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4.3.
Digital I/O Characteristics ........................................................................................................ 34
4.4.
Power Consumption ................................................................................................................. 34
4.5.
RF Performances ..................................................................................................................... 38
4.5.1.
Wi-Fi Performances ...................................................................................................... 38
4.5.2.
Bluetooth Performances ............................................................................................... 41
4.6.
ESD Protection ......................................................................................................................... 41
4.7.
Operating and Storage Temperatures ...................................................................................... 42
4.8.
Thermal Dissipation ................................................................................................................. 42
5
Mechanical Information .................................................................................................................... 44
5.1.
Mechanical Dimensions of the Module .................................................................................... 44
5.2.
Recommended Footprint ......................................................................................................... 46
5.3.
Top and Bottom Views ............................................................................................................. 47
6
Storage, Manufacturing & Packaging ............................................................................................. 48
6.1.
Storage Conditions ................................................................................................................... 48
6.2.
Manufacturing and Soldering ................................................................................................... 49
6.3.
Packaging Specifications ......................................................................................................... 51
6.3.1.
Carrier Tape ................................................................................................................... 51
6.3.2.
Plastic Reel ................................................................................................................... 52
6.3.3.
Mounting Direction ........................................................................................................ 52
6.3.4.
Packaging Process ....................................................................................................... 53
7
Appendix References ....................................................................................................................... 54
AF55C_Hardware_Design
Automotive Wi-Fi&Bluetooth Module Series
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