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Figure 3. ID label on the front of the compute node
Specifications
The following information is a summary of the features and specifications of the solution. Depending on the
model, some features might not be available, or some specifications might not apply.
Enclosure specifications
Features and specifications of the enclosure.
Table 2. Enclosure specifications
Specification
PCI expansion slots
(depending on the enclosure
model)
Hot-swap fans
Power supply (depending on
the model)
System Management Module
(SMM)
Description
• PCIe 3.0 x8 shuttle:
– Supports up to eight low-profile PCIe 3.0 x8 adapters
One node supports up to two low-profile PCIe 3.0 x8 adapters from processor
1
• PCIe 3.0 x16 shuttle:
– Supports up to four low-profile PCIe 3.0 x16 adapters
One node supports one low-profile PCIe 3.0 x16 adapters from processor 1
Notes:
1. PCIe 3.0 x16 shuttle supports PCIe cassettes that can be installed and
removed without removing the shuttle from the enclosure.
2. Ensure to power off the node before unseating the PCIe cassette from the
shuttle.
• Three 60x60x56mm fans
• Two 80x80x80mm fans
Note: Access these fans from the top of the enclosure (see
thinksystem.lenovofiles.com/help/topic/7X21/remove_the_fan_cover.html
Supports up to two hot-swap power supplies for redundancy support. (Except for the
application of 240V DC applied through C14 input connect)
• 1100-watt ac power supply
• 1600-watt ac power supply
• 2000-watt ac power supply
Important: Power supplies and redundant power supplies in the enclosure must be
with the same power rating, wattage or level.
• Hot-swappable
• Equipped with ASPEED controller
• Offers RJ45 port for management of nodes and SMM over 1G Ethernet
http://
).
.
5
Chapter 1
Introduction
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