Emi/Esd Protection - Renesas RZ/A Series Manuallines

High-speed usb2.0 board design
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RZ/A1

7. EMI/ESD Protection

Notes on EMI/ESD protection are described below.
• When components for EMI/ESD protection such as coils and diodes are mounted on the USB
transmission lines, they should be allocated near the USB transmission lines and the wiring should be as
short as possible.
• The components for the EMI/ESD protection must be USB 2.0 High-Speed compliant. Also, by mounting
EMI/ESD protection components, an inconsistent impedance may occur on the USB transmission lines,
and the waveform may become distorted. Components for use should be selected after thorough
evaluation.
Figure 7.1 shows an example of connection when the components for EMI/ESD protection are used.
RZ/A1
When components for EMI/ESD protection are used, they should be
allocated near the USB transmission lines and the wiring to the component
installation pattern should be as short as possible.
Note: n = 0 or 1
Figure 7.1
Connection example when components for EMI/ESD protection are used
R01AN5119EJ0120 Rev.1.20
May.26.20
Guidelines for High-Speed USB2.0 Board Design
EMI protection coil ESD Protection diode
DPn
DMn
USB connector
D+
D-
Digital ground
(DGND)
Page 13 of 17

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