 -95.1 -84.7...
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3GPP QPSK Design Duplex Bandwidth Prefsens Spec. NR Band Mode (KHz) (MHz) (dBm) (dBm) SIMO *2 SIMO *1 -89.7 -91.6 -85.6 Table 3-5 NR Conducted RX sensitivity Note: SIMO is a smart antenna technology that uses a single antenna at the transmitter side and two antennas at the receiver side, which improves the RX performance.
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3GPP QPSK Design Spec. Bandwidth LTE Band Duplex Mode Prefsens (dBm) (MHz) SIMO *2 SIMO *1 -103 -101.5 -103.5 -102 -101.5 -103.5 -103.5 -103 Table 3-6 LTE Conducted RX sensitivity Note: SIMO is a smart antenna technology that uses a single antenna at the transmitter side and two antennas at the receiver side, which improves the RX performance.
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3.5 Conducted Transmit Power The conducted transmit power is another indicator of the performance of the module and refers to the maximum power that the module tested at the antenna port can transmit. According to the 3GPP protocol, the required transmit power varies with the power class. Table 3-3 list the required range of the conducted transmit power of the module under 3.3 V +10% -5% voltage and normal temperature.
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Design Spec.(dBm) 5GNR 3GPP Standard (Sub 6G) (dBm) Max. Typ. Min. 23+/-2 n41(HPUE) 26+2/-3 24~26 23+2/-3 22.5 23+/-2 23+2/-2.5 20.5 23+2/-3 n77(HPUE) 26+2/-3 23+2/-3 n78(HPUE) 26+2/-3 24~26 23+2/-3 n79(HPUE) 26+2/-3 24~26 Table 3-9 NR Conducted Maximum TX sensitivity Note: n41, n77, n78, n79 support HPUE power class 2.
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3.5.1.2. Maximum power reduction (MPR) for power class 2 of SA Maximum power reduction (MPR) for power class 2 of SA 5G NR should refer to should refer to 3GPP TS 38.101-1 V16.6.0 as below. MPR (dB) Modulation Edge RB Outer RB Inner RB allocations...
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3.5.1.3. Maximum power reduction (MPR) for power class 3 of NSA Maximum power reduction (MPR) for power class 3 of NSA 5G NR should refer to should refer to 3GPP TS 38.101-1 V16.6.0 as below. MPR (dB) Modulation Edge RB Outer RB Inner RB allocations...
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NOTE 2: Applicable for UE operating in FDD mode, or in TDD mode in bands other than n40, n41, n77, n78 and n79 with Pi/2 BPSK modulation and if the IE powerBoostPi2BPSK is set to 0 and if more than 40 % of slots in radio frame are used for UL transmission for bands n40, n41, n77, n78 and n79.
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3.5.2. LTE Transmits Power 3.5.2.1. LTE Conductive Maximum Transmits Power Design Spec.(dBm) LTE Band 3GPP Standard (FDD) (dBm) Max. Typ. Min. 23+/-2 23+/-2 23+/-2 23.5 23+/-2 23.5 23+/-2 23.5 23+/-2 23+/-2 23+/-2 23.5 23+2/-2.5 20.5 23+/-2 23+/-2 23.5 23+/-2 23+/-2 23+/-2 23+/-2 23+/-2...
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Design Spec.(dBm) LTE Band 3GPP Standard (FDD) (dBm) Max. Typ. Min. 23+/-2 23.5 23+/-2 23+/-2 23.5 23+/-2 23+/-2 22.5 23+2/-3 23+2/-3 23+2/-3 24.5 Table 3-12 LTE Conducted Maximum TX Power Note: B38, B40, B41, B42 currently set to power class 3, can support power class 2 (HPUE).
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3.5.2.2. LTE Maximum Power Reduction (MPR) Maximum Power Reduction (MPR) and Additional Maximum Power Reduction (A-MPR) of LTE should refer to 3GPP TS 36.521-1 as below. Channel bandwidth / Transmission bandwidth (N Modulation (dB) ≤ 1 QPSK > 5 > 4 >...
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3.6 Bandwidth Specifications 3.6.1. NR Bandwidth Specifications Channel Bandwidths (MHz) Band Mode (kHz) 90 100 20 R16*1 R16...
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Note: The default channel bandwidth is based on 3GPP spec 38.101-1 release 15.6.0 *1 based on later spec version and need MTK library release. *2 3GPP TS 138.508-1. Test frequencies for NR operating band 40 and band 48, the channel 5MHz bandwidth can only be used as SCell.
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Duplex Channel Bandwidths (MHz) Band Mode Table 3-16 LTE Bandwidth Note: B29, B32, B46 is SDL.
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(MHz) CC number Band number Subcarrier 15K/30K spacing (Hz) Max MIMO layers per CC Modulation 256 QAM 64 QAM 256 QAM Table 3-17 LTE / NR hardware and software capability Note: AIW-357 DK-G2U only support NR UL 1 CC...
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EN-DC 2.9 Gbps 2.97 Gbps *4 700 Mbps 530 Mbps Table 3-18 AIW-357 DK-G2U/EUI LTE / NR (SA) / ENDC maximum throughput Note: *1 120M (FDD 20M 4RX), 130M (FDD 30M 2RX) *2 Module level (actual test data in MAC).
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3.9 RF Antenna Connector Configuration The module provides four antenna pads for connecting the external antennas. Antenna Port Function Operating Frequencies WCDMA/LTE/NR Primary TRX(SRS) 700 MHz ~ 2700 MHz ANT0 (Main) NR Diversity TRX 2496 MHz ~ 5000 MHz ANT1 MIMO (SRS) 1920 MHz ~ 5000 MHz NR Primary TRX (SRS)
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3.10 GPS Feature 3.10.1. Feature Supports L1 (1575.42MHz) GPS/GLONASS/Beidou/Galileo/QZSS concurrent reception GPS/Galileo only (GPS only) GPS/Galileo – GLONASS (G + G) GPS/Beidou (G + B) GPS/GLONASS/Beidou (G + G + B) GPS/Galileo/GLONASS (G + G + G) GPS/Galileo/GLONASS/Beidou (G + G + G + B) ...
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Test Result TTFF 20 times average time Cold Start 35.7 sec Warm start 32.8 sec Hot start 1.2 sec 3.10.3.2. Acquisition sensitivity Test Result Acquisition Sensitivity -145dBm 3.10.3.3. Tracking sensitivity Test Result Tracking Sensitivity -156dBm...
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4 Electrical Characterisitics 4.1 Absolute Maximum Ratings Pin Name Description Min. Typ. Max. +3.3V External power supply 3.135V 3.3V Table 4-1 Absolute maximum ratings for power supply 4.2 Recommended Operating Conditions Pin Name Description Min. Typ. Max. +3.3V External power supply 3.135V 3.3V 3.63V...
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4.4 USIM DC electrical characteristics 4.4.1. USIM1_DATA USIM1_PWR=1.8V Parameter Description Min. Typ. Max. Unit Input logic low voltage Input logic high voltage 0.27 DC output logic low voltage DC output logic high voltage 0.27 Table 4-5 USIM1_data electrical characteristics ...
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USIM1_PWR=3.0V Parameter Description Min. Typ. Max. Unit Input logic low voltage Input logic high voltage DC output logic low voltage DC output logic high voltage Table 4-8 USIM1_CLK electrical characteristics 4.4.3. USIM1_RESET USIM1_PWR=1.8V Parameter Description Min. Typ. Max. Unit Input logic low voltage Input logic high voltage...
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5.2 Storage Requirement The module need to be stored by sealed antistatic PE bag with the TYVEK Clay desiccant inside, under a temperature below 40°C and the relative humidity less than 60%. 5.3 Dimensions Figure 5-2 AIW-357 DK-G2U Dimensions...
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5.4 Assembly Processes AIW-357 DK-G2U is M.2 module which follows PCI-express standard. Please follow the steps in Picture 5-2 to insert the module. Minimum two step insertion is desirable; intent is to minimize the insertion/extraction force. Step 1: As PCI-express standard, angled insertion is allowable and preferred. The recommend of angle of insertion is 20°.
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Figure 5-3 AIW-357 DK-G2U assembly processes The RF connector on AIW-357 DK-G2U module is standard MHF 4 connector, the serial number is 20579-001E manufacture by I-PEX Corporation. To prevent RF connector being damaged while install and uninstall RF cable, the recommend...
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