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3.2
PCB Layout
Figure 3
shows the component placement on the top overlay of the test board. The two-layer EVM PCB
measures 2.4-in × 4.2-in and is fabricated with a 1-oz copper pour. The bottom layer has no components
but contains a solid copper ground plane that provides a low-impedance path for return currents.
The top layer of the PCB consists of power planes tied to the IS+ and IS– pins. The INA253 is rated to
support a 15-A continuous current over temperature. Enhance the current handling capability by using
proper layout techniques that facilitate heat dissipation. Combine the large power planes at the IS+ and
IS– pins. Use a 2-oz copper pour to improve the heat-dissipation capabilities, and thus increase the
continuous-load current capacity.
Using the INA253EVM board with this robust layout and airflow, the INA253 device safely accommodates
up to 15 A of current over the entire –40°C to +85°C temperature range.
top and bottom layers, respectively, of the test board.
SBOU194 – May 2018
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Figure 3. PCB Top Overlay
Copyright © 2018, Texas Instruments Incorporated
Schematic, PCB Layout, and Bill of Materials
Figure 4
and
Figure 5
INA253EVM
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