Manual Revision Information; Thermal Solutions - JETWAY For Socket 370 User Manual

Reversion Revision History
3.0 Third Edition
Item Checklist

630CF/630CN

Cable for IDE/Floppy

CD for motherboard utilities
□ Cable for USB Port 3/4 (Option)

Cable for COM2

630CF/630CN User's Manual

Intel Processor Family

Thermal Solutions

As processor technology pushes to faster speeds and higher performance, thermal
management becomes increasingly crucial when building computer systems. Maintaining
the proper thermal environment is key to reliable, long-term system operation. The
overall goal in providing the proper thermal environment is keeping the processor
below its specified maximum case temperature. Heatsinks induce improved processor
heat dissipation through increased surface area and concentrated airflow from attached
fans. In addition, interface materials allow effective transfers of heat from the
processor to the heatsink. For optimum heat transfer, Intel recommends the use of
thermal grease and mounting clips to attach the heatsink to the processor.
When selecting a thermal solution for your system, please refer to the website below
for collection of heatsinks evaluated and recommended by Intel for use with Intel
processors.
Vendor list for heatsink and fan of Pentium® !!! processor, please visit：
http://developer.intel.com/design/Pentiumiii/components/index.htm
Vendor list for heatsink and fan of Intel®Celeron™ processor, please visit：
http://developer.intel.com/design/celeron/components/index.htm
Date
Jan 2001
Chapter 1
2