1.
CPU and PCH
2.
memory socket
3.
2x Ethernet PHY
4.
optional NVME
5.
3-pin fan connector
3.3.4 Back Side
Figure 3: COMh-caRP Back Side
1.
COM-HPC® Connector J1
2.
COM-HPC® Connector J2
3.
DDR5 SO-DIMM memory socket
4.
Programming connector for embedded controller
3.3.5 Processor (CPU)
The 13th Gen Intel® Core™ mobile processors combine power efficiency, performance, flexibility, and
industrial-grade features to drive success for demanding AI, graphics, and rugged edge use cases.
This new generation offers a performance hybrid architecture with up to 14 cores and flexible
processor base power from 15W to 45W.
13th Gen Intel Core mobile processors also offer enhanced Intel® Iris® X
efficient parallel AI processing and immersive visual experiences. And with industrial-grade features
and ruggedized SKUs, this lineup will enable advanced intelligence and real-time performance in the
most-challenging environments.
Key features are:
www.kontron.com
COMh-caRP User Guide
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Graphics for fast, power-
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