Unpacking; Preparing The Environment; Installing The Ni Flexrio Fpga Module - National Instruments NI-6587 Getting Started Manual

Unpacking

The NI 6587 modules ship in antistatic packages to prevent electrostatic discharge from
damaging module components. To prevent such damage when handling the modules, ground
yourself using a grounding strap or by holding a grounded object, such as your computer
chassis, and complete the following steps:
1. Touch the antistatic package to a metal part of the computer chassis before removing the
module from the package.
Caution
2. Remove each module from the package and inspect it for loose components or any other
sign of damage.
Notify NI if the modules appear damaged in any way. Do not install a damaged module into
the chassis.

Preparing the Environment

Ensure that the environment you are using the NI 6587 in meets the following specifications.
............................................................................ Operating temperature
(IEC 60068-2-1, IEC 60068-2-2)
............................................................................ Operating humidity
(IEC 60068-2-56)
............................................................................ Pollution Degree
Maximum altitude ............................................................................
Indoor use only.
Refer to the NI 6587 Specifications at
Note
specifications.

Installing the NI FlexRIO FPGA Module

You must install the software before you install the hardware.
Note
1. Power off and unplug the PXI Express chassis. Refer to your chassis manual to install or
configure the chassis.
2. Identify a supported PXI Express slot in the chassis. The figure below shows the symbols
that indicate the slot types in a PXI Express chassis.
Never touch the exposed pins of connectors.
0 °C to 55 °C
10% to 90% RH, noncondensing
2
2,000 m at 25 °C ambient temperature
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