DFI TGU968 User Manual

Com express compact module
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TGU968
COM Express Compact Module
User's Manual
©May 10, 2023 DFI Inc.

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Summary of Contents for DFI TGU968

  • Page 1 TGU968 COM Express Compact Module User’s Manual ©May 10, 2023 DFI Inc.
  • Page 2 COM Express Specification Reference • Shielded interface cables must be used in order to comply with the emission limits. PICMG® COM Express® Module Base Specification. http://www.picmg.org/ User's Manual | TGU968...
  • Page 3: Table Of Contents

    Board Layout ......................... 9 Block Diagram ........................9 Connector ..........................10 COM Express Connector ....................10 COM Express Connector ....................11 COM Express Connector Signal Description ..............15 Cooling Option ........................23 Heat Sink ........................23 Installing the COM Express Debug Card ................24 COMe-DEBUG .........................25 User's Manual | TGU968...
  • Page 4 • To reduce the risk of electric shock, unplug the power cord before removing the sys- tem chassis cover for installation or servicing. After installation or servicing, cover the system chassis before plugging the power cord. User's Manual | TGU968...
  • Page 5 • Storage devices such as hard disk drive, etc. You will also need external system peripherals you intend to use which will normally include at least a keyboard, a mouse and a video display monitor. User's Manual | TGU968...
  • Page 6: Chapter 1 - Introduction

    4 x USB 3.2 Gen.2 8 x USB 2.0 SATA 2 x SATA 3.0 (up to 6Gb/s), co-lay PCIe x1 (available upon request) NVMe SSD 1 x 64GB/128GB/256GB/512GB/1024GB on board SSD (available upon request) 1 x 8-bit DIO User's Manual | TGU968...
  • Page 7 513,984 hrs @ 60°C; 398,344 hrs @ 70°C; 266,028 hrs @ 85°C MECHANICAL Dimensions COM Express® Compact 95mm (3.74") x 95mm (3.74") Compliance PICMG COM Express® R3.0, Type 6 STANDARDS AND CER- Certification CE, FCC TIFICATIONS User's Manual | TGU968...
  • Page 8: Chapter 2 - Concept

    Chapter 2 - Concept X COM Express Module Standards The figure below shows the dimensions of the different types of COM Express modules. TGU968 is a COM Express Compact. The dimension is 95mm x 95mm. Common for all Form Factors Extended only...
  • Page 9: Chapter 3 - Hardware Installation

    (optional) I225LM PCIe x1 (option) PCIe x1 (5x1) PCIe x1 USB 2.0 8x SATA 3.0 2x (optional) SPI Bus PCIe x1 SPI Flash (optional) 8bit DIO D110 COM Express Connector C110 B110 COM Express Connector A110 User's Manual | TGU968...
  • Page 10: Connector

    X Connector COM Express Connector The COM Express connector is used to interface the TGU968 COM Express board to a carrier board. Connect the COM Express connector (located on the solder side of the board) to the COM Express connector on the carrier board.
  • Page 11: Com Express Connector

    SATA2_TX+ (NA) SATA3_TX+ (NA) LPC_SERIRQ CB_RESET# SATA2_TX- (NA) SATA3_TX- (NA) GND (FIXED) GND (FIXED) SUS_S5# PWR_OK PCIE_TX5+ PCIE_TX5+ (Optional) (Optional) SATA2_RX+ (NA) SATA3_RX+ (NA) PCIE_TX5- PCIE_TX5- (Optional) (Optional) SATA2_RX- (NA) SATA3_RX- (NA) GPI0 GPO1 BATLOW# PCIE_TX4+ PCIE_RX4+ User's Manual | TGU968...
  • Page 12 VCC_8.5V~ 20V LVDS_A3- LVDS_BKLT_EN /eDP_BKLT_EN A107 VCC_8.5V~ 20V B107 VCC_8.5V~ 20V GND (FIXED) GND (FIXED) A108 VCC_8.5V~ 20V B108 VCC_8.5V~ 20V LVDS_A_CK+/eDP_TX3+ LVDS_B_CK+ A109 VCC_8.5V~ 20V B109 VCC_8.5V~ 20V LVDS_A_CK-/eDP_TX3- LVDS_B_CK- A110 B110 GND (FIXED) GND (FIXED) User's Manual | TGU968...
  • Page 13 DDI3_PAIR3- DDI2_PAIR3- PCIE_RX7- (Optional) PCIE_TX7- (Optional) GND (FIXED) GND (FIXED) DDI1_HPD RSVD PEG_RX0+ (Optional) PEG_TX0+ (Optional) DDI1_PAIR4+ (NA) RSVD PEG_RX0- (Optional) PEG_TX0- (Optional) DDI1_PAIR4- (NA) DDI1_PAIR0+ TYPE0# (NC) PEG_LANE_RV# (Optional) RSVD DDI1_PAIR0- PEG_RX1+ (Optional) PEG_TX1+ (Optional) User's Manual | TGU968...
  • Page 14 C107 VCC_8.5V~ 20V D107 VCC_8.5V~ 20V GND (FIXED) GND (FIXED) C108 VCC_8.5V~ 20V D108 VCC_8.5V~ 20V PEG_RX9+ (NA) PEG_TX9+ (NA) C109 VCC_8.5V~ 20V D109 VCC_8.5V~ 20V PEG_RX9- (NA) PEG_TX9- (NA) C110 D110 GND (FIXED) GND (FIXED) User's Manual | TGU968...
  • Page 15: Com Express Connector Signal Description

    PCI Express differential receive pairs 3 (This Port is BOM Option with On board LAN) PCIE_RX3- Slot - Connect to PCIE Conn pin PCIE_TX4+ AC Coupling capacitor O PCIE AC coupled on Module Connect to PCIE device or slot PCI Express differential transmit pairs 4 PCIE_TX4- AC Coupling capacitor User's Manual | TGU968...
  • Page 16 PCI Express Graphics receive differential pairs 11 PEG_RX11- PEG_TX12+ O PCIE AC coupled on Module PCI Express Graphics transmit differential pairs 12 PEG_TX12- PEG_RX12+ I PCIE AC coupled off Module PCI Express Graphics receive differential pairs 12 PEG_RX12- User's Manual | TGU968...
  • Page 17 DDI2_PAIR2- Connect AC Coupling Capacitors 0.1uF to Device DDI2_PAIR3+ DDI 2 Pair 3 differential pairs/Serial Digital Video B clock output differential pair O PCIE AC coupled off Module Connect AC Coupling Capacitors 0.1uF to Device DDI2_PAIR3- User's Manual | TGU968...
  • Page 18 Connect 90Ω @100MHz Common Choke in series and ESD suppressors to GND to USB USB differential pairs 7, USB7 may be configured as a USB client or as a host, or both, at the I/O USB 3.3V Suspend/3.3V USB7- connector Module designer's discretion.(CR901-B default set as a host) User's Manual | TGU968...
  • Page 19 Connect to DDC clock of LVDS panel I2C clock output for LVDS display use LVDS_I2C_DAT I/O OD CMOS 3.3V / 3.3V PU 2.2K to 3.3V Connect to DDC data of LVDS panel I2C data line for LVDS display use User's Manual | TGU968...
  • Page 20 SPI CS0# SPI_CS# Descriptor Entry Destination Destination I CMOS Module Module High Module SPI0/SPI1 Module Module High Module Carrier FWH BIOS_DIS1# Module Carrier SPI0 Carrier SPI0/SPI1 Carrier Module SPI1 Module SPI0/SPI1 (Default) (Default) (Default) (Default) (Default) User's Manual | TGU968...
  • Page 21 System Management Bus bidirectional data line. System Management Bus Alert – active low input can be used to SMB_ALERT# I CMOS 3.3V Suspend/3.3V PU 2.2K to 3V3_DU_EC generate an SMI# (System Management Interrupt) or to wake the system. User's Manual | TGU968...
  • Page 22 Trusted Platform Module (TPM) Physical Presence pin. Active high. TPM chip has an TPM_PP I CMOS 3.3V / 3.3V Default NA, PD 4.7K when stuff TPM chip internal pull down. This signal is used to indicate Physical Presence to the TPM. User's Manual | TGU968...
  • Page 23: Cooling Option

    The carrier board (COM332-B) used in this section is for reference purpose only The COM Express connector is used to interface the TGU968 COM Express board to a carrier and may not resemble your carrier board. These illustrations are mainly to guide board.
  • Page 24: Installing The Com Express Debug Card

    These illustrations are for reference only. 1. COMe-LINK2 is the COM Express debug platform installed into COM Express Mini modules for the application of debugging and displaying signals and codes. COM Express Connector COM Express Connector User's Manual | TGU968...
  • Page 25: Come-Debug

    COM Express Type Display Signal Display COM Express Power/Reset/ Power Display Bolts Sleep/LID control 4. Use the provided bolts to fix the COMe-LINK2 debug card onto the carrier board. Cable COMe-DEBUG COMe-LINK2 Bolts COMe-LINK2 Carrier Board COMe-DEBUG User's Manual | TGU968...
  • Page 26 6. Then, grasp the heat sink by its edges and position it down firmly on the top of the COM Express Mini module. Cable Carrier Board COM Express Mini Module COMe-LINK2 Side View of the Module, Debug Card and Carrier Board COMe-DEBUG User's Manual | TGU968...

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