Package Contents - Nexcom NDiS B338-LITE User Manual

Fanless embedded computer
Table of Contents

Advertisement

Preface

Package Contents

Before continuing, verify that the NDiS B338-LITE package that you received is complete. Your package should have all the items listed in the following table.
Item Part Number
Name
1
10W00B33802X0
NDiS B338-LITE
2
7400060049X00
Power Adapter FSP:FSP060-DHAN3
3
5060200719X00
THERMAL PAD T-GLOBAL 65x20x1.0mm FOR BOTTOM RAM
4
5060200781X00
THERMAL PAD T-GLOBAL 60x20x2.5mm FOR TOP RAM
THERMAL PAD T-GLOBAL 60x20x3.5mm FOR TOP M.2(Transcend)
5
5060200782X00
Note: Due to different module with different height, please choose an appropriate thermal pad.
THERMAL PAD T-GLOBAL 60x20x3.0mm FOR TOP M.2(Apacer/InnoDisk)
6
5060200720X00
Note: Due to different module with different height, please choose an appropriate thermal pad.
7
5060200783X00
THERMAL PAD T-GLOBAL 30x30x2.5mm FOR WIFI/LTE MODULE
Copyright © 2023 NEXCOM International Co., Ltd. All Rights Reserved.
xiii
Qty
1
1
1
1
1
1
2
NDiS B338-LITE User Manual

Advertisement

Table of Contents
loading

Table of Contents